Abstract: In a lighting device, a first LED is formed by sealing a blue LED element by a first resin, the first resin having a first phosphor included in the first resin so as to raise a correlation color temperature of an emitted light color; and a second LED is formed by sealing a blue LED element by a second resin, the second resin having a second phosphor included in the second resin so as to lower a correlation color temperature of an emitted light color. The lighting device emits light from white light of a color having a first correlation color temperature to white light of a color having a second correlation color temperature, and the first correlation color temperature is higher than the second correlation color temperature. Consequently, various tones of white light can be more easily adjusted and controlled over a long period.

Abstract: A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.

Abstract: An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.

Abstract: An LED light source apparatus comprises a circular base having thermal conductivity, an insulative substrate concentric with the base and including a pass-through hole provided to pass through an upper surface and a lower surface of the substrate, at least one mounting area formed having a central portion of an upper surface of the base exposed from the pass-through hole of the substrate, and a plurality of LED elements mounted on the mounting area and electrically connected to electrodes provided on the upper surface of the substrate, the pass-through hole being formed in a circular shape concentric with the base and the substrate.

Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting arrays or light-emitting groups arranged on the substrate. The light-emitting arrays or light-emitting groups include a plurality of LED elements connected in parallel with a pair of adjacent electrodes. The number of the LED elements constituting each of the light-emitting arrays or the light-emitting groups differs in each of the light-emitting arrays or the light-emitting groups. Of the plurality of light-emitting arrays arranged in parallel with each other or the light-emitting groups arranged in a line, the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned inside the substrate is more than the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned outside the substrate.

Abstract: An LED light source apparatus comprises a circular base having thermal conductivity, an insulative substrate concentric with the base and including a pass-through hole provided to pass through an upper surface and a lower surface of the substrate, at least one mounting area formed having a central portion of an upper surface of the base exposed from the pass-through hole of the substrate, and a plurality of LED elements mounted on the mounting area and electrically connected to electrodes provided on the upper surface of the substrate, the pass-through hole being formed in a circular shape concentric with the base and the substrate.

Abstract: The present invention relates to an illumination apparatus comprising an LED light source which includes an LED chip and a sealing member containing a fluorescent material therein and sealing the LED chip and is configured to illuminate an object, and a light-transmitting member provided in front of the LED light source, the LED chip being configured to make standby emission of light by application of a standby current during standby illumination of the object, the LED chip being controlled so that a color of the sealing member containing the fluorescent material is less visible from outside, and a current value of the standby current being controlled according to brightness of external light detected by an external light sensor to reduce power consumption.

Abstract: An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.

Abstract: An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.

Abstract: A semiconductor light-emitting device includes: a printed-wiring board; a light-emitting diode element mounted on the printed-wiring board; and a resin body for sealing the light-emitting diode element. The resin body is composed of a first resin body arranged around the light-emitting diode element, and a second resin body, which seals the light-emitting diode and the first resin body. An upper edge of the first resin body disposed at a lower position of the PN-junction is configured to be at least on or beyond an imaginary line that connects the PN-junction and a lower edge of the second resin body.

Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

Abstract: In a lighting device, a first LED is formed by sealing a blue LED element by a first resin, the first resin having a first phosphor included in the first resin so as to raise a correlation color temperature of an emitted light color; and a second LED is formed by sealing a blue LED element by a second resin, the second resin having a second phosphor included in the second resin so as to lower a correlation color temperature of an emitted light color. The lighting device emits light from white light of a color having a first correlation color temperature to white light of a color having a second correlation color temperature, and the first correlation color temperature is higher than the second correlation color temperature. Consequently, various tones of white light can be more easily adjusted and controlled over a long period.

Abstract: The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved.

Abstract: The present invention is an LED unit having a thermal-release structure including a base having high thermal conductivity, a circuit board which includes a wiring pattern and is provided on the base, at least one LED element which is electrically connected to the wiring pattern and disposed on the base, and a light-transmitting resinous body provided to cover above the base to seal the LED element.

Abstract: The present invention relates to an illumination apparatus comprising an LED light source which includes an LED chip and a sealing member containing a fluorescent material therein and sealing the LED chip and is configured to illuminate an object, and a light-transmitting member provided in front of the LED light source, the LED chip being configured to make standby emission of light by application of a standby current during standby illumination of the object, the LED chip being controlled so that a color of the sealing member containing the fluorescent material is less visible from outside, and a current value of the standby current being controlled according to brightness of external light detected by an external light sensor to reduce power consumption.

Abstract: A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.

Abstract: The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved.

Abstract: An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.

Abstract: A multifunctional-type backlight unit, including a light guiding plate having a first incident/exit surface and a second incident/exit surface which are capable of receiving and emitting light, a light emitting device disposed to face the first incident/exit surface and configured to supply light to the first incident/exit surface, and a light receiving device disposed to face the first incident/exit surface and configured to receive light emitted from the first incident/exit surface, the light guiding plate being configured so that the light emitted from the light emitting device enters the light guiding plate, passes through the light guiding plate, and is emitted from the second incident/exit surface, and the light guiding plate being configured so that the light which enters the second incident/exit surface, passes through the light guiding plate emits from the first incident/exit surface is received by the light receiving device.