Abstract: An implementation relates to a polyester-based film having low hygroscopicity, a manufacturing method therefor, and a membrane electrode assembly comprising same, and the polyester-based film has excellent flexibility, adhesion and durability and has a moisture absorption represented by formula 1, which meets 0.25% or less, and thus has excellent hydrolysis resistance so as to be applied as a film for a fuel cell sub-gasket and exhibit excellent characteristics.

Abstract: A test board is provided. The test board comprises a first region which includes a first upper surface with first test sockets aligned thereon, and a first lower surface opposite to the first upper surface, a second region which includes a second upper surface with second test sockets aligned thereon, and a second lower surface opposite to the second upper surface, a hinge portion between the first region and the second region, and configured to connect the first region and the second region such that the first region and the second region are folded or unfolded, a first connector at one end of the first region opposite to the hinge portion and a second connector at one end of the second region opposite to the hinge portion.

Abstract: A semiconductor circuit includes a reference voltage generating circuit which generates a first reference voltage; a voltage control circuit which receives the first reference voltage from the reference voltage generating circuit to output a second reference voltage; a DC-DC conversion circuit which executes DC-DC conversion on the basis of the second reference voltage which is output from the voltage control circuit, and provides an output thereof to a first node; and a voltage regulator which executes voltage regulating on the basis of the first reference voltage which is output from the reference voltage generating circuit, and a voltage of the first node, and provides an output thereof to a second node.

Abstract: An apparatus for testing a signal speed of a semiconductor package may include a plurality of sockets, one or more test boards including at least a first test board, an extension board and a test head. Each of the sockets may be configured to receive the semiconductor package. The first test board may include a plurality of mount regions on which the sockets may be mounted, and test lines extended from the mount regions toward at least one side surface of the first test board. The extension board may be vertically arranged at the side surface of the first test board. The extension board may be electrically connected to the test lines. The test head may be electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board. Thus, it may not be required to change a structure of the socket in accordance with types of the semiconductor packages.

Abstract: An apparatus for testing semiconductor devices and a system including the same includes a socket unit having a plurality of sockets into which a plurality of semiconductor devices are inserted, respectively. Also included is a module unit including a first sub-module for receiving a test signal from a host and providing the same test signal to each of the plurality of sockets, and a second sub-module including the same structure as the first sub-module. The first sub-module includes a first buffer unit including an amplifier having an input terminal to which an input signal is inputted and an output terminal to amplify and output the input signal inputted based on a reference voltage (VT), and a reference resistor having one end connected to the input terminal of the amplifier and the other end to which the reference voltage is applied, and a second buffer unit including the same structure as the first buffer unit.

Abstract: A semiconductor circuit includes a reference voltage generating circuit which generates a first reference voltage; a voltage control circuit which receives the first reference voltage from the reference voltage generating circuit to output a second reference voltage; a DC-DC conversion circuit which executes DC-DC conversion on the basis of the second reference voltage which is output from the voltage control circuit, and provides an output thereof to a first node; and a voltage regulator which executes voltage regulating on the basis of the first reference voltage which is output from the reference voltage generating circuit, and a voltage of the first node, and provides an output thereof to a second node.

Abstract: A rechargeable power module (RPM) may include a rechargeable energy storage device such as a battery or capacitor, a charging circuit, a direct-current (DC) to DC converter, a low drop-out (LDO) voltage regulator and a controller. The charging circuit provides the rechargeable energy storage device with a charging current based on power requirements of device under test and the state of charge, or storage, of the energy storage device.

Abstract: An apparatus for testing a signal speed of a semiconductor package may include a plurality of sockets, one or more test boards including at least a first test board, an extension board and a test head. Each of the sockets may be configured to receive the semiconductor package. The first test board may include a plurality of mount regions on which the sockets may be mounted, and test lines extended from the mount regions toward at least one side surface of the first test board. The extension board may be vertically arranged at the side surface of the first test board. The extension board may be electrically connected to the test lines. The test head may be electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board. Thus, it may not be required to change a structure of the socket in accordance with types of the semiconductor packages.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: An apparatus for testing semiconductor devices and a system including the same includes a socket unit having a plurality of sockets into which a plurality of semiconductor devices are inserted, respectively. Also included is a module unit including a first sub-module for receiving a test signal from a host and providing the same test signal to each of the plurality of sockets, and a second sub-module including the same structure as the first sub-module. The first sub-module includes a first buffer unit including an amplifier having an input terminal to which an input signal is inputted and an output terminal to amplify and output the input signal inputted based on a reference voltage (VT), and a reference resistor having one end connected to the input terminal of the amplifier and the other end to which the reference voltage is applied, and a second buffer unit including the same structure as the first buffer unit.

Abstract: A rechargeable power module (RPM) may include a rechargeable energy storage device such as a battery or capacitor, a charging circuit, a direct-current (DC) to DC converter, a low drop-out (LDO) voltage regulator and a controller. The charging circuit provides the rechargeable energy storage device with a charging current based on power requirements of device under test and the state of charge, or storage, of the energy storage device.

Abstract: A rechargeable power module (RPM) may include a rechargeable energy storage device such as a battery or capacitor, a charging circuit, a direct-current (DC) to DC converter, a low drop-out (LDO) voltage regulator and a controller. The charging circuit provides the rechargeable energy storage device with a charging current based on power requirements of device under test and the state of charge, or storage, of the energy storage device.

Abstract: A test device includes a test unit and a voltage selection circuit. The test unit is configured to detect a voltage at a test pad of a semiconductor device under test by applying a test current to the test pad. The voltage selection circuit is configured to apply a selection voltage to a ground pad of the semiconductor device under test by selecting one of a plurality of voltages according to a test mode.

Abstract: A test board includes a plurality of power pads on a substrate. The power pads output a power supply voltage to a plurality of power terminals of a semiconductor device under test. The test board also includes a current limit circuit to limit current flowing through each of the power pads.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: A test interface board includes a substrate including a power plane electrically connected to at least one power terminal of a semiconductor device under test, and a ground plane electrically connected to at least one ground terminal of the semiconductor device under test, and a voltage regulator arranged on the substrate and configured to supply, via the power plane and the ground plane, to the semiconductor device under test, a driving voltage.

Abstract: A rechargeable power module (RPM) may include a rechargeable energy storage device such as a battery or capacitor, a charging circuit, a direct-current (DC) to DC converter, a low drop-out (LDO) voltage regulator and a controller. The charging circuit provides the rechargeable energy storage device with a charging current based on power requirements of device under test and the state of charge, or storage, of the energy storage device.

Abstract: A test interface board includes a substrate including a power plane electrically connected to at least one power terminal of a semiconductor device under test, and a ground plane electrically connected to at least one ground terminal of the semiconductor device under test, and a voltage regulator arranged on the substrate and configured to supply, via the power plane and the ground plane, to the semiconductor device under test, a driving voltage.

Abstract: A test device includes a test unit and a voltage selection circuit. The test unit is configured to detect a voltage at a test pad of a semiconductor device under test by applying a test current to the test pad. The voltage selection circuit is configured to apply a selection voltage to a ground pad of the semiconductor device under test by selecting one of a plurality of voltages according to a test mode.

Abstract: A semiconductor device and a test apparatus including the same, the semiconductor device including a command distributor receiving a serial command that is synchronized with a first clock signal and converting the serial command into a parallel command, a command decoder receiving the parallel command and generating a pattern sequence based on the parallel command, and a signal generator receiving the pattern sequence and generating operating signals synchronized with a second clock signal, wherein a frequency of the first clock signal is less than a frequency of the second clock signal.