Patents by Inventor KENTO OHGA

KENTO OHGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125561
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Applicant: FUJITSU LIMITED
    Inventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
  • Patent number: 11892246
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: February 6, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
  • Publication number: 20220322564
    Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.
    Type: Application
    Filed: January 4, 2022
    Publication date: October 6, 2022
    Applicant: FUJITSU LIMITED
    Inventors: Hideo KUBO, Kenji SASABE, Shinnosuke FUJIWARA, Nobumitsu AOKI, Keita HIRAI, Atsushi ENDO, Masahide KODAMA, Kento OHGA
  • Publication number: 20220307772
    Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.
    Type: Application
    Filed: December 2, 2021
    Publication date: September 29, 2022
    Applicant: FUJITSU LIMITED
    Inventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
  • Publication number: 20220299273
    Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.
    Type: Application
    Filed: January 4, 2022
    Publication date: September 22, 2022
    Applicant: FUJITSU LIMITED
    Inventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
  • Patent number: 11071232
    Abstract: A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: July 20, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Kento Ohga, Keita Hirai
  • Publication number: 20200253086
    Abstract: A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.
    Type: Application
    Filed: January 2, 2020
    Publication date: August 6, 2020
    Applicant: FUJITSU LIMITED
    Inventors: KENTO OHGA, Keita Hirai