Abstract: Embodiments are generally directed to package stacking using chip to wafer bonding. An embodiment of a device includes a first stacked layer including one or more semiconductor dies, components or both, the first stacked layer further including a first dielectric layer, the first stacked layer being thinned to a first thickness; and a second stacked layer of one or more semiconductor dies, components, or both, the second stacked layer further including a second dielectric layer, the second stacked layer being fabricated on the first stacked layer.

Abstract: A method for operating a web server implemented on a computer, wherein in a launch phase, a web server process ignores requests from clients and a further process having elevated permissions of the web server process is started by the web server process, where the further process serves to execute actions with access to a predefined operating system area, following the launch phase, the web server process transitions to normal operation such that when the web server process then receives a request requiring an action with access to the predefined operating system area, the permissibility of the received request is checked by the web server process and in the event of a permissible request, the web server process and the further process communicate, which prompts the further process to execute the action with the required access to the predefined operating system area.

Abstract: A method for operating a web server implemented on a computer, wherein in a launch phase, a web server process ignores requests from clients and a further process having elevated permissions of the web server process is started by the web server process, where the further process serves to execute actions with access to a predefined operating system area, following the launch phase, the web server process transitions to normal operation such that when the web server process then receives a request requiring an action with access to the predefined operating system area, the permissibility of the received request is checked by the web server process and in the event of a permissible request, the web server process and the further process communicate, which prompts the further process to execute the action with the required access to the predefined operating system area.

Abstract: The present invention is directed to a method for adsorbing, i.e. non-covalently binding, nucleic acids to a solid phase using a two-step procedure. Furthermore, the present invention pertains to a method for isolating nucleic acids from a biological sample. In the first step of the procedure, lysis is effected by mixing the biological sample with an aqueous lysis buffer containing a chaotropic agent and incubating the mixture; in the second step, the concentration of the chaotropic agent in the mixture is increased and the mixture is contacted with the solid phase, whereby the nucleic acids in the liquid phase is adsorbed to the solid phase.

Abstract: The present invention is directed to a method for adsorbing, i.e. non-covalently binding, nucleic acids to a solid phase using a two-step procedure. Furthermore, the present invention pertains to a method for isolating nucleic acids from a biological sample. In the first step of the procedure, lysis is effected by mixing the biological sample with an aequous lysis buffer containing a chaotropic agent and incubating the mixture; in the second step, the concentration of the chaotropic agent in the mixture is increased and the mixture is contacted with the solid phase, whereby the nucleic acids in the liquid phase is adsorbed to the solid phase.

Abstract: A waveguide assembly includes a waveguide having walls defining a cavity; and a frame surrounding the walls of the waveguide. The frame has a coefficient of thermal expansion less than that of the waveguide. First and second connecting spacers are attached to and project away from oppositely located wall portions of the waveguide and are attached to the frame such that forces derived from a difference between a heat expansion of the frame and a heat expansion of the waveguide are transmitted by the first and second connecting spacers to the waveguide walls for deforming the same.