Patents by Inventor Koji Sawahata

Koji Sawahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170267080
    Abstract: There are provided a front roof, a rear roof, a glass unit including a rear-window glass, a rear roof support link which openably supports the rear roof at a vehicle body, a front-roof support link mechanism which openably supports the front roof, the front-roof support link mechanism being connected to the rear roof support link such that closed states of both the front roof and the rear roof are achieved by means of the rear roof support link and the front-roof support link mechanism, and a glass-unit support link mechanism which is connected to the rear roof support link and configured to support the glass unit in a closed position.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 21, 2017
    Applicants: MAZDA MOTOR CORPORATION, Webasto Japan Co., Ltd.
    Inventors: Kouichi MATSUMOTO, Koji SAWAHATA, Yasufumi KAWAKAMI
  • Publication number: 20170267079
    Abstract: There provided an openable roof, a link mechanism foldably supporting the openable roof, and a drive device to drive a drive link of a link mechanism. The drive device comprises a drive unit including a drive gear connected to a drive motor, a driven gear provided at the drive link, and an intermediate gear engaging with the drive gear and the driven gear. The drive unit is located at a lower level than a beltline of the vehicle body, the driven-gear pivotal portion is located at a higher level than the beltline, and the intermediate gear is located at a specified level such that the intermediate gear overlaps the beltline in a side view.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 21, 2017
    Applicants: MAZDA MOTOR CORPORATION, Webasto Japan Co., Ltd.
    Inventors: Kouichi MATSUMOTO, Koji SAWAHATA, Takeshi MIZOGUCHI
  • Patent number: 8216934
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: July 10, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura, Akira Takashima, Mitsuhisa Watanabe
  • Patent number: 8042424
    Abstract: Reducing number of components in a case where a plurality of locking mechanism is being used.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: October 25, 2011
    Assignee: Webasto AG
    Inventors: Koji Sawahata, Shinya Matsui, Takashi Motohashi, Takuya Izumi
  • Publication number: 20110092065
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Application
    Filed: December 22, 2010
    Publication date: April 21, 2011
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Eiji YOSHIDA, Takao OHNO, Yoshito AKUTAGAWA, Koji SAWAHATA, Masataka MIZUKOSHI, Takao NISHIMURA, Akira TAKASHIMA, Mitsuhisa WATANABE
  • Patent number: 7884459
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: February 8, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura, Akira Takashima, Mitsuhisa Watanabe
  • Patent number: 7837250
    Abstract: To reliably prevent lifting of a roof panel when the roof panel is fully closed. To provide a roof panel (12) to a vehicle body (1) capable of opening/closing a vehicle cabin space (11), a link mechanism (3) for supporting the roof panel (12) at the vehicle body (1) having a front connecting link (33) rotatably connected to both of the vehicle body (1) and the roof panel (12), and a rear connecting link (34) rotatably connected to both of the vehicle body (1) and the roof panel (12) at rear side of a vehicle relative to front connecting link (33), and link restricting mechanism (500) for restricting the rear connecting link (34) to the vehicle body (1) when the roof panel (12) is in fully closed state over the vehicle cabin space (11).
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: November 23, 2010
    Assignee: Webasto AG
    Inventors: Shinya Matsui, Koji Sawahata, Kozo Odoi
  • Patent number: 7659937
    Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: February 9, 2010
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Koji Sawahata, Shigeo Iriguchi, Toshiyuki Honda, Katsuro Hiraiwa
  • Publication number: 20100007178
    Abstract: Reducing number of components in a case where a plurality of locking mechanism is being used.
    Type: Application
    Filed: March 28, 2007
    Publication date: January 14, 2010
    Applicant: WEBASTO AG
    Inventors: Koji Sawahata, Shinya Matsui, Takaaki Motohashi, Takuya Izumi
  • Patent number: 7564111
    Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: July 21, 2009
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda, Shigeo Iriguchi, Masashi Takenaka
  • Publication number: 20090160225
    Abstract: To reliably prevent lifting of a roof panel when the roof panel is fully closed. To provide a roof panel (12) to a vehicle body (1) capable of opening/closing a vehicle cabin space (11), a link mechanism (3) for supporting the roof panel (12) at the vehicle body (1) having a front connecting link (33) rotatably connected to both of the vehicle body (1) and the roof panel (12), and a rear connecting link (34) rotatably connected to both of the vehicle body (1) and the roof panel (12) at rear side of a vehicle relative to front connecting link (33), and link restricting mechanism (500) for restricting the rear connecting link (34) to the vehicle body (1) when the roof panel (12) is in fully closed state over the vehicle cabin space (11).
    Type: Application
    Filed: March 28, 2007
    Publication date: June 25, 2009
    Applicant: WEBASTO AG
    Inventors: Shinya Matsui, Koji Sawahata, Kozo Odoi
  • Publication number: 20090008798
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Application
    Filed: September 15, 2008
    Publication date: January 8, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura, Akira Takashima, Mitsuhisa Watanabe
  • Publication number: 20070120050
    Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Inventors: Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda, Shigeo Iriguchi, Masashi Takenaka
  • Publication number: 20060243884
    Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.
    Type: Application
    Filed: March 29, 2006
    Publication date: November 2, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Koji Sawahata, Shigeo Iriguchi, Toshiyuki Honda, Katsuro Hiraiwa
  • Publication number: 20050167812
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 4, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura, Akira Takashima, Mitsuhisa Watanabe