Abstract: The present invention reduces an electromagnetic coupling that can occur between a first signal line provided on a first substrate and a second signal line provided on a main surface of a second substrate on the first substrate side. A wireless module (10) includes an RFIC (28), a baseband IC (16), a first substrate (11) on which first signal lines (121 through 126) for transmitting a baseband signal are provided, and a second substrate (21) provided with second signal lines (2201 through 2232) for transmitting an RF signal on a main surface (211). The first substrate (11) is provided with a pseudo conductor wall (post wall 13) for shielding the first signal lines (121 through 126) and the second signal lines (2201 through 2232).

Abstract: The present invention reduces an electromagnetic coupling that can occur between a first signal line provided on a first substrate and a second signal line provided on a main surface of a second substrate on the first substrate side. A wireless module (10) includes an RFIC (28), a baseband IC (16), a first substrate (11) on which first signal lines (121 through 126) for transmitting a baseband signal are provided, and a second substrate (21) provided with second signal lines (2201 through 2232) for transmitting an RF signal on a main surface (211). The first substrate (11) is provided with a pseudo conductor wall (post wall 13) for shielding the first signal lines (121 through 126) and the second signal lines (2201 through 2232).

Abstract: To provide a wireless communication module capable of preventing radiation characteristics from being changed by deformation of an antenna circuit board, a wireless communication module includes an antenna circuit board having a first principal surface on which at least one antenna element is mounted and a second principal surface on which an integrated circuit is mounted. The wireless communication module includes a support that holds the antenna circuit board by being in contact with a pair of opposite sides thereof and that thereby keeps the antenna circuit board flat. The support either (i) faces the second principal surface and is separated from the second principal surface by a distance that is not smaller than the wavelength of an electromagnetic wave transmitted and received with use of the antenna circuit board or (ii) does not face the second principal surface.

Abstract: The present invention reduces the risk of damaging a waveguide made of a brittle material. A transmission line (1) includes: a first waveguide (11) which is made of a brittle material; a second waveguide (21); and a bonding layer (31) by which the first waveguide (11) and the second waveguide (21) are bonded and which is electrically conductive. At least part of the bonding layer (31) is made of an electrically conductive adhesive, the at least part of the bonding layer (31) being in contact with the first waveguide (11).

Abstract: In a radio communication device which employs a millimeter wave, a contact failure which can occur in a case where maintenance is repeatedly carried out is suppressed. A radio communication device (1) includes: a first substrate (11) which includes a radio communication circuit (RFIC 12) that processes a high frequency signal; and a second substrate (21) which includes a baseband circuit (baseband IC 22) that processes the baseband signal. A terminal (14d) to which the baseband signal is supplied from the second substrate (21) is provided in a vicinity of an edge (11a) of the first substrate (11), and the second substrate (21) includes a card-edge connector (23) which supplies the baseband signal to the terminal (14d).

Abstract: In a radio communication device which employs a millimeter wave, a contact failure which can occur in a case where maintenance is repeatedly carried out is suppressed. A radio communication device (1) includes: a first substrate (11) which includes a radio communication circuit (RFIC 12) that processes a high frequency signal; and a second substrate (21) which includes a baseband circuit (baseband IC 22) that processes the baseband signal. A terminal (14d) to which the baseband signal is supplied from the second substrate (21) is provided in a vicinity of an edge (11a) of the first substrate (11), and the second substrate (21) includes a card-edge connector (23) which supplies the baseband signal to the terminal (14d).

Abstract: To provide a wireless communication module capable of preventing radiation characteristics from being changed by deformation of an antenna circuit board, a wireless communication module includes an antenna circuit board having a first principal surface on which at least one antenna element is mounted and a second principal surface on which an integrated circuit is mounted. The wireless communication module includes a support that holds the antenna circuit board by being in contact with a pair of opposite sides thereof and that thereby keeps the antenna circuit board flat. The support either (i) faces the second principal surface and is separated from the second principal surface by a distance that is not smaller than the wavelength of an electromagnetic wave transmitted and received with use of the antenna circuit board or (ii) does not face the second principal surface.

Abstract: A mounting structure includes a semiconductor device including a first terminal, a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, and a bump that electrically connects the first terminal and the second terminal.

