Abstract: A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m2d, preferably of less than 50 g/m2d, especially less than 15 g/m2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

Abstract: A thin glass film composite web comprising a thin glass film web (10) with a first surface (11), and a second surface (12), and two edges (15, 16) which run in the longitudinal direction (L) and comprising a protective film web (20) made of a first material, said protective film web extending along at least one part of the first surface (11), at least one reinforcing strip (30, 31) made of a second material which differs from the first material, said reinforcing strip running along at least one of the two edges (15, 16), the protective film web and the reinforcing strip being connected to each other such that the two can together be applied onto the thin glass web, and the at least one reinforcing strip (30, 31) having a greater relative tensile strength than the thin glass film web (10).

Abstract: In the case of a liner for the protection of adhesives, the protective effect is to be enhanced in respect of permeates originating from the environment and also permeates included during winding or stacking and other processing steps. This enhancement is accomplished through provision of a liner which comprises at least one adhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance.

Abstract: A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.

Abstract: Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

Abstract: The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Abstract: Translucent multiphase adhesive comprising at least one continuous phase and dispersed domains, the at least one continuous phase having a refractive index of more than 1.45 and a permeation rate for water vapour of less than 100 g/m2, and the disperse domains being present in a size range of 0.1 ?m to 50 ?m and being included in a weight fraction of not more than 10 wt % in the adhesive, characterized in that the disperse domains are polymeric in nature and have a water vapour permeation rate of less than 100 g/m2d and a refractive index of less than 1.45.

Abstract: An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Abstract: Liner for protecting adhesives with respect to permeates originating from the surroundings or included during winding, stacking or other process steps, having at least one non-stick release layer and at least one getter material that is able to absorb at least one substance capable of permeation, the getter material being contained as a dispersed phase in at least one layer of the liner.

Abstract: The invention relates to a method of storing a thin sheet glass film (10). According to the invention, the thin sheet glass film (10) is held at two sides, at least one side of the thin sheet glass film (10) is coated over its entire surface with a fluid coating material (20) comprising at least one drying agent, the coating material (20) sets to form a solid polymeric coating, and the coated thin sheet glass film (10) is rolled up for storage.

Abstract: The invention relates to a rolled up thin glass composite comprising a thin glass film and at least one further layer (10, 11, 20, 30) applied over the surface of one side of the thin glass film, wherein the at least one further layer (10, 11, 20, 30) is applied to a radially outer side of the rolled up thin glass film and the at least one further layer (10, 11, 20, 30) contains a desiccant which protects the thin glass film against stress corrosion cracking.

Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract: An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and optionally a solvent, wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m2d, preferably of less than 60 g/m2d, in particular less than 30 g/m2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

Abstract: A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state makes it possible to produce epoxy adhesives having pressure-sensitive properties.

Abstract: The invention relates to a method for absorbing permeates from a sheet material I, as used, for example, in organic electronic structures, this method being easy to carry out. Such a method includes, according to the invention, directly or indirectly bringing sheet material I into planar contact with a sheet material II, which contains at least one getter material and is capable of absorbing at least one permeate from sheet material I, there being no adhesive connection between sheet material I and sheet material II.

Abstract: An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

Abstract: The aim is to provide an improved method for removing water from an adhesive compound and/or for protecting an adhesive compound against water from the surroundings. This is achieved using a method in which water is removed from a release liner up to a maximum water content of 75 wt. % of the water content in the release liner at a temperature of 23° C. and 50% air humidity, and the release liner is brought into contact with the adhesive compound.

Abstract: A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Abstract: A heating element including a current conductor through which electric power is conducted and electricity converted into heat by a voltage drop across an ohmic resistor. The heating element is a planar or a strip-shaped structure and is provided with at least one support layer and an adhesive layer, while the current conductor is designed as an additional, current-conducting layer which is arranged between the support layer and the adhesive layer. The support layer, the current-conducting layer, and the adhesive layer are transparent.