Patents by Inventor Kevin Seichi Yamada

Kevin Seichi Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170082568
    Abstract: A system and method of sensing the amount of moisture in soil are disclosed. According to an embodiment, a soil moisture sensing system comprises a circuit unit and a sensor link electrically connected to the circuit unit. The sensor link includes a plurality of segments, each segment including an LC circuit in which a capacitor is connected with an inductor. The circuit unit is configured to provide an oscillating signal to a first LC circuit of the sensor link, sense a first coupled signal in a second LC circuit of the sensor link, and determine a soil moisture level on the basis of the first coupled signal.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 23, 2017
    Inventors: Manu Pillai, Kevin Seichi Yamada
  • Patent number: 6717799
    Abstract: A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: April 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Takeshi Hamano, Kevin Seichi Yamada
  • Patent number: 6347035
    Abstract: A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: February 12, 2002
    Assignee: Fujitsu Limited
    Inventors: Takeshi Hamano, Kevin Seichi Yamada
  • Publication number: 20010046119
    Abstract: A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.
    Type: Application
    Filed: June 5, 2001
    Publication date: November 29, 2001
    Inventors: Takeshi Hamano, Kevin Seichi Yamada
  • Patent number: 6185103
    Abstract: A removable, EMI-shielding hard disk drive module for a notebook computer is pivotally insertable into the computer through an opening in the computer's base plate. Connectors fixedly mounted on the module and computer, respectively, mate when the module is fully inserted. A pin on the module cooperates with a movable cam on the computer to automatically lock the module in position when it is fully inserted, and to positively but smoothly disengage the connectors when the lock is released for removal of the module. To facilitate removal, the cam may lightly hold the module, after the connectors are disengaged, in a position where the module is easy to grasp and remove.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: February 6, 2001
    Assignee: Fujitsu Limited
    Inventor: Kevin Seichi Yamada