Patents by Inventor Ko-Pu WU

Ko-Pu WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200395275
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU