Patents by Inventor Kevin D. Martin

Kevin D. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10350103
    Abstract: Orthopedic splinting materials and methods for stabilizing an injured limb or extremity of a human or animal are disclosed. The methods include applying a foam to the limb or extremity and allowing the foam to set to sufficient rigidity. A kit for stabilizing an injured limb or extremity includes a dispenser for a foamable composition. A spine board and method of making the spine board are disclosed. In situ preparation and application of a compression bandage are disclosed.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: July 16, 2019
    Assignee: The United States of America, as represented by the Secretary of the Army
    Inventor: Kevin D. Martin
  • Publication number: 20190159769
    Abstract: Various methods and devices are provided for allowing multiple surgical instruments to be inserted into sealing elements of a single surgical access device. The sealing elements can be movable along predefined pathways within the device to allow surgical instruments inserted through the sealing elements to be moved laterally, rotationally, angularly, and vertically relative to a central longitudinal axis of the device for ease of manipulation within a patient's body while maintaining insufflation.
    Type: Application
    Filed: December 7, 2018
    Publication date: May 30, 2019
    Applicant: Ethicon LLC
    Inventors: Mark S. Ortiz, David T. Martin, Matthew C. Miller, Mark J. Reese, Wells D. Haberstich, Carl Shurtleff, Charles J. Scheib, Frederick E. Shelton, IV, Jerome R. Morgan, Daniel H. Duke, Daniel J. Mumaw, Gregory W. Johnson, Kevin L. Houser
  • Publication number: 20160317343
    Abstract: Orthopedic splinting materials and methods for stabilizing an injured limb or extremity of a human or animal are disclosed. The methods include applying a foam to the limb or extremity and allowing the foam to set to sufficient rigidity. A kit for stabilizing an injured limb or extremity includes a dispenser for a foamable composition. A spine board and method of making the spine board are disclosed. In situ preparation and application of a compression bandage are disclosed.
    Type: Application
    Filed: May 31, 2016
    Publication date: November 3, 2016
    Applicant: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
    Inventor: Kevin D. Martin
  • Patent number: 9427489
    Abstract: Orthopedic splinting materials and methods for stabilizing an injured limb or extremity of a human or animal comprising applying a foam to the limb or extremity and allowing the foam set to sufficient rigidity, which can be in less than 60 seconds. The foam, such as a Spray Polyurethane Foam, can be sprayed directly on the skin without producing an amount of heat release that is painful or uncomfortable on the skin. Also provided is a kit for stabilizing an injured limb or extremity comprising a dispenser comprising the present foam. Further provided is situ preparation and application of a compression bandage on an injured patient in an emergency or combat situation comprising applying the present foam. A spine board and a method for making the same comprising applying the present foam to the patient's back, then contacting the foam with a board or flat surface before the foam sets.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: August 30, 2016
    Inventor: Kevin D. Martin
  • Publication number: 20130324897
    Abstract: Orthopedic splinting materials and methods for stabilizing an injured limb or extremity of a human or animal comprising applying a foam to the limb or extremity and allowing the foam set to sufficient rigidity, which can be in less than 60 seconds. The foam, such as a Spray Polyurethane Foam, can be sprayed directly on the skin without producing an amount of heat release that is painful or uncomfortable on the skin. Also provided is a kit for stabilizing an injured limb or extremity comprising a dispenser comprising the present foam. Further provided is situ preparation and application of a compression bandage on an injured patient in an emergency or combat situation comprising applying the present foam. A spine board and a method for making the same comprising applying the present foam to the patient's back, then contacting the foam with a board or flat surface before the foam sets.
    Type: Application
    Filed: November 18, 2010
    Publication date: December 5, 2013
    Applicant: USA, as Represented by the Secretary of the Army
    Inventor: Kevin D. Martin
  • Patent number: 7027898
    Abstract: An apparatus for providing weather information onboard an aircraft includes a processor unit and a graphical user interface. The processor unit processes weather information after it is received onboard the aircraft from a ground-based source, and the graphical user interface provides a graphical presentation of the weather information to a user onboard the aircraft. Preferably, the graphical user interface includes one or more user-selectable options for graphically displaying at least one of convection information, turbulence information, icing information, weather satellite information, SIGMET information, significant weather prognosis information, and winds aloft information.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: April 11, 2006
    Assignee: Honeywell International Inc.
    Inventors: Daniel R. Leger, David Burdon, Robert S. Son, Kevin D. Martin, John Harrison, Keith R. Hughes
  • Patent number: 5360992
    Abstract: The invention comprises a semiconductor package which allows pinouts and bond options to be customized after the encasement of a die in plastic, ceramic, or other suitable materials. A first embodiment of the invention has a first assembly comprising an encapsulated die having bond pads connected to bond wires which terminate in exterior pad portions on the exterior of the encapsulant. Conductive paths which are part of a second assembly electrically connect with the exterior pad portions of the first assembly and pass signals to device pinouts, which can be leads or other connecting means, to an electronic device into which the module is installed. By selectively connecting the exterior pad portions of the first assembly to the connection points of the conductive paths of the second assembly, the device pinouts and bond options can be selected. To manufacture a device having different pinouts or bond options, a bottom section having a different design is used.
    Type: Grant
    Filed: April 1, 1994
    Date of Patent: November 1, 1994
    Assignee: Micron Technology, Inc.
    Inventors: Tyler A. Lowrey, Alan R. Reinberg, Kevin D. Martin
  • Patent number: D495546
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: September 7, 2004
    Inventor: Kevin D. Martin
  • Patent number: D495911
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: September 14, 2004
    Inventor: Kevin D. Martin