Patents by Inventor Kiyoshi Otsuka
Kiyoshi Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230242079Abstract: A raindrop detection device includes: a front monitoring camera for photographing a front of a vehicle through a windshield of the vehicle; a raindrop detection camera for photographing a raindrop adhering to the windshield; and an electronic control unit disposed away from the windshield, the front monitoring camera, and the raindrop detection camera, performing an image processing on an image data of a front image from the front monitoring camera, and performing an image processing on an image data of a windshield image from the raindrop detection camera.Type: ApplicationFiled: April 10, 2023Publication date: August 3, 2023Inventors: KEIGO HIKIDA, TAKAMITSU OKURA, KIYOSHI OTSUKA, YOSHIHISA BANNO, KAZUMASA NAKAJIMA, MASAAKI INOGUCHI
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Patent number: 10527498Abstract: A sensor device includes a sensor element detecting a temperature of an attachment member to which the sensor device is attached. The sensor device includes a flexible substrate that includes a base having a first surface and a second surface and made of an electrically insulating material, and a land disposed adjacent to the first surface and electrically connected to the sensor element. The sensor device further includes: a rigid member adhered to the second surface; a flexible member that has a thermal conductivity and a flexibility higher than those of the base, is stacked on the rigid member to be in contact with the rigid member on a side opposite to the flexible substrate, and is to be in contact with the attachment member in an attached state; and a pressing member that presses the flexible substrate toward the attachment member in the attached state.Type: GrantFiled: May 24, 2016Date of Patent: January 7, 2020Assignee: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Junichi Ishikawa, Hirotaka Kurozaki
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Publication number: 20180156670Abstract: A sensor device includes a sensor element detecting a temperature of an attachment member to which the sensor device is attached. The sensor device includes a flexible substrate that includes a base having a first surface and a second surface and made of an electrically insulating material, and a land disposed adjacent to the first surface and electrically connected to the sensor element. The sensor device further includes: a rigid member adhered to the second surface; a flexible member that has a thermal conductivity and a flexibility higher than those of the base, is stacked on the rigid member to be in contact with the rigid member on a side opposite to the flexible substrate, and is to be in contact with the attachment member in an attached state; and a pressing member that presses the flexible substrate toward the attachment member in the attached state.Type: ApplicationFiled: May 24, 2016Publication date: June 7, 2018Inventors: Kiyoshi OTSUKA, Junichi ISHIKAWA, Hirotaka KUROZAKI
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Patent number: 9528930Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops.Type: GrantFiled: January 16, 2014Date of Patent: December 27, 2016Assignee: DENSO CORPORATIONInventors: Junichi Ishikawa, Jun Tarui, Kiyoshi Otsuka, Makiko Sugiura, Takahiko Yoshida, Tomohide Ariki
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Publication number: 20150346089Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops.Type: ApplicationFiled: January 16, 2014Publication date: December 3, 2015Inventors: Junichi ISHIKAWA, Jun TARUI, Kiyoshi OTSUKA, Makiko SUGIURA, Takahiko YOSHIDA, Tomohide ARIKI
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Patent number: 9166081Abstract: An optical sensor includes a light receiving portion, a definition portion, and a selection portion. The definition portion defines an incident angle of an incident light that enters the light receiving portion. The selection portion selects a wavelength of the incident light that enters the light receiving portion. The definition portion has a light shielding film disposed above the light receiving portion, and an opening formed in the light shielding film. The selection portion has a slit formed in the light shielding film disposed within a region surrounded by the opening.Type: GrantFiled: September 5, 2013Date of Patent: October 20, 2015Assignee: DENSO CORPORATIONInventors: Makiko Sugiura, Takahiko Yoshida, Kiyoshi Otsuka
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Publication number: 20150276615Abstract: An optical sensor is attached to a transparent board and includes: a light emitting element that applies light to the transparent board; a plurality of light receiving elements that receive light from the light emitting element, reflected by the transparent board; and a detection unit that detects the amount of rainfall based on output signals of the light receiving elements. The light emitting element applies light to one irradiation region in the transparent board. The light receiving elements correspond to the one irradiation region and the detection unit detects the amount of rainfall based on output signals of the light receiving elements corresponding to the one irradiation region.Type: ApplicationFiled: November 28, 2013Publication date: October 1, 2015Inventors: Makiko Sugiura, Kiyoshi Otsuka, Tomohide Ariki
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Publication number: 20150179830Abstract: An optical sensor includes a light receiving portion, a definition portion, and a selection portion. The definition portion defines an incident angle of an incident light that enters the light receiving portion. The selection portion selects a wavelength of the incident light that enters the light receiving portion. The definition portion has a light shielding film disposed above the light receiving portion, and an opening formed in the light shielding film. The selection portion has a slit formed in the light shielding film disposed within a region surrounded by the opening.Type: ApplicationFiled: September 5, 2013Publication date: June 25, 2015Inventors: Makiko Sugiura, Takahiko Yoshida, Kiyoshi Otsuka
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Patent number: 8028584Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.Type: GrantFiled: July 29, 2008Date of Patent: October 4, 2011Assignee: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Yasuaki Makino, Tsuyoshi Fukada, Inao Toyoda, Naoki Kakoiyama
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Patent number: 7856890Abstract: In a manufacturing method of a pressure detector, a first member that includes a sensing portion for outputting an electric signal in accordance with a pressure, a second member that includes a pressure-receiving diaphragm, and a pressure transmission member are prepared. The pressure transmission member is disposed between the sensing portion and the pressure-receiving diaphragm and the first member and the second member are welded in a state where the pressure is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member. One of the first member and the second member are strained so that a preliminary load, which is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member in a state where no external pressure is applied to the pressure-receiving diaphragm, meets a predetermined value.Type: GrantFiled: July 22, 2008Date of Patent: December 28, 2010Assignee: DENSO CORPORATIONInventors: Hiroshige Matsui, Kiyoshi Otsuka
