Patents by Inventor Kiyotaka Tabuchi

Kiyotaka Tabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190312074
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Application
    Filed: June 13, 2019
    Publication date: October 10, 2019
    Applicant: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Patent number: 10418397
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: September 17, 2019
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 10355038
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 16, 2019
    Assignee: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Publication number: 20180114807
    Abstract: This technology relates to a solid-state imaging device and an electronic apparatus by which image quality can be enhanced. The solid-state imaging device includes a pixel region in which a plurality of pixels are arranged, a first wiring, a second wiring, and a shield layer. The second wiring is formed in a layer lower than that of the first wiring, and the shield layer is formed in a layer lower at least than that of the first wiring. This technology is applicable to a CMOS image sensor, for example.
    Type: Application
    Filed: March 11, 2016
    Publication date: April 26, 2018
    Applicant: Sony Corporation
    Inventors: HAJIME YAMAGISHI, KIYOTAKA TABUCHI, MASAKI OKAMOTO, TAKASHI OINOUE, MINORU ISHIDA, SHOTA HIDA, KAZUTAKA YAMANE
  • Patent number: 9941321
    Abstract: A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor substrate and a first main surface side of the second semiconductor substrate being bonded to each other; and a warpage correction layer which is formed on at least one or more selected from the first main surface side of the first semiconductor substrate, the first main surface side of the second semiconductor substrate, a second main surface side of the first semiconductor substrate, and a second main surface side of the second semiconductor substrate.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: April 10, 2018
    Assignee: Sony Corporation
    Inventors: Hiroyasu Matsugai, Kiyotaka Tabuchi
  • Publication number: 20180019270
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 18, 2018
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9812480
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: November 7, 2017
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170317128
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Applicant: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Patent number: 9806114
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: October 31, 2017
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9741757
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: August 22, 2017
    Assignee: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Publication number: 20170154907
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: February 14, 2017
    Publication date: June 1, 2017
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170033140
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170012074
    Abstract: A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor substrate and a first main surface side of the second semiconductor substrate being bonded to each other; and a warpage correction layer which is formed on at least one or more selected from the first main surface side of the first semiconductor substrate, the first main surface side of the second semiconductor substrate, a second main surface side of the first semiconductor substrate, and a second main surface side of the second semiconductor substrate.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Inventors: Hiroyasu Matsugai, Kiyotaka Tabuchi
  • Patent number: 9508767
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: November 29, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9472472
    Abstract: A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor substrate and a first main surface side of the second semiconductor substrate being bonded to each other; and a warpage correction layer which is formed on at least one or more selected from the first main surface side of the first semiconductor substrate, the first main surface side of the second semiconductor substrate, a second main surface side of the first semiconductor substrate, and a second main surface side of the second semiconductor substrate.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: October 18, 2016
    Assignee: Sony Corporation
    Inventors: Hiroyasu Matsugai, Kiyotaka Tabuchi
  • Patent number: 9461081
    Abstract: An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 4, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160204141
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160111462
    Abstract: An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9253456
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: February 2, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160013234
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Application
    Filed: September 22, 2015
    Publication date: January 14, 2016
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino