Patents by Inventor Kiyotaka Komori
Kiyotaka Komori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11818835Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.Type: GrantFiled: February 10, 2021Date of Patent: November 14, 2023Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Hiroaki Takahashi, Kiyotaka Komori, Masaya Koyama, Jun Tochihira, Ryu Harada
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Publication number: 20230145377Abstract: A method for manufacturing a metal clad laminated plate includes hot pressing a laminated body by a double belt press method. The laminated body includes an insulating film containing the liquid crystal polymer and the metal foil lying on the insulating film. In hot pressing the laminated body, a highest heating temperature is higher than or equal to a temperature lower than a melting point of the insulating film by 5° C. and lower than or equal to a temperature higher than the melting point by 20° C. The highest heating temperature is maintained for longer than or equal to 20 seconds and shorter than or equal to 120 seconds.Type: ApplicationFiled: January 4, 2023Publication date: May 11, 2023Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masaya KOYAMA, Yusuke ITO, Yoshinori MATSUZAKI, Kiyotaka KOMORI, Hiroaki TAKAHASHI
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Publication number: 20220408568Abstract: A method includes providing a first laminate and a second laminate. The first laminate includes a first conductor layer, a first insulating layer containing polyimide, and a second conductor layer. The second laminate includes a second insulating layer containing polyimide and a third conductor layer. The method further includes: heating each of the first laminate and the second laminate under a condition including a heating temperature equal to or higher than 100° C. and a heating duration equal to or longer than half an hour; and stacking, after heating, the first laminate and the second laminate one on top of the other with a third insulating layer interposed between the second conductor layer and the second insulating layer.Type: ApplicationFiled: November 13, 2020Publication date: December 22, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tomoyuki KAWAHARA, Kiyotaka KOMORI, Masaya KOYAMA
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Publication number: 20210400810Abstract: A metal clad laminated plate is a metal clad laminated plate including: an insulating layer containing a liquid crystal polymer; and a metal foil lying on the insulating layer. The metal foil has a surface lying on the insulating layer. The surface has a mean width of profile elements (RSm) of greater than or equal to 10 ?m and less than or equal to 65 ?m. The mean width is calculated from a roughness curve obtained from a cross section of the metal clad laminated plate. The metal clad laminated plate has a plate thickness accuracy of less than ±20%. Pull strength of the metal foil from the insulating layer is greater than or equal to 0.8 N/mm.Type: ApplicationFiled: October 25, 2019Publication date: December 23, 2021Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Masaya KOYAMA, Yusuke ITO, Yoshinori MATSUZAKI, Kiyotaka KOMORI, Hiroaki TAKAHASHI
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Patent number: 11039533Abstract: A printed wiring board includes: a first insulating layer having a first surface and a second surface opposite from the first surface; a second insulating layer stacked on the first surface of the first insulating layer; and a conductor wiring interposed between the first insulating layer and the second insulating layer. The first insulating layer contains a liquid crystal polymer. The second insulating layer contains a cured product of a thermosetting composition, containing an inorganic filler and a thermosetting component, and a fibrous base member. A temperature, at which a decrease in the mass of the second insulating layer that has had its temperature increased at a temperature increase rate of 10° C./min from an initial-state temperature of 25° C. reaches 5% of its initial-state mass, is equal to or higher than 355° C.Type: GrantFiled: February 2, 2018Date of Patent: June 15, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki Takahashi, Masaya Koyama, Kiyotaka Komori, Yutaka Tashiro, Hiroki Morikawa
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Publication number: 20210176854Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.Type: ApplicationFiled: February 10, 2021Publication date: June 10, 2021Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Hiroaki TAKAHASHI, Kiyotaka KOMORI, Masaya KOYAMA, Jun TOCHIHIRA, Ryu HARADA
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Publication number: 20200346437Abstract: A metal-clad laminate includes: an insulating layer containing a liquid crystal polymer; and a metal layer stacked on the insulating layer. The insulating layer has amplitude of oscillation with a logarithmic decrement falling within the range from 0.05 to 0.30, which is measured at a melting point of the insulating layer by a rigid body pendulum type viscoelasticity measuring device.Type: ApplicationFiled: October 25, 2018Publication date: November 5, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki TAKAHASHI, Yoshinori MATSUZAKI, Masaya KOYAMA, Kiyotaka KOMORI, Yusuke ITO
