Abstract: A pigtail-less optical connector assembly is described that is capable of data rates as high as 10 GHz. The described optical connector assembly connects the optical fiber connector to an optical die element mounted in the connector assembly using optical fiber ribbon and an optical deflecting device. The optical fiber connector is slideable within the connector assembly and is resiliently biased toward a home position. The connector assembly is designed to allow the optical fiber ribbon to flex without damaging the fiber ribbon as the optical fiber connector slides.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.

Abstract: A flexible circuit assembly that integrates a first fiber optic die, for example a transmitter die, and a second fiber optic die, for example a receiver die, on a single flexible circuit. Alignment holes and the multiple die are accurately placed on a single flexible circuit. The precise placement of the alignment holes and the fiber optic die facilitate micron alignment accuracy to a mechanical transfer (MT) connector. Fiber optic die circuitry is electrically connected to the first fiber optic die and second fiber optic die and connected to the flexible circuit.

Abstract: A die circuit assembly and method are described that integrates a first fiber optic die and a second fiber optic die into one assembly containing alignment features allowing for the accurate aligning of the fiber optic die to a fiber optic connector. The die circuit assembly can be attached to a flexible circuit in a manner to ensure the planarity of the fiber optic die is kept normal to the fiber optic connector. A method is also described where a plurality of the die circuit assemblies are formed from a single assembly.

Abstract: A pigtail-less optical connector assembly is described that is capable of data rates as high as 10 GHz. The described optical connector assembly connects the optical fiber connector to an optical die element mounted in the connector assembly using optical fiber ribbon and an optical deflecting device. The optical fiber connector is slideable within the connector assembly and is resiliently biased toward a home position. The connector assembly is designed to allow the optical fiber ribbon to flex without damaging the fiber ribbon as the optical fiber connector slides.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A flexible circuit assembly is described that integrates a first fiber optic die, for example a transmitter die, a second fiber optic die, for example a receiver die, a trans-impedance amplifier die and a transmitter driver die on a single flexible circuit. Alignment holes and multiple die are accurately placed on a single flexible circuit. The precise placement of alignment holes and fiber optic die facilitate micron alignment accuracy to a fiber optic connector, preferably a mechanical transfer (MT) connector. A heat sink is provided that transfers heat from the trans-impedance amplifier die and the transmitter driver die and isolates the fiber optic die from the heat source. Circuitry for the first fiber optic die, second fiber optic die, impedance die, and driver die, including isolated grounding circuitry, is also integrated on the flexible circuit assembly.

Abstract: A heat transfer device generally includes a flexible cooling layer for use in heat pipe technology for example. The flexible layer has outer and inner surfaces. A backing layer has an outer surface and an inner surface facing the inner surface of the flexible layer. A rigid separator portion is disposed between the inner surfaces of the flexible and backing layers, and has inner and outer surfaces. The inner surfaces of the flexible and backing layers and the rigid separator portion define a sealed chamber. An evaporable working liquid is contained within the sealed chamber. The working liquid expands when heated to expand a volume within the sealed chamber, such that the flexible layer extends away from the sealed chamber. The flexible layer, when extended transfers heat through the sealed chamber to a cooler area of the device.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.

Abstract: An optical fiber connector and a method of forming an optical fiber connector are described where the optical fiber connector has low eccentricity tolerance at each end of the connector. Optical interconnection can be made at both ends of the connector, with the low eccentricity tolerance at each end providing improved light transmission at each interconnection. The connector is formed by using two commercially available, off-the-shelf connector members. Each connector member has a first end with a low eccentricity tolerance and a second end that allows for a fiber optic cable termination. The two connectors are connected together back-to-back, so that the second ends face each other and the first ends are disposed at opposite ends of the connector. The size of the connector can also be easily adjusted to make it shorter or longer.

Abstract: A flexible circuit assembly is described that integrates a first fiber optic die, for example a transmitter die, a second fiber optic die, for example a receiver die, a trans-impedance amplifier die and a transmitter driver die on a single flexible circuit. Alignment holes and multiple die are accurately placed on a single flexible circuit. The precise placement of alignment holes and fiber optic die facilitate micron alignment accuracy to a fiber optic connector, preferably a mechanical transfer (MT) connector. A heat sink is provided that transfers heat from the trans-impedance amplifier die and the transmitter driver die and isolates the fiber optic die from the heat source. Circuitry for the first fiber optic die, second fiber optic die, impedance die, and driver die, including isolated grounding circuitry, is also integrated on the flexible circuit assembly.

Abstract: A flexible circuit assembly that integrates a first fiber optic die, for example a transmitter die, and a second fiber optic die, for example a receiver die, on a single flexible circuit. Alignment holes and the multiple die are accurately placed on a single flexible circuit. The precise placement of the alignment holes and the fiber optic die facilitate micron alignment accuracy to a mechanical transfer (MT) connector. Fiber optic die circuitry is electrically connected to the first fiber optic die and second fiber optic die and connected to the flexible circuit.

Abstract: A device and method that exchanges heat is described, which includes intaking air into a chamber and then forcing air from holes of a heat conducting surface that fluidly communicate with the chamber to create a toroidal mass of air resulting from vortex shedding. A pump, for example a flexible diaphragm, is employed to increase and decrease a volume of the chamber in communication with the holes. When the volume of the chamber is increased (air intake), a boundary layer of heat breaks up by the heat conducting surface which helps to improve cooling. When the volume of the chamber is decreased, jets of air are discharged from the holes to create vortices of air that cause vortex shedding and can also help disrupt the boundary layer of heat.

Abstract: A connector assembly that integrates an optical fiber connector with a fiber optic transceiver into one assembly. The optical fiber connector is provided with end float for optical connection to an optical back panel. Some components of the fiber optic transceiver are mounted on the optical fiber connector and float with the connector. Other components of the fiber optic transceiver are mounted in static positions on a circuit card assembly that is part of the connector assembly. A flexible circuit electrically connects the transceiver components mounted on the optical fiber connector with the static transceiver components. The connector assembly eliminates the use of a fiber pigtail, improves the ease of mounting and removal of the fiber optic transceiver from the host board, consolidates the transceiver circuitry into one assembly, and allows reduction of the host board footprint and/or provides additional space on the host board for mounting other components.

Abstract: A functional optical device for use in an optical backplane system is provided that includes one or more input fibers, one or more output fibers, and a functional portion configured to operate on an optical input received via the one or more input fibers to provide an optical output via the one or more output fibers. The one or more input fibers and the one or more output fibers of the functional optical device are terminated in a fixed configuration based on a fixed termination layout of at least one group of multiple fibers of an optical backplane interconnect.

Abstract: Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a first end and a second end, where the expandable member includes a first outer surface to contact a first conduction-cooled electronic module, an inlet located at a first end to receive a conductive fluid, and an outlet located at the second end to exhaust the conductive fluid.

Abstract: An optical sensing device uses a set of source mirrors directing light from a set of light sources to a movable collector mirror. Each of the light sources has a unique wavelength. The collector mirror is coupled to a MEMS actuator that moves the collector mirror in response to a physical phenomena. A light collector gathers light from the collector mirror and the physical phenomena can be measured by determining the relative intensity associated with each of the light sources in the light gathered at the collector.