Patents by Inventor Ki Seok Jang

Ki Seok Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210402525
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Application
    Filed: June 30, 2021
    Publication date: December 30, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, KWANG-SEONG CHOI, Jiho JOO, CHANMI LEE, Ki Seok JANG
  • Patent number: 11211102
    Abstract: A method of operating memory devices disposed in different ranks of a multi-rank memory device and sharing a signal line includes receiving, in all of the memory devices included in the multi-rank memory device, on-die termination (ODT) state information of the signal line. The method further includes storing, in each of the memory devices of the multi-rank memory device, the ODT state information of the signal line in a mode register. The method further includes generating, in each of the memory devices of the multi-rank memory device, a control signal based on the ODT state information of the signal line stored in the mode register. The method further includes changing, in each of the memory devices of the multi-rank memory device, an ODT setting of the signal line in response to the control signal.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 28, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-Sik Moon, Kyung-Soo Ha, Young-Soo Sohn, Ki-Seok Oh, Chang-Kyo Lee, Jin-Hoon Jang, Yeon-Kyu Choi, Seok-Hun Hyun
  • Publication number: 20210320236
    Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 14, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho JOO, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, CHANMI LEE, Ki Seok JANG
  • Publication number: 20210252620
    Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 19, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Yong Sung EOM, Jiho JOO, Seok-Hwan MOON, Ho-Gyeong YUN, Ki Seok JANG, GWANG-MUN CHOI
  • Publication number: 20200266078
    Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 20, 2020
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung EOM, KWANG-SEONG CHOI, Ki Seok JANG, Seok-Hwan MOON, Jiho JOO
  • Patent number: 10466413
    Abstract: Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: November 5, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gyungock Kim, Hyundai Park, In Gyoo Kim, Sang Hoon Kim, Ki Seok Jang, Sang Gi Kim, Jiho Joo, Yongseok Choi, Hyuk Je Kwon, Jaegyu Park, Sun Ae Kim, Jin Hyuk Oh, Myung joon Kwack
  • Patent number: 10168474
    Abstract: Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: January 1, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gyungock Kim, Hyundai Park, In Gyoo Kim, Sang Hoon Kim, Ki Seok Jang, Sang Gi Kim, Jiho Joo, Yongseok Choi, Hyuk Je Kwon, Jaegyu Park, Sun Ae Kim, Jin Hyuk Oh, myung joon Kwack
  • Patent number: 10131825
    Abstract: Provided are an optical member, a pressure-sensitive adhesive composition, and an LCD. The optical member may have excellent endurance reliability even when a pressure-sensitive adhesive layer is formed to have a thickness of 20 ?m or less.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: November 20, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Se Woo Yang, Ki Seok Jang, Yong Su Park, Min Soo Park, Suk Ky Chang, Jong Rok Jeon
  • Publication number: 20170269298
    Abstract: Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
    Type: Application
    Filed: May 30, 2017
    Publication date: September 21, 2017
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Gyungock KIM, Hyundai PARK, In Gyoo KIM, Sang Hoon KIM, Ki Seok JANG, Sang Gi KIM, Jiho JOO, Yongseok CHOI, Hyuk Je KWON, Jaegyu PARK, Sun Ae KIM, Jin Hyuk OH, myung joon KWACK
  • Publication number: 20170261705
    Abstract: Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
    Type: Application
    Filed: May 30, 2017
    Publication date: September 14, 2017
    Applicant: Electronics and Telecommunications Research Instit ute
    Inventors: Gyungock KIM, Hyundai PARK, In Gyoo KIM, Sang Hoon KIM, Ki Seok JANG, Sang Gi KIM, Jiho JOO, Yongseok CHOI, Hyuk Je KWON, Jaegyu PARK, Sun Ae KIM, Jin Hyuk OH, Myung Joon KWACK
  • Patent number: 9728657
    Abstract: Provided is a photodetector including a substrate, a first doped region on the substrate, a second doped region having a ring structure, wherein the second doped region is provided in the substrate, surrounds the first doped region and is horizontally spaced apart from a side of the first doped region, an optical absorption layer on the first doped region, a contact layer on the optical absorption layer, a first electrode on the contact layer, and a second electrode on the second doped region.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: August 8, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho Joo, Gyungock Kim, Myungjoon Kwack, Sang Hoon Kim, Sun Ae Kim, In Gyoo Kim, Jaegyu Park, Jin Hyuk Oh, Ki Seok Jang
  • Publication number: 20170204294
    Abstract: Provided are an optical member, a pressure-sensitive adhesive composition, and an LCD. The optical member may have excellent endurance reliability even when a pressure-sensitive adhesive layer is formed to have a thickness of 20 ?m or less.
