Patents by Inventor Kohichi Tokudome

Kohichi Tokudome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9156857
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Means for Solving Problem] Use a diethylzinc composition added a compound which has particular carbon-carbon double bond to a diethylzinc.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: October 13, 2015
    Assignee: TOSOH FINECHEM CORPORATION
    Inventors: Kenichi Haga, Shizuo Tomiyasu, Kohichi Tokudome, Kouji Toyota, Koichiro Inaba
  • Patent number: 9018125
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Solving Means] Use a diethylzinc composition added a compound which is added an aromatic compound as an additive which has isopropenyl group bonded as a side chain.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: April 28, 2015
    Assignee: Tosoh Finechem Corporation
    Inventors: Kenichi Haga, Shizuo Tomiyasu, Kohichi Tokudome
  • Publication number: 20140228207
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Solving Means] Use a diethylzinc composition added a compound which is added an aromatic compound as an additive which has isopropenyl group bonded as a side chain.
    Type: Application
    Filed: March 31, 2014
    Publication date: August 14, 2014
    Applicant: TOSOH FINECHEM CORPORATION
    Inventors: Kenichi HAGA, Shizuo TOMIYASU, Kohichi TOKUDOME
  • Patent number: 8722561
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Solving Means] Use a diethylzinc composition added a compound which is added an aromatic compound as an additive which has isopropenyl group bonded as a side chain.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: May 13, 2014
    Assignee: Tosoh Finechem Corporation
    Inventors: Kenichi Haga, Shizuo Tomiyasu, Kohichi Tokudome
  • Patent number: 8673413
    Abstract: A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: March 18, 2014
    Assignee: Tosoh Finechem Corporation
    Inventors: Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
  • Publication number: 20130281724
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Means for solving problem] Use a diethylzinc composition added a compound which has particular carbon-carbon double bond to a diethylzinc.
    Type: Application
    Filed: December 15, 2011
    Publication date: October 24, 2013
    Applicant: TOSOH FINECHEM CORPORATION
    Inventors: Kenichi Haga, Shizuo Tomiyasu, Kohichi Tokudome, Kouji Toyota, Koichiro Inaba
  • Publication number: 20120184432
    Abstract: [Object] To improve heat stability of diethylzinc which is used for a catalyst of polymerizing, an organic synthetic reaction reagent and a raw materials for providing a zinc film by MOCVD. And to offer the diethylzinc composition being superior in heat stability, even if it handles for a long term a metal zinc particle does not precipitate. [Solving Means] Use a diethylzinc composition added a compound which is added an aromatic compound as an additive which has isopropenyl group bonded as a side chain.
    Type: Application
    Filed: September 1, 2010
    Publication date: July 19, 2012
    Applicant: Tosoh Finechem Corporation
    Inventors: Kenichi Haga, Shizuo Tomiyasu, Kohichi Tokudome
  • Patent number: 8092604
    Abstract: A solid organometallic compound novel filled container stably supplies an apparatus for vapor phase epitaxial growth such as an MOCVD apparatus with a solid organometallic compound over a long term. The solid organometallic compound-filled container has a carrier gas inlet and a carrier gas outlet. The interior of the filled container is separated into a plurality of vertical compartments. A carrier gas introduced via the carrier gas inlet flows through each of the vertical compartments and is then discharged via the carrier gas outlet.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 10, 2012
    Assignee: Tosoh Finechem Corporation
    Inventors: Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
  • Publication number: 20090283041
    Abstract: A solid organometallic compound novel filled container stably supplies an apparatus for vapor phase epitaxial growth such as an MOCVD apparatus with a solid organometallic compound over a long term. The solid organometallic compound-filled container has a carrier gas inlet and a carrier gas outlet. The interior of the filled container is separated into a plurality of vertical compartments. A carrier gas introduced via the carrier gas inlet flows through each of the vertical compartments and is then discharged via the carrier gas outlet.
    Type: Application
    Filed: May 12, 2009
    Publication date: November 19, 2009
    Inventors: Shizuo TOMIYASU, Kohichi Tokudome, Kenichi Haga
  • Patent number: 7547363
    Abstract: A solid organometallic compound novel filled container stably supplies an apparatus for vapor phase epitaxial growth such as an MOCVD apparatus with a solid organometallic compound over a long term. The solid organometallic compound-filled container has a carrier gas inlet and a carrier gas outlet. The interior of the filled container is separated into a plurality of vertical compartments. A carrier gas introduced via the carrier gas inlet flows through each of the vertical compartments and is then discharged via the carrier gas outlet.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: June 16, 2009
    Assignee: Tosoh Finechem Corporation
    Inventors: Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
  • Publication number: 20070175397
    Abstract: A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 2, 2007
    Inventors: Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
  • Publication number: 20050008799
    Abstract: A novel filled container is provided, which can stably supply an apparatus for vapor phase epitaxial growth such as an MOCVD apparatus with a solid organometallic compound over a long term. The solid organometallic compound-filled container has a carrier gas inlet and a carrier gas outlet. The interior of the filled container is separated into a plurality of vertical compartments. A carrier gas introduced via the carrier gas inlet flows through each of the vertical compartments and is then discharged via the carrier gas outlet.
    Type: Application
    Filed: June 14, 2004
    Publication date: January 13, 2005
    Inventors: Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga