Patents by Inventor Kiyoshi Otsuka

Kiyoshi Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230242079
    Abstract: A raindrop detection device includes: a front monitoring camera for photographing a front of a vehicle through a windshield of the vehicle; a raindrop detection camera for photographing a raindrop adhering to the windshield; and an electronic control unit disposed away from the windshield, the front monitoring camera, and the raindrop detection camera, performing an image processing on an image data of a front image from the front monitoring camera, and performing an image processing on an image data of a windshield image from the raindrop detection camera.
    Type: Application
    Filed: April 10, 2023
    Publication date: August 3, 2023
    Inventors: KEIGO HIKIDA, TAKAMITSU OKURA, KIYOSHI OTSUKA, YOSHIHISA BANNO, KAZUMASA NAKAJIMA, MASAAKI INOGUCHI
  • Patent number: 10527498
    Abstract: A sensor device includes a sensor element detecting a temperature of an attachment member to which the sensor device is attached. The sensor device includes a flexible substrate that includes a base having a first surface and a second surface and made of an electrically insulating material, and a land disposed adjacent to the first surface and electrically connected to the sensor element. The sensor device further includes: a rigid member adhered to the second surface; a flexible member that has a thermal conductivity and a flexibility higher than those of the base, is stacked on the rigid member to be in contact with the rigid member on a side opposite to the flexible substrate, and is to be in contact with the attachment member in an attached state; and a pressing member that presses the flexible substrate toward the attachment member in the attached state.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: January 7, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Junichi Ishikawa, Hirotaka Kurozaki
  • Publication number: 20180156670
    Abstract: A sensor device includes a sensor element detecting a temperature of an attachment member to which the sensor device is attached. The sensor device includes a flexible substrate that includes a base having a first surface and a second surface and made of an electrically insulating material, and a land disposed adjacent to the first surface and electrically connected to the sensor element. The sensor device further includes: a rigid member adhered to the second surface; a flexible member that has a thermal conductivity and a flexibility higher than those of the base, is stacked on the rigid member to be in contact with the rigid member on a side opposite to the flexible substrate, and is to be in contact with the attachment member in an attached state; and a pressing member that presses the flexible substrate toward the attachment member in the attached state.
    Type: Application
    Filed: May 24, 2016
    Publication date: June 7, 2018
    Inventors: Kiyoshi OTSUKA, Junichi ISHIKAWA, Hirotaka KUROZAKI
  • Patent number: 9528930
    Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: December 27, 2016
    Assignee: DENSO CORPORATION
    Inventors: Junichi Ishikawa, Jun Tarui, Kiyoshi Otsuka, Makiko Sugiura, Takahiko Yoshida, Tomohide Ariki
  • Publication number: 20150346089
    Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops.
    Type: Application
    Filed: January 16, 2014
    Publication date: December 3, 2015
    Inventors: Junichi ISHIKAWA, Jun TARUI, Kiyoshi OTSUKA, Makiko SUGIURA, Takahiko YOSHIDA, Tomohide ARIKI
  • Patent number: 9166081
    Abstract: An optical sensor includes a light receiving portion, a definition portion, and a selection portion. The definition portion defines an incident angle of an incident light that enters the light receiving portion. The selection portion selects a wavelength of the incident light that enters the light receiving portion. The definition portion has a light shielding film disposed above the light receiving portion, and an opening formed in the light shielding film. The selection portion has a slit formed in the light shielding film disposed within a region surrounded by the opening.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 20, 2015
    Assignee: DENSO CORPORATION
    Inventors: Makiko Sugiura, Takahiko Yoshida, Kiyoshi Otsuka
  • Publication number: 20150276615
    Abstract: An optical sensor is attached to a transparent board and includes: a light emitting element that applies light to the transparent board; a plurality of light receiving elements that receive light from the light emitting element, reflected by the transparent board; and a detection unit that detects the amount of rainfall based on output signals of the light receiving elements. The light emitting element applies light to one irradiation region in the transparent board. The light receiving elements correspond to the one irradiation region and the detection unit detects the amount of rainfall based on output signals of the light receiving elements corresponding to the one irradiation region.
    Type: Application
    Filed: November 28, 2013
    Publication date: October 1, 2015
    Inventors: Makiko Sugiura, Kiyoshi Otsuka, Tomohide Ariki
  • Publication number: 20150179830
    Abstract: An optical sensor includes a light receiving portion, a definition portion, and a selection portion. The definition portion defines an incident angle of an incident light that enters the light receiving portion. The selection portion selects a wavelength of the incident light that enters the light receiving portion. The definition portion has a light shielding film disposed above the light receiving portion, and an opening formed in the light shielding film. The selection portion has a slit formed in the light shielding film disposed within a region surrounded by the opening.
