Abstract: An electronic device comprises a housing, a motion sensor configured to sense motion of the housing, and a processor configured to determine an impact geometry based on the motion. A countermeasure system comprises an actuator coupled to an actuated member. The actuated member is operable by the actuator to modify the impact geometry, so that impact energy is redirected away from an impact sensitive component of the electronic device to an energy absorbing component of the electronic device.

Abstract: An electronic device contains electrical circuits. The circuits may include circuitry on printed circuit boards and components such as a touch screen display and buttons. Signal paths for routing signals between the electrical circuits may be formed from metal traces on flexible printed circuit cables. The flexible printed circuit cables may be bent around one or more bend axes. A flexible printed circuit cable may be formed from a flexible polymer substrate having one or more layers of polymer. Upper and lower ground layers may be supported by the flexible polymer substrate. The metal traces for the signal paths may lie between the upper and lower ground layers. Longitudinal slits within the flexible printed circuit may be formed that pass through the ground layers and the polymer layers. Vias may be formed that couple the ground layers together. The vias may run along the edges of the slits.

Abstract: Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers and backlight components. A metal chassis may include a portion that partially surrounds the light source. Openings or perforations in the metal chassis may allow the portion that surrounds the light source to flex about a flex axis. A portion of a display layer may be mounted to a plastic chassis. The plastic chassis may be insert molded over a light source, may form part of a package for a light source, may be adhered to a light source, or may wrap around the light source. An encapsulant may be formed over the light source to protect the light source from vibrations and contaminants.

Abstract: Methods and tools for positioning cables using magnets during assembly of a consumer electronic product are described. Methods described are well suited in the manufacture of portable electronic devices such as mobile phones, computer tablets and the like. Methods involve attaching magnetic components to cables and to one or more surfaces within the enclosure of the electronic devices. During assembly, the magnetic components on the cables magnetically couple with corresponding magnetic components on the surfaces within the enclosure. In this way, the cables can be secured in certain positions and out of the way during the assembly of the electronic device. In some instances, the cables can remain magnetically secured after assembly and during the operation of the electronic device. In other instances, the magnetic components are decoupled after assembly thereby releasing the cables from their secured positions during operation of the electronic device.

Abstract: Structures and methods for providing a liquid adhesive between substrates of a composite structure are described. Methods include providing a liquid adhesive having a thread disposed therein between two substrates of a composite structure. In some embodiments, the thread has a fixed diameter which acts to provide a consistent gap between the two substrates. In some embodiments, the thread is configured to be activated during the assembly process to facilitate curing of the liquid adhesive. In some embodiments the thread is configured to be activated after the composite structure is formed to facilitate separation of the two substrates and disassembly of the composite structure. The thread can be made of a conductive or non-conductive material. In some embodiments, the thread is activated by passing a voltage through the thread to heat the thread. In some embodiments, the thread is activated by passing ultraviolet light through the thread.

Abstract: An electronic device may have polarizer layers, color filter layers, thin-film-transistor layers, and other display layers. A display layer may be separated from structures such as a display cover layer formed from clear glass or plastic and a touch sensor layer mounted on an inner surface of the display cover layer by an air gap. Cavities within an electronic device housing may serve as a source of dust and other contaminants. The air gap may be sealed against dust intrusion from a cavity within an electronic device using a dust sealing structure. The dust sealing structure may have a rectangular ring shape that runs around a rectangular peripheral portion of a display layer. The dust sealing structure may be formed from a tape-based structure, an elastomeric structure, a compressible foam structure, or a cured liquid structure.

Abstract: An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.

Abstract: Electronic devices may include displays. A display may include backlight components such as a light guide plate that distributes light from a light source across the display. The light source may include a plurality of light-emitting diodes mounted on a printed circuit substrate. A portion of the light guide plate may be attached to the printed circuit substrate using adhesive. The adhesive may be a supported adhesive that includes a lining of reflective material. A reflective coating such as a layer of white coverlay may be formed on the surface of the printed circuit substrate and may be configured to reflect light into the light guide plate. The reflective coating may serve as a solder mask. The printed circuit substrate may be attached to a metal display chassis using adhesive. A shim may be used to raise the height of the light source relative to the printed circuit substrate.

