Patents by Inventor Kerstin Neveling
Kerstin Neveling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955588Abstract: In one embodiment, the optoelectronic semiconductor device comprises a semiconductor layer sequence and an electrical via. The semiconductor layer sequence includes an active zone for generating radiation and a contact layer for electrical contacting. The active zone lies in a plane perpendicular to a main growth direction of the semiconductor layer sequence and is located between a first semiconductor region and a second semiconductor region. The contact layer is located within the second semiconductor region. The via extends through the contact layer and preferably ends within the second semiconductor region. A contact surface between the via and the contact layer encloses a contact angle of at least 20° and at most 60° with respect to the plane.Type: GrantFiled: November 18, 2019Date of Patent: April 9, 2024Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Korbinian Perzlmaier, Kerstin Neveling, Heribert Zull
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Patent number: 11855245Abstract: An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.Type: GrantFiled: September 12, 2019Date of Patent: December 26, 2023Assignee: Osram OLED GmbHInventors: Korbinian Perzlmaier, Alexander F. Pfeuffer, Kerstin Neveling
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Publication number: 20220393058Abstract: In an embodiment, an optoelectronic semiconductor component includes a semiconductor layer sequence with a doped first layer, a doped second layer, an active zone configured to generate radiation by electroluminescence between the first layer and the second layer, and a side surface extending transversely to the active zone and delimiting the semiconductor layer sequence in a lateral direction, two electrodes for electrical contact between the first and second layers and a cover layer located on the side surface in a region of the first layer, wherein the cover layer is in direct contact with the first layer, wherein a material of the cover layer alone and its direct contact with the first layer are configured to cause a formation of a depletion zone in the first layer, wherein the depletion zone comprises a lower concentration of majority charge carriers compared to a rest of the first layer, wherein the cover layer comprises a metal or a metal compound, and wherein the cover layer forms a Schottky contact wType: ApplicationFiled: November 3, 2020Publication date: December 8, 2022Inventors: Michael Binder, Andreas Rückerl, Roland Zeisel, Tobias Meyer, Kerstin Neveling, Christine Rafael, Moses Richter, Rainer Hartmann, Clemens Vierheilig
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Publication number: 20220393059Abstract: In an embodiment a component composite includes an auxiliary carrier, a plurality of components, a retaining structure and an electrically conductive sacrificial layer, wherein each of the components has a connection layer which faces the sacrificial layer and is electrically conductively connected to the sacrificial layer, wherein the sacrificial layer is arranged in vertical direction between the auxiliary carrier and the components, and wherein the sacrificial layer is to be removable and the components are mechanically connected to the auxiliary carrier only via the retaining structure in addition to the sacrificial layer.Type: ApplicationFiled: October 6, 2020Publication date: December 8, 2022Inventors: Korbinian Perzlmaier, Peter Stauß, Alexander F. Pfeuffer, Christoph Klemp, Kerstin Neveling, Andreas Biebersdorf
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Publication number: 20220375991Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: July 28, 2022Publication date: November 24, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Toblas MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220285430Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 29, 2022Publication date: September 8, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220271084Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 29, 2022Publication date: August 25, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220271085Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 30, 2022Publication date: August 25, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220262850Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 29, 2022Publication date: August 18, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220262852Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 30, 2022Publication date: August 18, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220262851Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: April 30, 2022Publication date: August 18, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220223756Abstract: A support structure for receiving planar microchips, comprising a planar support substrate and at least two receiving elements. The receiving elements are connected to the carrier substrate and configured in such a way that they detachably hold a flat microchip between the at least two receiving elements in such a way that the microchip can be moved out with a defined minimum force transversely to a support structure plane.Type: ApplicationFiled: March 10, 2020Publication date: July 14, 2022Inventors: Alexander PFEUFFER, Korbinian PERZLMAIER, Kerstin NEVELING
