Abstract: The invention is concerned with a method and an apparatus for working a clad material used as a reed frame for a flat package type integrated circuit. When metal foils of a predetermined size is superimposed at a predetermined position on a strip-like material, press contacted and rolled to produce a continuous clad material, and reference holes are bored in the clad material, not only the relative position between the reference holes but also the relative position between the reference holes and the metal foils previously applied to the clad material may be set accurately. Even if the pitch distances between the reference holes provided in the clad material differ from one another, press working by the metal mold may be continuously performed using these reference holes.