Patents by Inventor Kevin M. O'Connell

Kevin M. O'Connell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130178092
    Abstract: A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 11, 2013
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Mark D. Plucinski, Sandra J. Shirk/Heath, Arvind K. Sinha
  • Publication number: 20130032935
    Abstract: A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.
    Type: Application
    Filed: August 5, 2011
    Publication date: February 7, 2013
    Inventors: Kevin M. O'Connell, Arvind K. Sinha, Kory W. Weckman