Abstract: Electronic devices may include displays having backlight structures and display layers. The display layers may include alignment features. The backlight structure may include alignment features. The alignment features on the backlight structures may include transparent portions of the backlight structures. The alignment features on the display layers may include alignment marks that are visible through the transparent portions of the backlight structures. The transparent portions of the backlight structures may include openings that extend from a first surface of the backlight structures to an opposing second surface of the backlight structures. The openings may be filled by transparent members formed from plastic or glass. The transparent members may include additional alignment marks. The transparent members may include lensing portions that magnify the alignment marks on the display layers when viewed through the lensing portions.

Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.

Abstract: An electronic device contains electrical circuits. The circuits may include circuitry on printed circuit boards and components such as a touch screen display and buttons. Signal paths for routing signals between the electrical circuits may be formed from metal traces on flexible printed circuit cables. The flexible printed circuit cables may be bent around one or more bend axes. A flexible printed circuit cable may be formed from a flexible polymer substrate having one or more layers of polymer. Upper and lower ground layers may be supported by the flexible polymer substrate. The metal traces for the signal paths may lie between the upper and lower ground layers. Longitudinal slits within the flexible printed circuit may be formed that pass through the ground layers and the polymer layers. Vias may be formed that couple the ground layers together. The vias may run along the edges of the slits.

Abstract: Structures and methods for providing a liquid adhesive between substrates of a composite structure are described. Methods include providing a liquid adhesive having a thread disposed therein between two substrates of a composite structure. In some embodiments, the thread has a fixed diameter which acts to provide a consistent gap between the two substrates. In some embodiments, the thread is configured to be activated during the assembly process to facilitate curing of the liquid adhesive. In some embodiments the thread is configured to be activated after the composite structure is formed to facilitate separation of the two substrates and disassembly of the composite structure. The thread can be made of a conductive or non-conductive material. In some embodiments, the thread is activated by passing a voltage through the thread to heat the thread. In some embodiments, the thread is activated by passing ultraviolet light through the thread.

Abstract: An electronic device comprises a housing, a motion sensor configured to sense motion of the housing, and a processor configured to determine an impact geometry based on the motion. A countermeasure system comprises an actuator coupled to an actuated member. The actuated member is operable by the actuator to modify the impact geometry, so that impact energy is redirected away from an impact sensitive component of the electronic device to an energy absorbing component of the electronic device.

Abstract: An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.

Abstract: Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. A plastic display chassis may be used to support display layers and backlight components. A light blocking material such as a layer of metal or opaque coating material may be formed on a surface of the plastic display chassis and may be used to reduce light leakage from the backlight components to the exterior of the electronic device. A metal barrier structure may be formed on a surface of the support structure and may be used to ground a conductive display layer to a conductive support structure such as a metal display chassis or a metal housing member. The plastic display chassis may be insert molded around a light barrier structure.

Abstract: Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers and backlight components. A metal chassis may include a portion that partially surrounds the light source. Openings or perforations in the metal chassis may allow the portion that surrounds the light source to flex about a flex axis. A portion of a display layer may be mounted to a plastic chassis. The plastic chassis may be insert molded over a light source, may form part of a package for a light source, may be adhered to a light source, or may wrap around the light source. An encapsulant may be formed over the light source to protect the light source from vibrations and contaminants.

Abstract: An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.

Abstract: Electronic devices may include displays. A display may include backlight components such as a light guide plate that distributes light from a light source across the display. The light source may include a plurality of light-emitting diodes mounted on a printed circuit substrate. A portion of the light guide plate may be attached to the printed circuit substrate using adhesive. The adhesive may be a supported adhesive that includes a lining of reflective material. A reflective coating such as a layer of white coverlay may be formed on the surface of the printed circuit substrate and may be configured to reflect light into the light guide plate. The reflective coating may serve as a solder mask. The printed circuit substrate may be attached to a metal display chassis using adhesive. A shim may be used to raise the height of the light source relative to the printed circuit substrate.

Abstract: Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface.

Abstract: Electronic devices may include displays having backlight structures that include optical films. The optical films may help guide light from the backlight structures to display layers that generate display images using the light. The optical films may be attached together at one or more locations. The optical films may be attached to a structural member of the backlight structures. The structural member may be formed along each edge of the optical films and prevent the optical films from sliding within the display. Each optical film may be designed to expand to a common lateral size when the display is operated at a display operating temperature. The optical films may each include an elongated opening such as a slot through which a pin can be placed to partially constrain the movement of the optical films while allowing the optical films to expand or contract under changing thermal conditions in the display.