Abstract: A polyamic acid varnish according to the present disclosure contains a polyamic acid. The monomers that constitute this polyamic acid include: a monomer (A) that has a C4-12 linear alkylene group but does not have an ester bond, an amide bond, or an ether bond; and a monomer (B) that is a monomer other than the monomer (A). The monomer (A) content is 15 to 70 mol % with respect to the total amount of the monomers that constitute the polyamic acid. The monomer (B) contains at least 90 mol % aromatic monomer.

Abstract: This poly(amic acid) composition contains a poly(amic acid). Aromatic monomers account for 95 mol % or more of all monomers that constitute the poly(amic acid). The aromatic monomers include 40-95 mol % of a monomer (A) having a prescribed diphenyl ether skeleton, 0-60 mol % of a monomer (B) having a benzophenone skeleton and 0-60 mol % of a monomer (C) having a biphenyl skeleton, each relative to the total amount of monomers. The monomer (A) having a diphenyl ether skeleton includes 20 mol % or more of a monomer (A-1) having at least three aromatic rings relative to the total amount of monomers. The diamine/tetracarboxylic acid dianhydride molar ratio is 0.90-0.999.

Abstract: The polyamic acid composition according to the present disclosure comprises a polyamic acid. The monomers constituting the polyamic acid include, relative to the total monomers, 30-95 mol % of monomer (A) that has a diphenyl ether skeleton represented by general formula (1) or (2) but no benzophenone skeleton, and 0-5 mol % of monomer (B) that has a benzophenone skeleton. The diamines constituting the polyamic acid include aromatic diamine (?1) that has a diphenyl ether skeleton represented by general formula (2) and aliphatic diamine (?2) represented by general formula (3) or (4), and the molar ratio b/a of the diamines b to tetracarboxylic dianhydride a constituting the polyamic acid is 0.90-0.999.