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Patent number: 7559247Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.Type: GrantFiled: July 12, 2007Date of Patent: July 14, 2009Assignee: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
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Publication number: 20090084191Abstract: In a manufacturing method of a pressure detector, a first member that includes a sensing portion for outputting an electric signal in accordance with a pressure, a second member that includes a pressure-receiving diaphragm, and a pressure transmission member are prepared. The pressure transmission member is disposed between the sensing portion and the pressure-receiving diaphragm and the first member and the second member are welded in a state where the pressure is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member. One of the first member and the second member are strained so that a preliminary load, which is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member in a state where no external pressure is applied to the pressure-receiving diaphragm, meets a predetermined value.Type: ApplicationFiled: July 22, 2008Publication date: April 2, 2009Applicant: DENSO CORPORATIONInventors: Hiroshige Matsui, Kiyoshi Otsuka
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Publication number: 20090049921Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.Type: ApplicationFiled: July 29, 2008Publication date: February 26, 2009Applicant: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Yasuaki Makino, Tsuyoshi Fukada, Inao Toyoda, Naoki Kakoiyama
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Patent number: 7404330Abstract: A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.Type: GrantFiled: March 13, 2007Date of Patent: July 29, 2008Assignee: DENSO CORPORATIONInventors: Hiroshi Uchigashima, Kiyoshi Otsuka, Osamu Itoh
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Publication number: 20080148860Abstract: A pressure sensor has a polygonal cylindrical stem having a bottom wall and a plurality of side walls including a remarked side wall, a diaphragm constituted by a portion of the remarked side wall, and a sensing element attached to the remarked side wall. Each of the side walls extends along a longitudinal direction of the stem so as to face a hollow of the stem. A center axis of the hollow along the longitudinal direction is shifted from a center axis of the stem toward the remarked side wall so as to differentiate a thickness of the remarked side wall from those of the other side walls. The diaphragm is deformable in response to a pressure of a medium introduced in the hollow. The sensing element senses a deformation of the diaphragm and outputs a sensing signal indicating the deformation of the diaphragm.Type: ApplicationFiled: November 29, 2007Publication date: June 26, 2008Applicant: DENSO CORPORATIONInventors: Yoshifumi Murakami, Kiyoshi Otsuka
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Publication number: 20080047354Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.Type: ApplicationFiled: July 12, 2007Publication date: February 28, 2008Applicant: DENSO CORPORATIONInventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
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Patent number: 7300643Abstract: With a method producing hydrogen by making iron or iron oxide contact water, water vapor, or a gas including water vapor, a hydrogen generating medium, which has a high hydrogen generation reaction rate and is resistant to a repetition of oxidation-reduction without degrading its activity, is provided by adding a different metal (such as Ti, Zr, V, Nb, Cr, Mo, Al, Ga, Mg, Sc, Ni, Cu, etc.) other than the iron to the iron or the iron oxide.Type: GrantFiled: April 1, 2002Date of Patent: November 27, 2007Assignees: Uchiya Thermostat Co., Ltd., Kiyoshi OtsukaInventors: Kiyoshi Otsuka, Sakae Takenaka, Kiyozumi Nakamura, Kazuyuki Iizuka
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Publication number: 20070220989Abstract: A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.Type: ApplicationFiled: March 13, 2007Publication date: September 27, 2007Applicant: DENSO CORPORATIONInventors: Hiroshi Uchigashima, Kiyoshi Otsuka, Osamu Itoh
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Patent number: 7231830Abstract: A pressure sensor includes a connector case having a recess, in which a sensor chip is contained and an oil is filled. The recess filled with the oil is sealed by a metal diaphragm. The sensor chip for outputting signals and the circuit chip having a processing circuit for processing the signals from the sensor chip, are stacked. That is, the circuit chip is provided between a bottom wall surface of the recess and the sensor chip. The processing circuit is covered by at least a part of the sensor chip, and the processing circuit of the circuit chip is arranged at a place where the processing circuit can avoid contact with the oil. Because the processing circuit of the circuit chip is not exposed to the oil, the processing circuit can be effectively restricted from being charged due to a polarization of the oil.Type: GrantFiled: September 6, 2005Date of Patent: June 19, 2007Assignee: DENSO CorporationInventors: Kiyoshi Otsuka, Inao Toyoda
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Publication number: 20060235245Abstract: Provided is a process for industrially advantageously producing an oxygen-bearing compound (e.g., an alcohol, a diol, a polyol, or a ketone) through oxidation of an alkane or an alcohol, which process requires no treatment for separation/removal of a catalyst and causes no equipment corrosion. Specifically, there are provided a process for producing an oxygen-bearing compound, including oxidizing an alkane in the presence of a catalyst containing at least one element selected from among transition metal elements belonging to Groups 5 and 8 to 10 of the periodic table, wherein the oxygen-bearing compound is an alcohol, a diol, a polyol, or a ketone; and a process for producing an oxygen-bearing compound, including oxidizing an alcohol in the presence of a catalyst containing at least one element selected from among transition metal elements belonging to Groups 5 and 8 to 10 of the periodic table, wherein the oxygen-bearing compound is a diol, a polyol, or a ketone.Type: ApplicationFiled: March 6, 2006Publication date: October 19, 2006Applicants: Idemitsu Kosan Co., Ltd., Tokyo Institute of TechnologyInventors: Ichiro Yamanaka, Kiyoshi Otsuka