Abstract: A method for manufacturing a terminal-equipped electric wire includes a step of crimping a first terminal to one end of an electric wire, a step of crimping a second terminal to the other end of the electric wire with a tubular seal member, a first waterproofing step of providing, at the one end of the electric wire, an anticorrosion member that covers an element wire bundle of the electric wire, and a second waterproofing step of providing, at the other end of the electric wire, a sealing member so as to fill gaps between conductive element wires of the element wire bundle in a tubular insulating sheath. The second waterproofing step is performed after the first waterproofing step is performed.

Abstract: A vehicle including: a battery; a voltage control unit that boosts an output voltage of the battery; a main drive unit, including a main drive motor driven by electric power with a boosted voltage, that outputs a main driving force for driving one of a front wheel and a rear wheel; a sub drive unit, including a sub drive motor driven by the electric power with the boosted voltage, that outputs a sub driving force for driving another of the front wheel and the rear wheel; and a control unit, in which the control unit increases the boosted voltage when a temperature of the sub drive unit reaches a predetermined value, compared to before the temperature of the sub drive unit reaches the predetermined value.

Abstract: Provided is a work processing apparatus configured so that limitations on the contents of processing for a work piece or the type of work piece can be reduced and processing for a wider range of processing contents and work piece can be performed. In a work processing apparatus 100, a work table 101 is, through a table displacement mechanism 103, supported on a rotation base 120 to be rotatably driven by a table rotary drive motor 125, and a weight holding tool 110 is supported on the rotation base 120 through a weight displacement mechanism 114. The table displacement mechanism 103 includes a rack-and-pinion mechanism configured to displace the work table 101 in an X-axis direction as viewed in the figure. At the table displacement mechanism 103, a power inputter 108 configured to input drive force from a table displacement mechanism drive apparatus 130 is provided.

Abstract: A method for manufacturing a terminal-equipped electric wire includes a step of crimping a terminal to one end of an electric wire, a step of crimping another terminal to the other end of the electric wire, and a waterproofing step of providing a sealing member at the other end of the electric wire so as to fill gaps between conductive element wires of an element wire bundle. The waterproofing step includes, in this order, a step of applying a resin to the element wire bundle to block at least a part of an inner portion of a tubular insulating sheath, a step of waiting during curing of the resin or until the curing is completed, and a step of applying the moisture curable resin to the element wire bundle, blocking a remaining portion of the inner portion of the insulating sheath, and curing the resin.

Abstract: A method for manufacturing a terminal-equipped electric wire includes a step of crimping a first terminal to one end of an electric wire, a step of crimping a second terminal to the other end of the electric wire with a tubular seal member, a first waterproofing step of providing, at the one end of the electric wire, an anticorrosion member that covers an element wire bundle of the electric wire, and a second waterproofing step of providing, at the other end of the electric wire, a sealing member so as to fill gaps between conductive element wires of the element wire bundle in a tubular insulating sheath. The second waterproofing step is performed after the first waterproofing step is performed.

Abstract: A method for manufacturing a terminal-equipped electric wire includes a step of crimping a first terminal to one end of an electric wire, a step of crimping a second terminal to the other end of the electric wire with a tubular seal member, a first waterproofing step of providing, at the one end of the electric wire, an anticorrosion member that covers an element wire bundle of the electric wire, and a second waterproofing step of providing, at the other end of the electric wire, a sealing member so as to fill gaps between conductive element wires of the element wire bundle in a tubular insulating sheath. The second waterproofing step includes a step of applying a moisture curable resin to the element wire bundle, and a step of applying a curing accelerator that accelerates curing of the moisture curable resin to the element wire bundle.

Abstract: A deterioration regeneration system includes a pre-post regeneration determination part configured to determine whether or not to execute, with respect to an electric contact to which an electrical or mechanical first external action is applied during an operation of a later-stage device, a deterioration regeneration process of regenerating a connection performance that has been deteriorated due to an increase in a contact resistance of the electric contact, and a deterioration regeneration part configured to execute a process of removing a foreign object present at the electric contact by applying a second external action to the electric contact, as the deterioration regeneration process, according to the determined result from the pre-post regeneration determination part, the second external action being of the same kind as the first external action and larger than the first external action.

Abstract: Provided is a work processing apparatus configured so that limitations on the contents of processing for a work piece or the type of work piece can be reduced and processing for a wider range of processing contents and work piece can be performed. In a work processing apparatus 100, a work table 101 is, through a table displacement mechanism 103, supported on a rotation base 120 to be rotatably driven by a table rotary drive motor 125, and a weight holding tool 110 is supported on the rotation base 120 through a weight displacement mechanism 114. The table displacement mechanism 103 includes a rack-and-pinion mechanism configured to displace the work table 101 in an X-axis direction as viewed in the figure. At the table displacement mechanism 103, a power inputter 108 configured to input drive force from a table displacement mechanism drive apparatus 130 is provided.

Abstract: A deterioration regeneration system includes a pre-post regeneration determination part configured to determine whether or not to execute, with respect to an electric contact to which an electrical or mechanical first external action is applied during an operation of a later-stage device, a deterioration regeneration process of regenerating a connection performance that has been deteriorated due to an increase in a contact resistance of the electric contact, and a deterioration regeneration part configured to execute a process of removing a foreign object present at the electric contact by applying a second external action to the electric contact, as the deterioration regeneration process, according to the determined result from the pre-post regeneration determination part, the second external action being of the same kind as the first external action and larger than the first external action.

Abstract: A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a plating layer formed on a surface of the first contact portion; and a second contact portion including a plating layer formed on a surface of the second contact portion. The indent portion of the first contact portion is slidable on a contact surface of the second contact portion. The indent portion of the first contact portion at a terminal insertion completed position is in contact with the second contact portion. The contact surface of the second contact portion includes an oxide-film shaving portion having an annular arc portion curved along a circumference portion of the indent portion.

Abstract: A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a plating layer formed on a surface of the first contact portion; and a second contact portion including a plating layer formed on a surface of the second contact portion. The indent portion of the first contact portion is slidable on a contact surface of the second contact portion. The indent portion of the first contact portion at a terminal insertion completed position is in contact with the second contact portion. The contact surface of the second contact portion includes an oxide-film shaving portion having an annular arc portion curved along a circumference portion of the indent portion.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Abstract: An industrially suitable process for preparing V-28-3M useful as an antimycotic agent by conducting methyl esterification of V-28-3 efficiently. V-28-2 is efficiently converted into V-28-3M by protecting the amino group of the amino sugar of V-28-3 with an appropriate protecting group, subjecting the carboxyl group of V-28-3 to methyl esterification with methyl methanesulfonate or methyl p-toluenesulfonate in the presence of a base, and deprotecting the N-protected intermediate.