Patents by Inventor Kimio Nakamura

Kimio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070137025
    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.
    Type: Application
    Filed: February 23, 2006
    Publication date: June 21, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kubota, Kenji Kobae, Kimio Nakamura
  • Publication number: 20070137026
    Abstract: A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
    Type: Application
    Filed: March 29, 2006
    Publication date: June 21, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kubota, Kenji Kobae, Kimio Nakamura
  • Publication number: 20070141825
    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
    Type: Application
    Filed: February 23, 2006
    Publication date: June 21, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kubota, Kenji Kobae, Kimio Nakamura
  • Publication number: 20070080190
    Abstract: When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.
    Type: Application
    Filed: February 17, 2006
    Publication date: April 12, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Takayoshi Matsumura, Kenji Kobae, Norio Kainuma, Kimio Nakamura
  • Publication number: 20070041119
    Abstract: To reduce background light generated in a circumference of a scatterer in a head for a thermally assisted magnetic recording device using a scatterer having conductivity as an optical near-field generating element, a coil for generating a magnetic field is placed on a bottom portion of a slider, and an optical near-field generating element is placed in an inside of the coil. At this time, an inner diameter of the coil is set not larger than a wavelength of incident light, an interval between leader lines each for conducting an electric current to the coil is set not larger than a half of the wavelength of the light, and the coil for generating the magnetic field is caused to function as a shield for suppressing the background light.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 22, 2007
    Inventors: Takuya Matsumoto, Kimio Nakamura, Yoshio Takahashi
  • Publication number: 20060221482
    Abstract: In order to prevent deterioration of floating characteristics of a slider due to deformation of a slider floating surface by thermal expansion of a coil, the followings are performed. A recessed portion is formed in a part of the slider, and a device for generating an optical near-field and the coil for generating a magnetic field are formed in the recessed portion. The optical near-field generation device is formed on a surface facing a recording medium, and the magnetic field application coil is formed on an upper surface of the recessed portion. The optical near-field generation device and the magnetic field application coil are respectively exposed to the surface.
    Type: Application
    Filed: January 30, 2006
    Publication date: October 5, 2006
    Inventors: Takuya Matsumoto, Kimio Nakamura
  • Publication number: 20060099809
    Abstract: A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.
    Type: Application
    Filed: February 28, 2005
    Publication date: May 11, 2006
    Inventors: Norio Kainuma, Hidehiko Kira, Kenji Kobae, Takayoshi Matsumura, Kimio Nakamura
  • Patent number: 6930846
    Abstract: A magnetic recording apparatus suitable for high-density and high-frequency magnetic recording includes a recording head to the coil of which a recording current is supplied, the recording current having a waveform such that the conducting time length is shorter than the time length of a recording pattern.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: August 16, 2005
    Assignee: Hitachi, Ltd.
    Inventor: Kimio Nakamura
  • Publication number: 20040257688
    Abstract: A magnetic recording apparatus suitable for high-density and high-frequency magnetic recording includes a recording head to the coil of which a recording current is supplied, the recording current having a waveform such that the conducting time length is shorter than the time length of a recording pattern.
    Type: Application
    Filed: October 28, 2003
    Publication date: December 23, 2004
    Applicant: Hitachi., Ltd.
    Inventor: Kimio Nakamura
  • Patent number: 6744249
    Abstract: A method and instrument for measuring, with a high spatial resolution, a magnetic or electric field that varies repeatedly at high speed. An electron beam is deflected by passage through a magnetic or electric field to be measured and is allowed to pass through a deflection electrode to thereby be deflected in a direction perpendicular to the magnetic or electric field to be measured. A track of the deflected electron beam is detected by a two-dimensional sensor, and a waveform or pattern is displayed wherein a time base and an axis of the magnetic field to be measured are orthogonal to each other.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: June 1, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Suzuki, Tomokazu Shimakura, Kimio Nakamura
  • Patent number: 6683823
    Abstract: A method for reproducing information on a recording medium includes irradiating electromagnetic energy or light to the recording medium from one side with respect to the recording medium, applying a recording magnetic field to an electromagnetic energy or light irradiated position on the recording medium from the one side of irradiating electromagnetic energy or light, and detecting magnetic leakage flux emerging from the recording medium from the one side of irradiating electromagnetic energy or light.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: January 27, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hideki Saga, Hiroaki Nemoto, Hirofumi Sukeda, Masahiko Takahashi, Kimio Nakamura, Yohji Maruyama, Hiroshi Ide, Takehiko Hamaguchi
  • Publication number: 20030123333
    Abstract: A method for reproducing information on a recording medium includes irradiating electromagnetic energy or light to the recording medium from one side with respect to the recording medium, applying a recording magnetic field to an electromagnetic energy or light irradiated position on the recording medium from the one side of irradiating electromagnetic energy or light, and detecting magnetic leakage flux emerging from the recording medium from the one side of irradiating electromagnetic energy or light.
