Abstract: A chip-to-chip communication system and interface technique. A master and at least two devices are interconnected with a signal line of a high speed bus. A capacitive coupling element, for example a diode, is employed to capacitively couple the interface of the device to the signal line. By employing the capacitive coupling element, along with a suitable signaling technique which supports capacitive information transfer, high speed rates of information transfer between the master and device over the signal line are achieved.

Abstract: A printed circuit board modification and repair system is presented which functions under computer control. Modification is accomplished by securing the printed circuit board to an X-Y positioning fixture mounted on a work station table. After indexing to a reference point, the X-Y positioning fixture can be moved fore, aft and sideways by computer command to bring a specific location on the printed circuit board under any one of a plurality of heads mounted above the work station surface. One head will contain an etch cutting bit for making cuts in printed circuit connections. A second head has mounted thereon a laser beam discharge device for removing conformal coatings and wire insulation. A third head mounts a wire dispenser for making new conductive paths and a glue dispenser for securing the newly positioned wire to the board. A fourth head contains an ultra-violet lamp for achieving quick cures of glues and epoxy.