Patents by Inventor Kiyoshi Fujihara
Kiyoshi Fujihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230059013Abstract: A light source module includes a first semiconductor laser element hermetically sealed, a second semiconductor laser element hermetically sealed, and firth to fourth optical elements. A first laser beam prior to reaching the first optical element has divergence angle ?fd1 in a direction along a second optical axis and divergence angle ?sd1 in a direction along a third optical axis, and satisfy 90°>?fd1>?sd1>0°. Divergence angle ?fd12 of a first laser beam in the direction along the second optical axis decreases from divergence angle ?fd1, the first laser beam having exited the first optical element. A component of a first laser beam in the direction along the second optical axis is collimated, the first laser beam having exited the second optical element. The same applies to the second semiconductor laser element.Type: ApplicationFiled: November 8, 2022Publication date: February 23, 2023Inventors: Masayuki HATA, Kazuhiko YAMANAKA, Kiyoshi FUJIHARA, Shinji YOSHIDA
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Patent number: 11035280Abstract: A CO2 trapping device mounted in a hybrid vehicle, provided with a branch passage branched from an exhaust passage, a CO2 trapping part provided at the branch passage and trapping CO2 in inflowing exhaust gas, a cooling part using electric power of the battery to cool the CO2 trapping part, a flow controlling part controlling an amount of flow of the exhaust gas flowing into the branch passage, and a CO2 trapping control part controlling the cooling part and the flow controlling part, the CO2 trapping control part controlling the flow controlling part so as to make the cooling part stop cooling and to shut off the flow of the exhaust gas to the CO2 trapping part when a charging rate of the battery becomes a predetermined SOC threshold value or less.Type: GrantFiled: May 28, 2020Date of Patent: June 15, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kiyoshi Fujihara, Kouseki Sugiyama, Hiroshi Ohtsuki, Daiki Yokoyama, Yushi Seki
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Publication number: 20200400058Abstract: A CO2 trapping device mounted in a hybrid vehicle, provided with a branch passage branched from an exhaust passage, a CO2 trapping part provided at the branch passage and trapping CO2 in inflowing exhaust gas, a cooling part using electric power of the battery to cool the CO2 trapping part, a flow controlling part controlling an amount of flow of the exhaust gas flowing into the branch passage, and a CO2 trapping control part controlling the cooling part and the flow controlling part, the CO2 trapping control part controlling the flow controlling part so as to make the cooling part stop cooling and to shut off the flow of the exhaust gas to the CO2 trapping part when a charging rate of the battery becomes a predetermined SOC threshold value or less.Type: ApplicationFiled: May 28, 2020Publication date: December 24, 2020Inventors: Kiyoshi FUJIHARA, Kouseki SUGIYAMA, Hiroshi OHTSUKI, Daiki YOKOYAMA, Yushi SEKI
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Patent number: 10641150Abstract: An exhaust treatment catalyst (5) is arranged in the engine exhaust passage, and hydrogen generated in the reformer (6) is supplied through the hydrogen supply pipe (13) to the inside of the engine exhaust passage upstream of the exhaust treatment catalyst (5). Heat exchange fins (15) for heat exchange with exhaust gas flowing through the inside of the engine exhaust passage are formed on the outer circumferential surface of the hydrogen supply pipe (13) inserted inside the engine exhaust passage.Type: GrantFiled: February 11, 2019Date of Patent: May 5, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasumasa Notake, Hiromasa Nishioka, Keishi Takada, Tetsuya Sakuma, Kiyoshi Fujihara
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Publication number: 20190316505Abstract: An exhaust treatment catalyst (5) is arranged in the engine exhaust passage, and hydrogen generated in the reformer (6) is supplied through the hydrogen supply pipe (13) to the inside of the engine exhaust passage upstream of the exhaust treatment catalyst (5). Heat exchange fins (15) for heat exchange with exhaust gas flowing through the inside of the engine exhaust passage are formed on the outer circumferential surface of the hydrogen supply pipe (13) inserted inside the engine exhaust passage.Type: ApplicationFiled: February 11, 2019Publication date: October 17, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasumasa NOTAKE, Hiromasa NISHIOKA, Keishi TAKADA, Tetsuya SAKUMA, Kiyoshi FUJIHARA
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Patent number: 8866279Abstract: A semiconductor device includes: a lead frame; a semiconductor element held by the lead frame; a frame body which is formed on the lead frame to surround the semiconductor element, cover a side surface of the lead frame, and expose a bottom surface of the lead frame; and a protective resin filling a region surrounded by the frame body. The lead frame includes an uneven part formed in a section which is part of an upper surface of the lead frame, and is covered with the frame body.Type: GrantFiled: January 22, 2013Date of Patent: October 21, 2014Assignee: Panasonic CorporationInventors: Yuu Hasegawa, Tooru Aoyagi, Kenichi Ito, Toshiyuki Fukuda, Kiyoshi Fujihara, Masanori Nishino
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Patent number: 8669571Abstract: A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.Type: GrantFiled: July 4, 2011Date of Patent: March 11, 2014Assignee: Panasonic CorporationInventors: Akihiko Murai, Masahiro Kume, Akiko Nakamura, Tooru Aoyagi, Kiyoshi Fujihara
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Patent number: 8525307Abstract: A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.Type: GrantFiled: July 27, 2011Date of Patent: September 3, 2013Assignee: Panasonic CorporationInventors: Kenichi Ito, Shigehisa Oonakahara, Yoshikazu Tamura, Kiyoshi Fujihara
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Publication number: 20130075776Abstract: A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.Type: ApplicationFiled: July 4, 2011Publication date: March 28, 2013Applicant: PANASONIC CORPORATIONInventors: Akihiko Murai, Masahiro Kume, Akiko Nakamura, Tooru Aoyagi, Kiyoshi Fujihara