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Publication number: 20200205286Abstract: A printed wiring board includes: a first insulating layer having a first surface and a second surface opposite from the first surface; a second insulating layer stacked on the first surface of the first insulating layer; and a conductor wiring interposed between the first insulating layer and the second insulating layer. The first insulating layer contains a liquid crystal polymer. The second insulating layer contains a cured product of a thermosetting composition, containing an inorganic filler and a thermosetting component, and a fibrous base member. A temperature, at which a decrease in the mass of the second insulating layer that has had its temperature increased at a temperature increase rate of 10° C./min from an initial-state temperature of 25° C. reaches 5% of its initial-state mass, is equal to or higher than 355° C.Type: ApplicationFiled: February 2, 2018Publication date: June 25, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki TAKAHASHI, Masaya KOYAMA, Kiyotaka KOMORI, Yutaka TASHIRO, Hiroki MORIKAWA
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Patent number: 10668697Abstract: Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.Type: GrantFiled: May 11, 2017Date of Patent: June 2, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masaya Koyama, Kiyotaka Komori, Hiroaki Takahashi, Yoshinori Matsuzaki, Tadashi Mori
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Publication number: 20200114623Abstract: A metal-clad laminate provided and includes: an insulating layer containing a liquid crystal polymer; and a metal layer stacked on the insulating layer. The liquid crystal polymer has a melting point within a range from 305° C. to 320° C. The liquid crystal polymer has a loss modulus whose relationship curve with respect to temperature has two points at each of which a differential quotient is 0. A difference between values of the loss modulus at the two points being 4.0×108 Pa or smaller.Type: ApplicationFiled: May 29, 2018Publication date: April 16, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki TAKAHASHI, Yoshinori MATSUZAKI, Masaya KOYAMA, Kiyotaka KOMORI, Yusuke ITO
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Patent number: 10568201Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.Type: GrantFiled: January 24, 2017Date of Patent: February 18, 2020Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Hiroaki Takahashi, Tomoyuki Aoki, Kiyotaka Komori, Jun Tochihira, Ryu Harada
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Publication number: 20190134951Abstract: Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.Type: ApplicationFiled: May 11, 2017Publication date: May 9, 2019Inventors: MASAYA KOYAMA, KIYOTAKA KOMORI, HIROAKI TAKAHASHI, YOSHINORI MATSUZAKI, TADASHI MORI
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Publication number: 20180376579Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.Type: ApplicationFiled: January 24, 2017Publication date: December 27, 2018Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Hiroaki TAKAHASHI, Tomoyuki AOKI, Kiyotaka KOMORI, Jun TOCHIHIRA, Ryu HARADA
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Publication number: 20180270945Abstract: A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.Type: ApplicationFiled: January 5, 2016Publication date: September 20, 2018Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Hiroaki TAKAHASHI, Kiyotaka KOMORI, Masaya KOYAMA, Jun TOCHIHIRA, Ryu HARADA
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Patent number: 9775239Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.Type: GrantFiled: April 7, 2015Date of Patent: September 26, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tatsuya Arisawa, Yoshihiko Nakamura, Tomoyuki Abe, Kiyotaka Komori, Syouji Hasimoto, Mitsuyoshi Nishino
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Patent number: 9730320Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.Type: GrantFiled: October 27, 2011Date of Patent: August 8, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Naoyuki Tani, Yoshito Kitagawa
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Patent number: 9718941Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 ?m; (B) aluminum oxide particles having an average particle size (D50) of 1.5 ?m or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.Type: GrantFiled: April 27, 2012Date of Patent: August 1, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takashi Matsuda, Mitsuyoshi Nishino, Kiyotaka Komori
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Publication number: 20170099731Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.Type: ApplicationFiled: April 7, 2015Publication date: April 6, 2017Inventors: TATSUYA ARISAWA, YOSHIHIKO NAKAMURA, TOMOYUKI ABE, KIYOTAKA KOMORI, SYOUJI HASIMOTO, MITSUYOSHI NISHINO
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Patent number: 9307636Abstract: An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.Type: GrantFiled: July 19, 2012Date of Patent: April 5, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki Kato, Kiyotaka Komori
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Patent number: 9277646Abstract: An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.Type: GrantFiled: July 19, 2012Date of Patent: March 1, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroaki Kato, Kiyotaka Komori