    Type: Application
    Filed: September 5, 2013
    Publication date: June 25, 2015
    Inventors: Makiko Sugiura, Takahiko Yoshida, Kiyoshi Otsuka
  • Patent number: 8028584
    Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: October 4, 2011
    Assignee: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Yasuaki Makino, Tsuyoshi Fukada, Inao Toyoda, Naoki Kakoiyama
  • Patent number: 7856890
    Abstract: In a manufacturing method of a pressure detector, a first member that includes a sensing portion for outputting an electric signal in accordance with a pressure, a second member that includes a pressure-receiving diaphragm, and a pressure transmission member are prepared. The pressure transmission member is disposed between the sensing portion and the pressure-receiving diaphragm and the first member and the second member are welded in a state where the pressure is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member. One of the first member and the second member are strained so that a preliminary load, which is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member in a state where no external pressure is applied to the pressure-receiving diaphragm, meets a predetermined value.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: December 28, 2010
    Assignee: DENSO CORPORATION
    Inventors: Hiroshige Matsui, Kiyoshi Otsuka
  • Patent number: 7559247
    Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: July 14, 2009
    Assignee: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
  • Publication number: 20090084191
    Abstract: In a manufacturing method of a pressure detector, a first member that includes a sensing portion for outputting an electric signal in accordance with a pressure, a second member that includes a pressure-receiving diaphragm, and a pressure transmission member are prepared. The pressure transmission member is disposed between the sensing portion and the pressure-receiving diaphragm and the first member and the second member are welded in a state where the pressure is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member. One of the first member and the second member are strained so that a preliminary load, which is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member in a state where no external pressure is applied to the pressure-receiving diaphragm, meets a predetermined value.
    Type: Application
    Filed: July 22, 2008
    Publication date: April 2, 2009
    Applicant: DENSO CORPORATION
    Inventors: Hiroshige Matsui, Kiyoshi Otsuka
  • Publication number: 20090049921
    Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 26, 2009
    Applicant: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Yasuaki Makino, Tsuyoshi Fukada, Inao Toyoda, Naoki Kakoiyama
  • Patent number: 7404330
    Abstract: A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: July 29, 2008
    Assignee: DENSO CORPORATION
    Inventors: Hiroshi Uchigashima, Kiyoshi Otsuka, Osamu Itoh
  • Publication number: 20080148860
    Abstract: A pressure sensor has a polygonal cylindrical stem having a bottom wall and a plurality of side walls including a remarked side wall, a diaphragm constituted by a portion of the remarked side wall, and a sensing element attached to the remarked side wall. Each of the side walls extends along a longitudinal direction of the stem so as to face a hollow of the stem. A center axis of the hollow along the longitudinal direction is shifted from a center axis of the stem toward the remarked side wall so as to differentiate a thickness of the remarked side wall from those of the other side walls. The diaphragm is deformable in response to a pressure of a medium introduced in the hollow. The sensing element senses a deformation of the diaphragm and outputs a sensing signal indicating the deformation of the diaphragm.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 26, 2008
    Applicant: DENSO CORPORATION
    Inventors: Yoshifumi Murakami, Kiyoshi Otsuka
  • Publication number: 20080047354
    Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
    Type: Application
    Filed: July 12, 2007
    Publication date: February 28, 2008
    Applicant: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
  • Patent number: 7300643
    Abstract: With a method producing hydrogen by making iron or iron oxide contact water, water vapor, or a gas including water vapor, a hydrogen generating medium, which has a high hydrogen generation reaction rate and is resistant to a repetition of oxidation-reduction without degrading its activity, is provided by adding a different metal (such as Ti, Zr, V, Nb, Cr, Mo, Al, Ga, Mg, Sc, Ni, Cu, etc.) other than the iron to the iron or the iron oxide.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: November 27, 2007
    Assignees: Uchiya Thermostat Co., Ltd., Kiyoshi Otsuka
    Inventors: Kiyoshi Otsuka, Sakae Takenaka, Kiyozumi Nakamura, Kazuyuki Iizuka
  • Publication number: 20070220989
    Abstract: A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 27, 2007
    Applicant: DENSO CORPORATION
    Inventors: Hiroshi Uchigashima, Kiyoshi Otsuka, Osamu Itoh
  • Patent number: 7231830
    Abstract: A pressure sensor includes a connector case having a recess, in which a sensor chip is contained and an oil is filled. The recess filled with the oil is sealed by a metal diaphragm. The sensor chip for outputting signals and the circuit chip having a processing circuit for processing the signals from the sensor chip, are stacked. That is, the circuit chip is provided between a bottom wall surface of the recess and the sensor chip. The processing circuit is covered by at least a part of the sensor chip, and the processing circuit of the circuit chip is arranged at a place where the processing circuit can avoid contact with the oil. Because the processing circuit of the circuit chip is not exposed to the oil, the processing circuit can be effectively restricted from being charged due to a polarization of the oil.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: June 19, 2007
    Assignee: DENSO Corporation
    Inventors: Kiyoshi Otsuka, Inao Toyoda
  • Publication number: 20060235245
    Abstract: Provided is a process for industrially advantageously producing an oxygen-bearing compound (e.g., an alcohol, a diol, a polyol, or a ketone) through oxidation of an alkane or an alcohol, which process requires no treatment for separation/removal of a catalyst and causes no equipment corrosion. Specifically, there are provided a process for producing an oxygen-bearing compound, including oxidizing an alkane in the presence of a catalyst containing at least one element selected from among transition metal elements belonging to Groups 5 and 8 to 10 of the periodic table, wherein the oxygen-bearing compound is an alcohol, a diol, a polyol, or a ketone; and a process for producing an oxygen-bearing compound, including oxidizing an alcohol in the presence of a catalyst containing at least one element selected from among transition metal elements belonging to Groups 5 and 8 to 10 of the periodic table, wherein the oxygen-bearing compound is a diol, a polyol, or a ketone.
    Type: Application
    Filed: March 6, 2006
    Publication date: October 19, 2006
    Applicants: Idemitsu Kosan Co., Ltd., Tokyo Institute of Technology
    Inventors: Ichiro Yamanaka, Kiyoshi Otsuka