    Type: Application
    Filed: December 17, 2002
    Publication date: July 3, 2003
    Inventors: Hideki Saga, Hiroaki Nemoto, Hirofumi Sukeda, Masahiko Takahashi, Kimio Nakamura, Yohji Maruyama, Hiroshi Ide, Takehiko Hamaguchi
  • Patent number: 6566287
    Abstract: A non-woven fabric having such a structure that fine fibers having a small fineness are entangled with one another and a sheet obtained by impregnating the non-woven fabric with an elastic polymer satisfy the following requirements: the fine fibers should be obtained by splitting a strippable and splittable composite short fiber comprising at least two components; the fine fibers should have a monofilament size of 0.01 to 0.5 denier; the fine fibers should form a fine non-woven fabric structure that they are entangled with one another at random; the apparent density should be 0.18 to 0.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: May 20, 2003
    Assignees: Teijin Limited, Daiwabo Co., Ltd.
    Inventors: Masahisa Mimura, Hideki Nitta, Nobuo Ohkawa, Kimio Nakamura, Yoshiji Usui, Hiroji Wakisaka, Akihiro Imoto
  • Patent number: 6560168
    Abstract: An information recording apparatus using a recording medium which holds information by reversed magnetic domains on a perpendicular magnetic recording film includes an irradiation unit for applying electromagnetic energy or light onto the recording medium, and a magnetic flux detection unit for detecting magnetic leakage flux emerging from the recording medium, the magnetic flux detection unit being disposed on the same side as the irradiation unit with respect to the recording medium. As a result, both side recording of the recording medium can be conducted.
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: May 6, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hideki Saga, Hiroaki Nemoto, Hirofumi Sukeda, Masahiko Takahashi, Kimio Nakamura, Yohji Maruyama, Hiroshi Ide, Takehiko Hamaguchi
  • Publication number: 20030042899
    Abstract: A method and instrument for measuring, with a high spatial resolution, a magnetic or electric field that varies repeatedly at high speed. An electron beam is deflected by passage through a magnetic or electric field to be measured and is allowed to pass through a deflection electrode to thereby be deflected in a direction perpendicular to the magnetic or electric field to be measured. A track of the deflected electron beam is detected by a two-dimensional sensor, and a waveform or pattern is displayed wherein a time base and an axis of the magnetic field to be measured are orthogonal to each other.
    Type: Application
    Filed: May 14, 2002
    Publication date: March 6, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Hiroshi Suzuki, Tomokazu Shimakura, Kimio Nakamura
  • Patent number: 6304527
    Abstract: A pad for controlling the state of contact or flying of a slider with or to an information-recording medium and a probe for exciting near-field light having a small spot size are mounted on the slider and the pad is near to the probe. Semiconductor laser light focused by an objective lens is converted into near-field light having a small spot size near the top of the probe for exciting near-field light. The slider travels at a height of several tens nm to a recording medium substrate and information is recorded or read out on or from the information-recording medium formed on the recording medium substrate.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: October 16, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kenchi Ito, Sumio Hosaka, Masaru Muranishi, Kimio Nakamura
  • Patent number: 6298029
    Abstract: An information recording and reproducing apparatus includes an optical head having a super resolution film formed therein. The optical head includes a laser for producing an energy beam, a lens for focusing the energy beam and a super resolution film disposed in a position on which the energy beams is focused by the lens, whereby recording and reproducing of high-density information is attained.
    Type: Grant
    Filed: November 23, 1998
    Date of Patent: October 2, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Yasushi Miyauchi, Kimio Nakamura
  • Publication number: 20010001607
    Abstract: An information recording and reproducing apparatus includes an optical head having a super resolution film formed therein. The optical head includes a laser for producing an energy beam, a lens for focusing the energy beam and a super resolution film disposed in a position on which the energy beams is focused by the lens, whereby recording and reproducing of high-density information is attained.
    Type: Application
    Filed: January 18, 2001
    Publication date: May 24, 2001
    Inventors: Yasushi Miyauchi, Kimio Nakamura
  • Patent number: 5796706
    Abstract: An information recording apparatus having a light generator for emitting light as a signal of information being recorded, a probe formed of an optical fiber for physically or chemically changing a recording medium on the basis of the light, a slider coupled to the probe and maintaining the distance between the tip of the optical fiber and the recording medium to be within the radius of an aperture provided at the tip of the optical fiber when recording is made, a medium support for supporting the recording medium, and a medium driving mechanism for driving the recording medium to move.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: August 18, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Toshimichi Shintani, Ryo Imura, Kimio Nakamura, Sumio Hosaka
  • Patent number: 5181141
    Abstract: The anti-reflection optical element of the present invention achieves reduction of surface reflection by providing a multi-layered anti-reflection film directly or indirectly on an optical component made of a plastic. The anti-reflection optical element of the present invention uses a multi-layered anti-reflection film comprising at least one high refractive index film layer which is a film of mixed metal oxides comprising tantalum oxide, zirconium oxide and yttrium oxide deposited by evaporation process, and thereby has solved the problems of conventional anti-reflection optical elements that their optical, mechanical and chemical properties are deteriorated with the lapse of time.
    Type: Grant
    Filed: February 24, 1992
    Date of Patent: January 19, 1993
    Assignee: Hoya Corporation
    Inventors: Koji Sato, Tokio Suzuki, Hajime Kamiya, Kimio Nakamura, Masahisa Kosaka, Tetsuo Ohsora