    Type: Application
    Filed: March 6, 2017
    Publication date: July 20, 2017
    Inventors: Se Woo YANG, Ki Seok JANG, Yong Su PARK, Min Soo PARK, Suk Ky CHANG, Jong Rok JEON
  • Patent number: 9690042
    Abstract: Disclosed are an optical input/output device and an opto-electronic system including the same. The device includes a bulk silicon substrate, at least one vertical-input light detection element monolithically integrated on a portion of the bulk silicon substrate, and at least one vertical-output light source element monolithically integrated on another portion of the bulk silicon substrate adjacent to the vertical-input light detection element. The vertical-output light source element includes a III-V compound semiconductor light source active layer combined with the bulk silicon substrate by a wafer bonding method.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: June 27, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gyungock Kim, Hyundai Park, In Gyoo Kim, Sang Hoon Kim, Ki Seok Jang, Sang Gi Kim, Jiho Joo, Yongseok Choi, Hyuk Je Kwon, Jaegyu Park, Sun Ae Kim, Jin Hyuk Oh, Myung Joon Kwack
  • Patent number: 9638952
    Abstract: The present invention relates to a pressure sensitive adhesive composition, a polarizer and a liquid crystal display device. The present invention may provide a pressure sensitive adhesive which can have excellent stress relaxation characteristic to effectively inhibit light leakage by dimension change of optical films such as polarizing plates. In addition, a pressure sensitive adhesive having excellent physical properties such as adhesion durability and workability may be provided.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: May 2, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Ki Seok Jang, Suk Ky Chang, Min Soo Park, Se Woo Yang
  • Patent number: 9505960
    Abstract: Provided are a pressure-sensitive adhesive (PSA) composition including an interpenetrating polymer network structure in a cured state, and including an acrylic resin and a crosslinking agent component that consists of a bifunctional crosslinking agent, a polarizer and a liquid crystal display. Provided are the PSA composition, the polarizer including a cured product of the PSA composition, and the liquid crystal display, which have excellent workability and optical properties, durability and reliability, at high temperature or humidity condition, and significantly increase productivity of optical members such as a polarizer, since the time-dependent change of the pressure-sensitive adhesive strength is rapidly ended after fabrication.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: November 29, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Min Soo Park, In Cheon Han, Ki Seok Jang
  • Patent number: 9459409
    Abstract: An optical coupling device comprises an optical fiber block including a first block part and a second block part contacting with one side of the first block part, an optical fiber penetrating the optical fiber block and having an end surface exposed at a bottom surface of the optical fiber block, a semiconductor chip disposed below the optical fiber block and having an optical input/output element disposed on a top surface of the semiconductor chip to correspond with the end surface of the optical fiber, and a planarization layer disposed on the top surface of the semiconductor chip and having a recess region. A bottom surface of the first block part has a higher level than that of the second block part. The bottom surface of the second block part contacts with a bottom of the recess region. The optical fiber is optically coupled with the optical input/output element.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: October 4, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Myungjoon Kwack, Gyungock Kim, Jaegyu Park, Ki Seok Jang, Jiho Joo
  • Publication number: 20160259126
    Abstract: An optical coupling device comprises an optical fiber block including a first block part and a second block part contacting with one side of the first block part, an optical fiber penetrating the optical fiber block and having an end surface exposed at a bottom surface of the optical fiber block, a semiconductor chip disposed below the optical fiber block and having an optical input/output element disposed on a top surface of the semiconductor chip to correspond with the end surface of the optical fiber, and a planarization layer disposed on the top surface of the semiconductor chip and having a recess region. A bottom surface of the first block part has a higher level than that of the second block part. The bottom surface of the second block part contacts with a bottom of the recess region. The optical fiber is optically coupled with the optical input/output element.
    Type: Application
    Filed: August 6, 2015
    Publication date: September 8, 2016
    Inventors: Myungjoon KWACK, Gyungock KIM, Jaegyu PARK, Ki Seok JANG, Jiho JOO
  • Publication number: 20160211402
    Abstract: Provided is a photodetector including a substrate, a first doped region on the substrate, a second doped region having a ring structure, wherein the second doped region is provided in the substrate, surrounds the first doped region and is horizontally spaced apart from a side of the first doped region, an optical absorption layer on the first doped region, a contact layer on the optical absorption layer, a first electrode on the contact layer, and a second electrode on the second doped region.
    Type: Application
    Filed: July 29, 2015
    Publication date: July 21, 2016
    Inventors: Jiho JOO, Gyungock KIM, Myungjoon KWACK, Sang Hoon KIM, Sun Ae KIM, In Gyoo KIM, Jaegyu PARK, Jin Hyuk OH, Ki Seok JANG
  • Patent number: 9389455
    Abstract: The present invention relates to a pressure sensitive adhesive composition, a polarizer and a liquid crystal display device. The present invention may provide a pressure sensitive adhesive which can have excellent stress relaxation characteristic to effectively inhibit light leakage by dimension change of optical films such as polarizing plates. In addition, a pressure sensitive adhesive having excellent physical properties such as adhesion durability and workability may be provided.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: July 12, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Ki Seok Jang, Suk Ky Chang, Min Soo Park, Se Woo Yang
  • Patent number: 9231372
    Abstract: Provided is a method of fabricating a semiconductor laser. The method includes: providing a semiconductor substrate including a first region and a second region; forming a silicon single crystal layer in the second region of the semiconductor substrate by using a selective epitaxial growth process; forming an optical coupler by using the silicon single crystal layer; and forming a laser core structure including a germanium single crystal layer in the first region of the semiconductor substrate by using a selective epitaxial growth process.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: January 5, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: In Gyoo Kim, Sang Hoon Kim, Jaegyu Park, Gyungock Kim, Ki Seok Jang