Abstract: The invention provides low-emissivity coatings that are highly reflective of infrared radiation. The coating includes three infrared-reflection film regions, which may each comprise silver.

Abstract: Methods and equipment for depositing coatings on glass and other substrates. In some embodiments, methods and equipment are provided for depositing reflective thin film coatings, such as low-emissivity coatings that are particularly reflective of infrared radiation, optionally by a downward coating operation. In some embodiments, such a downward coating operation is coupled with an upward coating operation used to deposit another coating.

Abstract: The invention provides low-emissivity coatings that are highly reflective of infrared radiation. The coating includes three infrared-reflection film regions, which may each comprise silver.

Abstract: The invention provides low-emissivity coatings that are highly reflective of infrared radiation. The coating includes three infrared-reflection film regions, which may each comprise silver.

Abstract: The invention provides low-emissivity coatings that are highly reflective of infrared radiation. The coating includes three infrared-reflection film regions, which may each comprise silver.

Abstract: A cylindrical cathode target assembly for use in sputtering target material onto a substrate comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, a magnetic array carried within the target for generation of a plasma-containing field including a plurality of electron drift paths adjacent an outer surface of the target, and a device for supporting the magnetic array independently of rotation of the target. In certain embodiments of the invention, the magnetic array may include a plurality of magnetic elements arranged to form a plurality of electron drift paths spaced along a substantial length of the target to promote generally uniform film deposition and uniform target utilization along its length.

Abstract: The invention provides thin film coatings that have a transparent base layer. For example, the invention provides low-emissivity coatings with a transparent base layer. In certain embodiments, a silicon dioxide base layer is used. Methods of producing thin film coatings having a transparent base layer are provided as well. In one embodiment, sputter deposition is utilized to produce these coatings.

Abstract: The invention provides a substrate bearing a low-emissivity coating. The low-emissivity coating comprises at least one graded film region. In certain embodiments, at least one graded film region is provided between the two infrared-reflective layers of a double-type low-emissivity coating. The graded film region has a substantially continuously decreasing concentration of a first dielectric material and a substantially continuously increasing concentration of a second dielectric material. Also provided are methods of depositing such low-emissivity coatings and substrates bearing these coatings.

Abstract: The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is comprised of a vacuum chamber, a cathode target of sputterable material, a power source which supplies positive and negative charge, and a gas distribution system. The gas distribution system may comprise a simple perforated gas delivery member, or it may comprise a perforated gas delivery member with an attached conductive anodic surface. The gas delivery member may also contain an inner conduit with further perforations which serves to baffle flow of the sputtering gas. Gas flow may be regulated within discrete portions of the gas distribution system. The anodic surfaces of the gas distribution system are cleaned through the action of plasma and gas flow, creating a more stable plasma and reducing the need for maintenance.

Abstract: Methods and equipment for depositing films. In certain embodiments, there is provided a deposition chamber having a substrate-coating region and an electrode-cleaning region. In these embodiments, an electrode is positioned in the deposition chamber and has an interior cavity in which first and second magnet systems are disposed. In certain embodiments, there is provided a method for depositing films onto substrates using a deposition chamber of the described nature. The invention also provides electrode assemblies for film-deposition equipment. In certain embodiments, the electrode assembly comprises a rotatable electrode (optionally having an outer coating of carbon or the like) having an interior cavity, with stationary first and second generally-opposed magnet systems being disposed in this interior cavity.

Abstract: The invention provides methods and equipment for storing and protecting window assemblies. In certain embodiments, there is provided a bag configured to hold a window assembly therein following the assembly's manufacture up until after the installation of the assembly. The bag is configured to be sealed and to be form-fitted to the window assembly. As such, the likelihood of the bag allowing contaminants therein or catching on something and tearing is reduced. Following the installation of the window assembly, a portion of the bag is configured for removal from the exposed surfaces of the window assembly. A portion of the bag not removed is subsequently utilized as a protective barrier for the non-exposed surfaces of the window assembly. In certain embodiments, there is provided a method for storing and protecting a window assembly using a bag of the described nature.

Abstract: The present invention provides a system and method for removing contaminating moisture from a deposition chamber prior to use. Dry air, preferably hot dry air, is blown into the deposition chamber where it absorbs and removes moisture. This is done by connecting a desiccation system including a blower and a dryer to the deposition chamber. The deposition chamber is also provided with a vacuum source; this may be connected to the deposition chamber using the same line as that used for the desiccation source, or may be connected through a separate line. The dry air may re-circulate through the chamber during this flushing method, or the dry air may flow through the deposition chamber continuously. A heat exchanger may also be provided to efficiently reuse hot air used to recharge the desiccation system. The desiccation system and method are particularly suited for decontaminating a magnetron sputtering deposition chamber.

Abstract: A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

Abstract: Improved sputtering chambers for sputtering thin coatings onto substrates. One sputtering chamber includes spall shields which are disposed inwardly and upwardly toward the chamber interior and toward the sputtering targets, and which can aid in the retention of overcoated sputtering material which may otherwise fall onto substrates to be coated. Another sputtering chamber includes targets having magnets which are turned inwardly relative to vertical and toward each other. The inward rotation of the magnets can serve to deposit more material toward the open bottom center of the chamber, and less toward the side walls of the chamber. Yet another sputtering chamber includes a third target disposed between and upward of the lower two targets so as to shield a portion of the sputtering chamber interior from material sputtered from the first and second targets. Some chambers have the three targets forming a triangle, for example, an isosceles or equilateral triangle.

Abstract: The present invention relates to an oscillating shielded cylindrical target assembly comprising a cylindrical target, a motor assembly adapted to oscillate the cylindrical target, a shield, and a magnet assembly. Embodiments of the present invention also include a cylindrical target that has an outer surface containing a plurality of divided sections; the sections being disposed lengthwise around the target to form strips running lengthwise across the target. Each section includes a single sputtering material, such as silver, titanium, or niobium, that is intended to be applied as a separate coating on a substrate, such as glass.

Abstract: The invention provides niobium-titanium films, coatings (e.g., low-emissivity coatings) comprising one or more niobium-titanium films, and substrates bearings such coatings. Methods of depositing niobium-titanium films are also provided.

Abstract: The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

Abstract: The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

Abstract: A glass article that has a water-sheeting coating and methods of applying coating to a substrate are described. In certain embodiments, a water-sheeting coating 20 comprising silica is sputtered directly over a pyrolytic dielectric film over a glass sheet. In some cases, the exterior face of this water-sheeting coating is substantially non-porous but has an irregular surface. The water-sheeting coating causes water applied to the coated surface to sheet, making the glass article easier to clean and helping the glass stay clean longer. One embodiment provides an IG unit having a low-emissivity coating on its #2 surface, and having on its #4 surface a sputtered silica film over a pyrolytic dielectric layer.

Abstract: Methods and equipment are provided for processing sheet-like substrates. The methods and equipment are useful for depositing coatings on both major surfaces of a sheet-like substrate. Also provided are substrates with coatings on both major surfaces. Preferably, the coatings on the opposed major surfaces of a substrate have different structures, yet share a common structural sequence of at least two film regions, and in some embodiments at least three film regions.