Patents by Inventor Kevin M. Devereaux
Kevin M. Devereaux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130030881Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: ApplicationFiled: July 20, 2012Publication date: January 31, 2013Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 7825774Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: October 25, 2007Date of Patent: November 2, 2010Assignee: Round Rock Research, LLCInventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler A. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 7786845Abstract: Identification information is wirelessly communicated between radio frequency devices. In one embodiment, a first wireless device transmits a signal to request identification information. Other wireless devices are each affixed a respective item, and each of the other wireless devices determines if a reply signal is to be transmitted, and if so, communicates the reply signal to the first wireless device.Type: GrantFiled: August 29, 2007Date of Patent: August 31, 2010Assignee: Round Rock Research, LLCInventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 7777610Abstract: In one embodiment, a method includes transmitting a signal from a wireless transmitter to a radio frequency (RF) device of a plurality of RF devices within a communication range of the transmitter. The signal is to select a group of the RF devices. A reply signal is received from each RF device if the respective RF device determines that it is a member of the group.Type: GrantFiled: August 29, 2007Date of Patent: August 17, 2010Assignee: Round Rock Research, LLCInventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 7545256Abstract: To identify an RFID tag in a field of RFID tags, an interrogator sends a series of commands to implement an arbitration scheme. The commands include differentiation, selection, and modulation information. The tag uses the differentiation information to differentiate commands sent by the interrogator from commands sent by other interrogators that may be within communication range of the tag. The selection information is used by the tag to determine if the tag is a member of a group selected by the interrogator for response to the interrogator. If the tag is a member of the selected group, the tag may send a reply that is modulated using a modulation type selected by the modulation information. In accordance with one of the modulation types, one of three different pulse waveforms is selected by the interrogator via the modulation information to multiply with the baseband waveform of the reply from the tag.Type: GrantFiled: November 28, 2006Date of Patent: June 9, 2009Assignee: Keystone Technology Solutions, LLCInventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler A. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Publication number: 20080211636Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: ApplicationFiled: October 25, 2007Publication date: September 4, 2008Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler A. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 7385477Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: November 29, 2005Date of Patent: June 10, 2008Assignee: Keystone Technology Solutions, LLCInventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler F. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 7170867Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: April 12, 2004Date of Patent: January 30, 2007Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 7079043Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: July 24, 2003Date of Patent: July 18, 2006Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler E. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 6947513Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: March 30, 2001Date of Patent: September 20, 2005Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler E. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 6941124Abstract: An amplifier powered by a selectively engageable voltage source and a method for operating the amplifier. The amplifier includes first and second electrodes for receiving an input signal to be amplified. The first and second electrodes are adapted to be respectively connected to coupling capacitors. The amplifier also includes a differential amplifier having inputs respectively connected to the first and second electrodes, and having an output. The amplifier additionally includes selectively engageable resistances coupled between the voltage source and respective inputs of the differential amplifier and defining, with the coupling capacitors, the high pass characteristics of the circuit. The amplifier further includes second selectively engageable resistances coupled between the voltage source and respective inputs of the differential amplifier.Type: GrantFiled: February 11, 2000Date of Patent: September 6, 2005Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 6911357Abstract: The present invention provides a method and apparatus which facilitates wafer level burn-in testing of semiconductor dies. Sacrificial busses on the wafer supply voltage to respective on die Vcc and Vss sacrificial voltage pads during burn-in testing. The Vcc sacrificial pad on each die is connected to a secondary Vcc pad through an on-die sacrificial metal bus. An on-die fuse is interposed between the secondary Vcc pad and a normal Vcc die bonding pad. The fuse will blow when a die draws excessive current isolating a defective die from other dies on the wafer which are connected to the sacrificial busses. The Vss sacrificial pad is connected to a normal Vss die bonding pad through a sacrificial metal bus. After burn-in testing, the structures are removed. During this removal, the on-die sacrificial metal busses protect the secondary Vcc pad and Vss bonding pad. The secondary Vcc pad, Vcc bonding pad and Vss bonding pad can then be exposed for additional die testing.Type: GrantFiled: June 21, 2002Date of Patent: June 28, 2005Assignee: Micron Technology, Inc.Inventor: Kevin M. Devereaux
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Patent number: 6836472Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: April 26, 2002Date of Patent: December 28, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler E. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-Sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 6836468Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: August 14, 2000Date of Patent: December 28, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard
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Patent number: 6825773Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: September 11, 1998Date of Patent: November 30, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Robert R. Rotzoll, Shu-Sun Yu
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Publication number: 20040201457Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: ApplicationFiled: April 12, 2004Publication date: October 14, 2004Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler E. Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, Shu-sun Yu, David K. Ovard, Robert R. Rotzoll
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Patent number: 6774685Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: April 3, 2000Date of Patent: August 10, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 6771613Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: September 23, 1998Date of Patent: August 3, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll
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Patent number: 6753547Abstract: The present invention provides a method and apparatus which facilitates wafer level burn-in testing of semiconductor dies. Sacrificial busses on the wafer supply voltage to respective on die Vcc and Vss sacrificial voltage pads during burn-in testing. The Vcc sacrificial pad on each die is connected to a secondary Vcc pad through an on-die sacrificial metal bus. An on-die fuse is interposed between the secondary Vcc pad and a normal Vcc die bonding pad. The fuse will blow when a die draws excessive current isolating a defective die from other dies on the wafer which are connected to the sacrificial busses. The Vss sacrificial pad is connected to a normal Vss die bonding pad through a sacrificial metal bus. After burn-in testing, the structures are removed. During this removal, the on-die sacrificial metal busses protect the secondary Vcc pad and Vss bonding pad. The secondary Vcc pad, Vcc bonding pad and Vss bonding pad can then be exposed for additional die testing.Type: GrantFiled: August 28, 2001Date of Patent: June 22, 2004Assignee: Micron Technology, Inc.Inventor: Kevin M. Devereaux
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Patent number: 6735183Abstract: A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.Type: GrantFiled: May 2, 2000Date of Patent: May 11, 2004Assignee: Micron Technology, Inc.Inventors: James E. O'Toole, John R. Tuttle, Mark E. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax, Brian P. Higgins, David K. Ovard, Shu-Sun Yu, Robert R. Rotzoll