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Publication number: 20120305973Abstract: To provide a light emitting device which emits high-luminance, uniform white light with reduced variations in luminance, a light emitting element 101 is mounted on a substrate 105 and covered with a wavelength conversion layer 106 of uniform thickness, and then a light scattering layer 107 made of a translucent resin containing a light reflecting material is formed. As the light scattering layer 107, a high density region 109 in which a density of the light reflecting material is high is formed immediately above a central part of a light emitting surface of the light emitting element 101, and a low density region 110 in which the density of the light reflecting material is low is formed around a region immediately above the central part of the light emitting surface of the light emitting element. A translucent resin layer 108 is formed on the light scattering layer 107.Type: ApplicationFiled: January 25, 2011Publication date: December 6, 2012Inventors: Yoshihiko Chosa, Takashi Kuwaharada, Kiyoshi Fujihara, Kenichi Koya
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Publication number: 20120025361Abstract: A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.Type: ApplicationFiled: July 27, 2011Publication date: February 2, 2012Inventors: Kenichi ITO, Shigehisa Oonakahara, Yoshikazu Tamura, Kiyoshi Fujihara
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Patent number: 7440386Abstract: A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.Type: GrantFiled: October 20, 2005Date of Patent: October 21, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaya Tateyanagi, Masanori Minamio, Shigeki Okamoto, Kiyoshi Fujihara
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Patent number: 7280573Abstract: The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.Type: GrantFiled: July 5, 2006Date of Patent: October 9, 2007Assignee: Matsushita Electirc Industrial Co., Ltd.Inventors: Kiyoshi Fujihara, Masaya Tateyanagi, Shigeki Okamoto
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Patent number: 7264407Abstract: An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.Type: GrantFiled: November 4, 2004Date of Patent: September 4, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shigeki Okamoto, Masaya Tateyanagi, Masanori Mimamio, Kiyoshi Fujihara, Hiroyuki Ishida, Toshiyuki Fukuda
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Publication number: 20070008862Abstract: The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.Type: ApplicationFiled: July 5, 2006Publication date: January 11, 2007Inventors: Kiyoshi Fujihara, Masaya Tateyanagi, Shigeki Okamoto
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Publication number: 20060092812Abstract: A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.Type: ApplicationFiled: October 20, 2005Publication date: May 4, 2006Applicant: Matsushita Electric Industrial Co., LTD.Inventors: Masaya Tateyanagi, Masanori Minamio, Shigeki Okamoto, Kiyoshi Fujihara
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Publication number: 20060078021Abstract: The present invention provides a semiconductor laser unit which realizes efficient heat dissipation, reduction in size, high-density integration of optical elements, prevention of a light-receiving element from being polluted with dust, and simple structure for easy assembly.Type: ApplicationFiled: October 12, 2005Publication date: April 13, 2006Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kiyoshi Fujihara, Masanori Minamio, Masaya Tateyanagi, Shigeki Okamoto
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Publication number: 20050152634Abstract: An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.Type: ApplicationFiled: November 4, 2004Publication date: July 14, 2005Inventors: Shigeki Okamoto, Masaya Tateyanagi, Masanori Mimamio, Kiyoshi Fujihara, Hiroyuki Ishida, Toshiyuki Fukuda
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Publication number: 20050094694Abstract: An object of the present invention is to provide a semiconductor laser device that has a simple structure that can easily be constructed, and can dissipate heat easily, and can improve its functionality and realize miniaturizing concurrently. The semiconductor laser device composes a metal plate 100 that is substantially the same as the bigger one of the widths of the silicon substrate 120 and the flexible sheet 130, a semiconductor laser element 110, a silicon substrate 120 into which a light detection circuit and a signal processing circuit are integrated, a flexible sheet 130, a wire 140 and an optical element 150. The flexible sheet 130 is divided into two on the metal plate 100, and the two divided flexible sheet 130 are positioned face to face sandwiching the silicon substrate 120.Type: ApplicationFiled: November 3, 2004Publication date: May 5, 2005Inventors: Kiyoshi Fujihara, Akira Ueno, Yoshiaki Matsuda, Hideyuki Nakanishi
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Patent number: 6822997Abstract: The invention provides a semiconductor laser module and an optical transmission system, with which noise caused by light reflected back from a transmission path can be suppressed. The semiconductor laser module, includes a package having a window, a semiconductor laser chip outputting light, a lens that is optically designed such that it couples the light that is output by the semiconductor laser chip into an optical transmission path, an optical isolator that is disposed between the lens and the window, a temperature control mechanism for keeping temperature of these components constant, and a tubular ferrule that is holds and covers the optical transmission path. The semiconductor laser chip, the lens, the optical isolator, and the temperature control mechanism are arranged inside the package. A polarizer is arranged at an end face of the ferrule on the side of the package, such that the polarizer matches a polarization plane of the light that is emitted through the window of the package.Type: GrantFiled: June 28, 2002Date of Patent: November 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kiyoshi Fujihara, Jun Ohya