Patents by Inventor Ki-Jeong Moon

Ki-Jeong Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9090800
    Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: July 28, 2015
    Assignee: TORAY ADVANCED MATERIALS KOREA, INC.
    Inventors: Sung-Hwan Choi, Ki-Jeong Moon, Hae-Sang Jeon, Chang-Hoon Sim
  • Patent number: 8945668
    Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: February 3, 2015
    Assignee: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon Sim, Yeun-Soo Kim, Ki-Jeong Moon
  • Publication number: 20140107248
    Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 17, 2014
    Applicant: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon SIM, Yeun-Soo KIM, Ki-Jeong MOON
  • Patent number: 8524833
    Abstract: A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: September 3, 2013
    Assignee: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon Sim, Ki-Jeong Moon, Hae-Sang Jun
  • Publication number: 20120269990
    Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.
    Type: Application
    Filed: December 5, 2011
    Publication date: October 25, 2012
    Applicant: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon SIM, Yeun-Soo KIM, Ki-Jeong MOON
  • Patent number: 8263428
    Abstract: This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: September 11, 2012
    Assignee: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon Sim, Sang-Pil Kim, Ki-Jeong Moon
  • Publication number: 20120009715
    Abstract: This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.
    Type: Application
    Filed: March 22, 2010
    Publication date: January 12, 2012
    Applicant: TORAY ADVANCED MATERIALS KOREA INC.
    Inventors: Chang-Hoon Sim, Sang-Pil Kim, Ki-Jeong Moon
  • Publication number: 20110318580
    Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
    Type: Application
    Filed: March 9, 2009
    Publication date: December 29, 2011
    Inventors: Sung-Hwan Choi, Ki-Jeong Moon, Hae-Sang Jeon, Chang-Hoon Sim
  • Patent number: 8057894
    Abstract: An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: November 15, 2011
    Assignee: Toray Advanced Materials Korea, Inc.
    Inventors: Sang-Pil Kim, Ki-Jeong Moon, Woo-Seok Kim
  • Publication number: 20110166258
    Abstract: Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.
    Type: Application
    Filed: April 1, 2010
    Publication date: July 7, 2011
    Applicant: TORAY SAEHAN INC.
    Inventors: Seung Woo Hong, Woo Seok Kim, Ki Jeong Moon, Hae Sang Jeon
  • Patent number: 7960023
    Abstract: There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: June 14, 2011
    Assignee: Toray Advanced Materials Korea Inc.
    Inventors: Chang-Hoon Sim, Ki-Jeong Moon, Hae-Sang Jun, Jun-Ho Lee, Yun-Min Park
  • Publication number: 20110056623
    Abstract: This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 10, 2011
    Applicant: Toray Saehan, Inc.
    Inventors: Min-Ho IM, Sung-Hwan Choi, Chang-Hoon Sim, Ki-Jeong Moon, Hae-Sang Jeon
  • Publication number: 20100330278
    Abstract: There is provided a method for treating a surface of a substrate, comprising forming a layer, such as a mixed self-assembled monolayer (SAM), on the surface via chemical vapor deposition (CVD) with a CF3-functionalized organic silane and a CH3-functionalized organic silane, wherein the length of a carbon chain of the CH3-functional organic silane is shorter than a carbon chain of the CF3-functionalized organic silane.
    Type: Application
    Filed: August 24, 2010
    Publication date: December 30, 2010
    Inventors: Sung-Hwan Choi, Ki-Jeong Moon, Hae-Sang Jeon
  • Publication number: 20100295001
    Abstract: A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
    Type: Application
    Filed: July 2, 2009
    Publication date: November 25, 2010
    Applicant: Toray Saehan, Inc.
    Inventors: Chang-Hoon SIM, Ki-Jeong Moon, Hae-Sang Jun
  • Publication number: 20100247906
    Abstract: The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature.
    Type: Application
    Filed: August 22, 2007
    Publication date: September 30, 2010
    Applicant: TORAY SAEHAN INC.
    Inventors: Jun-Ho Lee, Hae-Sang Jeun, Ki-Jeong Moon, Chang-Hoon Sim
  • Publication number: 20090294046
    Abstract: The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.
    Type: Application
    Filed: December 5, 2007
    Publication date: December 3, 2009
    Applicant: TORAY SAEHAN INC.
    Inventors: Chang-Hoon SIM, Ki-Jeong Moon, Hae-Sang Jun
  • Publication number: 20080226884
    Abstract: The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film.
    Type: Application
    Filed: December 5, 2007
    Publication date: September 18, 2008
    Applicant: TORAY SAEHAN INC.
    Inventors: Chang-Hoon SIM, Ki-Jeong Moon, Hae-Sang Jun, Jun-Ho Lee, Yun-Min Park
  • Publication number: 20060286375
    Abstract: An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.
    Type: Application
    Filed: August 5, 2005
    Publication date: December 21, 2006
    Applicant: TORAY SAEHAN INC.
    Inventors: Sang-Pil Kim, Ki-Jeong Moon, Woo-Seok Kim