Patents by Inventor Kodai NIINA

Kodai NIINA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250012712
    Abstract: To appropriately take explosion-proof measures for an analysis device while suppressing consumption of a purge gas, an analysis device includes a filling unit, an irradiation unit, a propagation unit, a housing, a purge gas introduction unit, and an explosion-proof gas introduction unit. The filling unit is filled with a sample gas containing a gas to be measured. The irradiation unit emits measurement light to be used for analyzing the gas to be measured. The propagation unit is disposed between the filling unit and the irradiation unit, so as to form a propagation space for propagating the measurement light emitted from the irradiation unit to the filling unit. The housing houses the filling unit, the irradiation unit, and the propagation unit. The purge gas introduction unit introduces the purge gas into the propagation space. The explosion-proof gas introduction unit introduces an explosion-proof gas into the internal space of the housing.
    Type: Application
    Filed: May 25, 2022
    Publication date: January 9, 2025
    Applicant: HORIBA, LTD.
    Inventors: Kohei TACHIBANA, Keishi NAKAMURA, Kodai NIINA, Daisuke MIYAWAKI, Tsuyoshi WATANABE, Takuya IDO
  • Publication number: 20240146020
    Abstract: To suppress individual differences in intensity of output laser light for each semiconductor laser device as much as possible while suppressing generation of stray light in a package of the semiconductor laser device, provided is a semiconductor laser device used for optical analysis, including: a package that accommodates a semiconductor laser element therein; and a light reflection reducing member that is provided inside the package and suppresses reflection of light emitted from the semiconductor laser element, in which the light reflection reducing member is bonded to an inner surface of the package.
    Type: Application
    Filed: February 21, 2022
    Publication date: May 2, 2024
    Applicant: HORIBA, LTD.
    Inventors: Yusuke AWANE, Makoto MATSUHAMA, Kosuke TSUKATANI, Kodai NIINA, Takuya IDO