Patents by Inventor Kimiko Koiwa

Kimiko Koiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10988855
    Abstract: A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus (1) has an anode (12) and a pair of cathodes (13X) (13Y) which are provided in a plating bathtub (11); a plating power source (14) to supply an electric current between the anode (12) and the pair of cathodes (13X) (13Y); and a feedback circuit (21) to have an electrode potential of a first cathode (13X) equal to an electrode potential of a second cathode (13Y) while a summation of electric currents flowing through the pair of cathodes (13X) (13Y) is kept constant.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 27, 2021
    Assignee: YAMAMOTO-MS Co., Ltd.
    Inventors: Wataru Yamamoto, Kimiko Koiwa, Katsunori Akiyama, Masazumi Ishiguro, Yoshiaki Hoshino
  • Publication number: 20190352793
    Abstract: A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus (1) has an anode (12) and a pair of cathodes (13X) (13Y) which are provided in a plating bathtub (11); a plating power source (14) to supply an electric current between the anode (12) and the pair of cathodes (13X) (13Y); and a feedback circuit (21) to have an electrode potential of a first cathode (13X) equal to an electrode potential of a second cathode (13Y) while a summation of electric currents flowing through the pair of cathodes (13X) (13Y) is kept constant.
    Type: Application
    Filed: December 28, 2016
    Publication date: November 21, 2019
    Inventors: Wataru YAMAMOTO, Kimiko KOIWA, Katsunori AKIYAMA, Masazumi ISHIGURO, Yoshiaki HOSHINO
  • Publication number: 20160230285
    Abstract: A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a through portion (45) from which the plated object (W) is exposed and which stores a plating solution; and an anode member (6) that is stacked on the spacer (4) via a second seal member (3) in an annular shape surrounding the through portion (45), and has an anode layer (62) arranged to face the plated object (W) which is exposed from the through portion (45).
    Type: Application
    Filed: July 31, 2014
    Publication date: August 11, 2016
    Applicants: WASEDA University, YAMAMOTO-MS CO., LTD.
    Inventors: Wataru Yamamoto, Kimiko Koiwa, Takayuki HOMMA, Masahiro YANAGISAWA, Mikiko Saito, Tomoyuki YAMAMOTO