Patents by Inventor Kiyonobu Ida

Kiyonobu Ida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210017037
    Abstract: The present invention manufactures titanium oxide particles that have a small degree of aggregation (size of aggregate particle diameter relative to primary particle diameter) and are not readily sintered by heating. The present invention has: a step in which an alkali and a solution including a carboxylic acid and a titanium (oxy)chloride are mixed, and the titanium (oxy)chloride is hydrolyzed by neutralization; and a step in which, after the hydrolysis by neutralization, the solution is heated to a temperature of 80° C. or more and 110° C. or less, and the titanium (oxy)chloride remaining in the solution is hydrolyzed by heating.
    Type: Application
    Filed: March 27, 2019
    Publication date: January 21, 2021
    Inventors: Masanori TOMONARI, Kiyonobu IDA, Takuya HOSOKAWA
  • Patent number: 10507524
    Abstract: The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: December 17, 2019
    Assignee: ISHIHARA SANGYO KAISHA, LTD.
    Inventors: Kiyonobu Ida, Mitsuru Watanabe
  • Patent number: 10071419
    Abstract: A dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number wherein the difference (amine number?acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number wherein the difference (amine number?acid number) is 0 to 50, into an organic solvent. The dispersion maintains dispersion stability of the metallic copper particles for a long time, is suitable for inkjet printing and spray coating and can be used to make microelectrodes and circuit wiring patterns.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: September 11, 2018
    Assignee: ISHIHARA SANGYO KAISHA, LTD.
    Inventors: Masanori Tomonari, Kiyonobu Ida
  • Publication number: 20170252801
    Abstract: Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300° C.; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and/or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass % of gelatin and/or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100° C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300° C. under a nitrogen atmosphere of 1×10-2 ?·cm or less.
    Type: Application
    Filed: August 26, 2015
    Publication date: September 7, 2017
    Inventors: Kiyonobu IDA, Mitsuru WATANABE, Masanori TOMONARI
  • Publication number: 20160167130
    Abstract: The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g.
    Type: Application
    Filed: July 24, 2014
    Publication date: June 16, 2016
    Inventors: Kiyonobu IDA, Mitsuru WATANABE
  • Publication number: 20110155432
    Abstract: Disclosed is a dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number such that the difference therebetween (amine number?acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number such that the difference therebetween (amine number?acid number) is 0 to 50, into an organic solvent.
    Type: Application
    Filed: August 28, 2009
    Publication date: June 30, 2011
    Inventors: Masanori Tomonari, Kiyonobu Ida