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Publication number: 20220173157Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: October 29, 2021Publication date: June 2, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220123046Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: October 29, 2021Publication date: April 21, 2022Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Publication number: 20220123189Abstract: An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.Type: ApplicationFiled: September 12, 2019Publication date: April 21, 2022Inventors: Korbinian PERZLMAIER, Alexander F. PFEUFFER, Kerstin NEVELING
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Publication number: 20220102583Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: January 29, 2020Publication date: March 31, 2022Inventors: Thorsten BAUMHEINRICH, Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Michael BRANDL, Peter BRICK, Jean-Jacques DROLET, Hubert HALBRITTER, Laura KREINER, Erwin LANG, Andreas LEBER, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Jens RICHTER, Thomas SCHWARZ, Paul TA, Tansen VARGHESE, Xue WANG, Sebastian WITTMANN, Julia STOLZ, Karsten DIEKMANN, Karl ENGL, Siegfried HERRMANN, Berthold HAHN, Stefan ILLEK, Bruno JENTZSCH, Korbinian PERZLMAIER, Ines PIETZONKA, Andreas RAUSCH, Kilian REGAU, Tilman RUEGHEIMER, Simon SCHWALENBERG, Christopher SOELL, Peter STAUSS, Petrus SUNDGREN, Hoa VU, Christopher WIESMANN, Georg BOGNER, Patrick HOERNER, Christoph KLEMP, Jens MUELLER, Kerstin NEVELING, Jong PARK, Christine RAFAEL, Frank SINGER, Kanishk CHAND, Felix FEIX, Christian MUELLER, Eva-Maria RUMMEL, Nicole HEITZER, Marie ASSMANN, Christian BERGER, Ana KANEVCE
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Publication number: 20220069183Abstract: In one embodiment, the optoelectronic semiconductor device comprises a semiconductor layer sequence and an electrical via. The semiconductor layer sequence includes an active zone for generating radiation and a contact layer for electrical contacting. The active zone lies in a plane perpendicular to a main growth direction of the semiconductor layer sequence and is located between a first semiconductor region and a second semiconductor region. The contact layer is located within the second semiconductor region. The via extends through the contact layer and preferably ends within the second semiconductor region. A contact surface between the via and the contact layer encloses a contact angle of at least 20° and at most 60° with respect to the plane.Type: ApplicationFiled: November 18, 2019Publication date: March 3, 2022Inventors: Korbinian Perzlmaier, Kerstin Neveling, Heribert Zull
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Publication number: 20210104574Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: ApplicationFiled: September 30, 2020Publication date: April 8, 2021Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
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Patent number: 8710512Abstract: An optoelectronic semiconductor chip, comprising a first contact location (1) and a second contact location (2), and a reflective layer (3), which is directly electrically conductively connected to the second contact location. The reflective layer contains a metal that tends toward migration, and the reflective layer is arranged in such a way that a migration path (4) for the metal can form between the second and the first contact location. A means (6) which, during operation of the semiconductor chip, forms an electric field that counteracts the migration of the metal is provided at the semiconductor chip.Type: GrantFiled: April 24, 2009Date of Patent: April 29, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Tony Albrecht, Andreas Weimar, Anna Kasprzak-Zablocka, Christian Eichinger, Kerstin Neveling
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Publication number: 20110079810Abstract: An optoelectronic semiconductor chip is specified, comprising a first contact location (1) and a second contact location (2), and a reflective layer (3), which is directly electrically conductively connected to the second contact location. The reflective layer contains a metal that tends toward migration, and the reflective layer is arranged in such a way that a migration path (4) for the metal can form between the second and the first contact location. A means (6) which, during operation of the semiconductor chip, forms an electric field that counteracts the migration of the metal is provided at the semiconductor chip.Type: ApplicationFiled: April 24, 2009Publication date: April 7, 2011Applicant: OSRAM Opto Semiconductors GmbHInventors: Tony Albrecht, Andreas Weimar, Anna Kasprzak-Zablocka, Christian Eichinger, Kerstin Neveling