Abstract: A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

Abstract: An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

Abstract: A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.

Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Abstract: A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

Abstract: A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.

Abstract: A portable electronic apparatus has a water-resistant structure in which a cover covers a surface of an opening formed in a casing of the portable electronic apparatus. The portable electronic apparatus includes a mounting unit that has an outer peripheral surface to which frame-shaped packing that encompasses the opening is attached, and is formed on any one among the casing and the cover; and a groove that is formed on an outer peripheral surface of the mounting unit, and holds the frame-shaped packing therein enabling a surface of the frame-shaped packing to be brought into pressure contact with any one among the casing and the cover to which the mounting is not formed. The mounting unit has a side and a corner, and is of a shape that encompasses the opening, and the groove has a shape at the corner different from that along the side.

Abstract: An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

Abstract: A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.

Abstract: An optical waveguide substrate includes: a substrate body in which an optical waveguide is formed; a cable holding part configured to have a cable holding hole into which a signal cable is inserted, the signal cable having one of an incidence part and an emission part that is arranged so as to face the optical waveguide and having a first magnetic part; and a second magnetic part configured to generate a repulsive force in the cable holding hole in association with the first magnetic part.

Abstract: An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

Abstract: A housing includes a first case and a second case configured to be joined together to make a housing space; and a double-sided adhesive member having a first surface and a second surface, the double-sided adhesive member including an impermeable, elastic base material, and a plurality of binder layers formed on either surface of the base material, the binder layers on the first and second surfaces being bonded to the first and second cases, respectively, wherein an adhesive force between the first case and the first surface of the double-sided adhesive member is greater on an outer side of the first case than on an inner side of the first case, and wherein an adhesive force between the second case and the second surface of the double-sided adhesive member is greater on an inner side of the second case than on an outer side of the second case.

Abstract: An optical coupling structure includes a light source that emits light; and an optical waveguide that has on a given end, a mirror surface that reflects the light emitted from the light source, the optical waveguide guiding the light reflected by the mirror surface to another end. In the optical coupling structure, a traveling direction of the light emitted from the light source is inclined toward the given end of the optical waveguide and is, with respect to a normal line of the mirror surface, at an angle that is greater than 45 degrees and that satisfies a condition for complete reflection of light on the mirror surface and a condition for complete reflection of light in the optical waveguide.

Abstract: An optical waveguide substrate includes: a substrate body in which an optical waveguide is formed; a cable holding part configured to have a cable holding hole into which a signal cable is inserted, the signal cable having one of an incidence part and an emission part that is arranged so as to face the optical waveguide and having a first magnetic part; and a second magnetic part configured to generate a repulsive force in the cable holding hole in association with the first magnetic part.

Abstract: A water-resistant cover placed on an electronic device in an attachable/removable manner, and for the water-resistant cover and the circumference of a water-resistant area of the electronic device, a sealing member is provided on the whole circumference in the circumference direction of the water-resistant area on one side, and a contact plane facing the sealing member is formed on the same plane on another side, and the water-resistant cover slides and put on the electronic device in the state in which the sealing member contacts the contact plane and pressed.

Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

Abstract: An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Abstract: A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.