Patents by Inventor Kie Ueda

Kie Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070007344
    Abstract: In an RFID (radio frequency identification) tag comprising an antenna formed of a conductive paste containing conductive filler like silver flakes on a base member, and an RFID chip connected to the antenna, the present invention cures a pattern of the antenna formed of the conductive paste, and then connects the RFID chip to the antenna with thermoplastic resin contained in the conductive paste by heating bump electrodes of the RFID chip in contact with the antenna. According to the present invention, Since the bump electrodes of the RFID chip and the antenna are connected to each other and establish sufficient electrical conduction therebetween without providing an anisotropic conductive sheet or the like therebetween, a highly reliable RFID tag is supplied at a low cost.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 11, 2007
    Inventors: Kosuke Inoue, Hiroshi Homma, Hitoshi Odashima, Naoya Kanda, Kie Ueda
  • Patent number: 6589802
    Abstract: The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: July 8, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Toyoki Asada, Yuji Fujita, Kie Ueda, Naoya Kanda, Mari Matsuyoshi