Abstract: A circuit board includes: a first board; a second board; an electronic element connected to the first board via a first connecting portion, and connected to the second board via a second connecting portion, in which a thermal conductance of the second connecting portion is smaller than a thermal conductance of the first connecting portion.

Abstract: The present invention reduces the risk of damaging a waveguide made of a brittle material. A transmission line (1) includes: a first waveguide (11) which is made of a brittle material; a second waveguide (21); and a bonding layer (31) by which the first waveguide (11) and the second waveguide (21) are bonded and which is electrically conductive. At least part of the bonding layer (31) is made of an electrically conductive adhesive, the at least part of the bonding layer (31) being in contact with the first waveguide (11).

Abstract: A mounting structure includes a semiconductor device including a first terminal, a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, and a bump that electrically connects the first terminal and the second terminal.

Abstract: An optical device includes a window glass plate with which a window of a lid section is provided and which is connected to the lid section via a solder layer so that an internal space of the optical device is hermetically sealed. The solder layer has a void which is isolated from an external space and an internal space of the optical device.

Abstract: An optical device including a housing; an optical element contained in the housing; and a cover that seals an opening of the housing. The cover includes a frame member having an opening that serves as a window section, and a window section glass plate bonded to the frame member and seals the opening of the frame member. The frame member has a thickness which is greater than that of the window section glass plate, an upper surface of the frame member protrudes past an upper surface of the window section glass plate, a lower surface of the frame member protrudes past a lower surface of the window section glass plate.

Abstract: The present invention prevents an optical device from malfunctioning or receiving a reduced amount of light due to a foreign object adhering to or floating above a light receiving portion of the optical device. A metal frame (31) includes at least one protruding section (34) that protrudes toward an LCOS element (11).

Abstract: An optical device includes a window glass plate with which a window of a lid section is provided and which is connected to the lid section via a solder layer so that an internal space of the optical device is hermetically sealed. The solder layer has a void which is isolated from an external space and an internal space of the optical device.

Abstract: An optical device including a housing; an optical element contained in the housing; and a cover that seals an opening of the housing. The cover includes a frame member having an opening that serves as a window section, and a window section glass plate bonded to the frame member and seals the opening of the frame member. The frame member has a thickness which is greater than that of the window section glass plate, an upper surface of the frame member protrudes past an upper surface of the window section glass plate, a lower surface of the frame member protrudes past a lower surface of the window section glass plate.

Abstract: The present invention makes it possible to inhibit decrease in optical performance due to a foreign object, while securing a space necessary for wire bonding. A cover (3) is configured such that a distance (z2) between an optical device (1) and a sub-cover member (32) becomes greater than a distance (z1) between the optical device (1) and a cover glass (31).

Abstract: The present invention prevents an optical device from malfunctioning or receiving a reduced amount of light due to a foreign object adhering to or floating above a light receiving portion of the optical device. A metal frame (31) includes at least one protruding section (34) that protrudes toward an LCOS element (11).

Abstract: Object To prevent deformation of locating pins and breakage of the glass substrate on which locating holes are formed. Means for Solving the Problems There is provided an optical module including: a glass substrate that includes an optical-electric-conversion element, that is transparent to either one of light emitted from the optical-electric-conversion element and light received by the optical-electric-conversion element, and in which a locating hole is formed; and an optical component in which a locating pin is formed, the glass substrate and the optical component being positioned by fitting the locating pin to the locating hole through a protective film so that the protective film is in contact with the locating hole and the locating pin.

Abstract: Provided is a wiring board including: a board; a differential transmission line constituted by two wirings disposed on the board in parallel; an insulation resin layer which is formed on part of a face of the board. A stepped portion constituted by a lateral face of the insulation resin layer is formed at a boundary between the face of the board and a top face of the insulation resin layer. The two wirings extend from the face of the board to the top face of the insulation resin layer so as to traverse the stepped portion. The extending direction of the wirings traversing the stepped portion and the direction of a periphery are perpendicular to each other in a plan view of the board, the periphery being defined by a boundary between the top face of the insulation resin layer and the lateral face of the insulation resin layer.