Patents by Inventor Klaus Keite-Telgenbuscher

Klaus Keite-Telgenbuscher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9206279
    Abstract: Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: December 8, 2015
    Assignee: tesa SE
    Inventors: Michael Siebert, Philipp Preuβ, Jan Ellinger, Klaus Keite-Telgenbüscher, Stephan Zöllner
  • Publication number: 20150337175
    Abstract: The invention relates to an easy-to-carry-out and effective method and a suitable device for absorbing permeates from flat structures. The method according to the invention comprises the following steps: gluing an adhesive tape containing at least one getter material onto the flat structure, storing the composite so obtained and consisting of the adhesive tape and the flat structure, and removing at least part of the adhesive tape which contains a getter material from the flat structure, the adhesive tape being designed to absorb at least partially at least one permeate from the flat structure. The invention further relates to an adhesive tape comprising at least one substrate layer having a water vapor permeation rate of <1 g/(m2*d) (measured according to ASTM F-1249 at 38° C.
    Type: Application
    Filed: December 5, 2013
    Publication date: November 26, 2015
    Inventors: Klaus Keite-Telgenbüscher, Christian Schuh, Thomas Schabernack
  • Publication number: 20150337174
    Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.
    Type: Application
    Filed: December 5, 2013
    Publication date: November 26, 2015
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Judith Grünauer, Anika Petersen
  • Publication number: 20150322296
    Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
    Type: Application
    Filed: January 13, 2014
    Publication date: November 12, 2015
    Applicant: TESA SE
    Inventors: Klaus KEITE-TELGENBÜSCHER, Christian SCHUH, Bernd LÜHMANN, Thilo DOLLASE, Minyoung BAI, Thorsten KRAWINKEL
  • Publication number: 20150240134
    Abstract: Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45
    Type: Application
    Filed: July 4, 2013
    Publication date: August 27, 2015
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger
  • Publication number: 20150162568
    Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.
    Type: Application
    Filed: May 27, 2013
    Publication date: June 11, 2015
    Applicant: TESA SE
    Inventors: Minyoung Bai, Jan Ellinger, Judith Grünauer, Klaus Keite-Telgenbüscher, Anika Petersen
  • Patent number: 9039950
    Abstract: The invention relates to a method for the production of a layered or stacked inorganic/organic composite material, a predominantly inorganic material being provided and a polymer material being provided, characterized in that the predominantly inorganic material has a glass transition temperature or melting temperature lower than 500° C., that the predominantly inorganic material and the polymer material are each molten, and that the predominantly inorganic material and the polymer material are coextruded from the melt and thus form the composite material.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: May 26, 2015
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Anja Staiger, Uwe Michel
  • Patent number: 8911642
    Abstract: A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: December 16, 2014
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Anja Staiger, Florian Meyer
  • Patent number: 8840748
    Abstract: A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: September 23, 2014
    Assignee: tesa SE
    Inventors: Anja Staiger, Klaus Keite-Telgenbüscher, Judith Grünauer, Hans Karl Engeldinger
  • Publication number: 20140216644
    Abstract: An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.
    Type: Application
    Filed: July 10, 2012
    Publication date: August 7, 2014
    Applicant: tesa SE
    Inventor: Klaus Keite-Telgenbüscher
  • Publication number: 20140216654
    Abstract: A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.
    Type: Application
    Filed: July 10, 2012
    Publication date: August 7, 2014
    Applicant: tesa SE
    Inventor: Klaus Keite-Telgenbüscher
  • Patent number: 8771459
    Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: July 8, 2014
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen
  • Patent number: 8557084
    Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: October 15, 2013
    Assignee: Tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen
  • Patent number: 8460969
    Abstract: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: June 11, 2013
    Assignee: tesa SE
    Inventors: Thorsten Krawinkel, Klaus Keite-Telgenbüscher, Jan Ellinger, Alexander Steen
  • Patent number: 8383997
    Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: February 26, 2013
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann
  • Publication number: 20130040136
    Abstract: Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 14, 2013
    Applicant: TESA SE
    Inventors: Michael Siebert, Philipp Preuß, Jan Ellinger, Klaus Keite-Telgenbüscher, Stephan Zöllner
  • Publication number: 20130020022
    Abstract: A heat-activatedly bondable sheetlike element having at least one electrically conductive sheetlike structure and at least two layers of different heat-activable adhesives. A first heat-activatable adhesive layer is located substantially on a first side of the electrically conductive sheetlike structure and the second heat-activatable adhesive layer is located substantially on a second side of the electrically conductive sheetlike structure. Activation temperatures for achieving the adhesive properties of the heat-activatable adhesive layers differ from one another less than the melting temperatures of the two heat-activatable adhesive layers.
    Type: Application
    Filed: December 7, 2010
    Publication date: January 24, 2013
    Inventors: Klaus Keite-Telgenbüscher, Hans Karl Engeldinger, Judith Grünauer
  • Publication number: 20130000811
    Abstract: A heat-activated, glueable sheetlike element having at least one heat-activatable adhesive, at least one inductively heatable material, and at least one thermally conductive filler, wherein material of the thermally conductive filler has a thermal conductivity of at least 0.
    Type: Application
    Filed: December 7, 2010
    Publication date: January 3, 2013
    Applicant: Tesa SE
    Inventors: Hans Karl Engeldinger, Judith Grünauer, Klaus Keite-Telgenbüscher
  • Publication number: 20120279647
    Abstract: A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
    Type: Application
    Filed: October 8, 2010
    Publication date: November 8, 2012
    Inventors: Anja Staiger, Klaus Keite-Telgenbüscher, Judith Grünauer, Karl Hans Engeldinger
  • Publication number: 20120064318
    Abstract: A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.
    Type: Application
    Filed: April 8, 2010
    Publication date: March 15, 2012
    Applicant: TESA SE
    Inventors: Klaus Keite-Telgenbüscher, Judith Grünauer, Jan Ellinger