Abstract: Embodiments describe a housing for an electronic device that includes a non-conductive filament wound around a least a first portion of a perimeter of the housing, and a conductive filament wound around a least a second portion of the perimeter of the housing. The non-conductive filament and the conductive filament are adhered together to form the housing.

Abstract: Embodiments describe a housing for an electronic device that includes a non-conductive filament wound around a least a first portion of a perimeter of the housing, and a conductive filament wound around a least a second portion of the perimeter of the housing.

Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

Abstract: An electronic device including at least one electronic component, such as a processor and a housing enclosing the at least one electronic component. The housing including a top skin forming an outer surface of the housing, a bottom skin forming an inner surface of the housing and facing the at least one electronic component, and a core sandwiched by the top skin and the bottom skin. The core is made from a first material having a first modulus of elasticity and the top skin and the bottom skin are made from a second material having a second modulus of elasticity, the second modulus greater than the first. The inner surface of the housing is positioned above the at least one electronic component such that a clearance level is defined between the inner surface of the housing and the at least one electronic component.

Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

Abstract: Certain embodiments disclosed herein relate to a smooth finish composite structure and methods for making the composite structure. In particular, in one embodiment, a method is provided that includes creating a first layer of a composite structure. The creation of the first layer includes positioning the first layer in a mold and curing the first layer. Additional layers of the composite structure are created and bonded to the first layer.

Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.

Abstract: A housing for an electronic device or other object formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used. A spine made from CFRP may support, and be attached to, a CFRP skin. The CFRP spine may be a unitary frame that imparts strength and rigidity to the overall housing and also form at least some of the corners of the frame. In some embodiments, the spine may be rectangular. The skin may be formed from multiple layers of CFRP type material stacked atop each other. Each layer may be cut at one or more corners to expose at least a portion of the layer beneath. The skin may thus have an overall cross shape, such that each arm of the cross may be wrapped around a different side of the aforementioned rectangular spine.

Abstract: An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a frame that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the frame is configured to hold the consumer electronic device therein. For example, the frame may define a multi-sided cross-section with an inner edge thereof configured to engage a chamfered edge of the consumer electronic device. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations.

Abstract: A method is provided for fabricating a composite panel with a surface finish. The method includes securing a polymer film within a first portion of a mold and securing a composite panel within a second portion of the mold. The method also includes holding the first portion of the mold against the second portion of the mold to form a mold cavity between composite panel and the polymer film. The method further includes heating the mold to an elevated temperature, injecting a polymer resin into the mold cavity, and curing the polymer resin to form an integrated structure having a polymer resin layer between the composite panel and the polymer film.

Abstract: A method for manufacturing an enclosure for an electronic device including forming the enclosure, forming one or more locating cavities on a surface of the enclosure, attaching one or more blanks to the enclosure using the one or more locating cavities, and processing the one or more attached blanks to form a desired shape thereof. The enclosure may be formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used.

Abstract: Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.

Abstract: A housing for an electronic device or other object formed in a layered configuration. The layer or sandwich construction imparts strength and rigidity while decreasing the overall weight to the housing. The case/housing may have a first layer and a second layer formed from a first material. The case may also include a core formed from a second material. Where the first layer may be bonded to a top surface of the core and the second layer may be bonded to a bottom surface of the core.

Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.