Abstract: The present invention relates to a reservoir tank for coolant that stores the coolant for cooling an internal combustion engine. The reservoir tank includes: a tank chamber that stores the coolant; an opening, which is disposed in an upper part of the tank chamber, through which the coolant flows in and flows out, and in a circumferential wall of which a breathing hole is formed; and a first communication passage, a second communication passage, and a third communication passage that respectively communicate with the opening and the tank chamber.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract: The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions (32) in one main surface of substrate (30) and insulating resin layer (20) having a spiral void portion (40) disposed in the region thereof, a step of forming metal layer (36) in frame-like void portion (32) and spiral void portion (40) and on insulating resin layer (20), a step of polishing metal layer (36) at least up to the upper surface of insulating resin layer and forming coil section (18) in spiral void portion (40), and a step of forming a metal layer for connecting chip parts to frame-like void portion (32), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions (32) in one main surface of substrate (30) and insulating resin layer (20) having a spiral void portion (40) disposed in the region thereof, a step of forming metal layer (36) in frame-like void portion (32) and spiral void portion (40) and on insulating resin layer (20), a step of polishing metal layer (36) at least up to the upper surface of insulating resin layer and forming coil section (18) in spiral void portion (40), and a step of forming a metal layer for connecting chip parts to frame-like void portion (32), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: A three-dimensional coil pattern, whose internal electrode is connected to external electrodes through a via, is formed within photosensitive resin colored by colorant. This structure allows this electronic component to be lower profile. Cured and colored resin that works as a protecting section of the coil pattern prevents irregular reflection on the internal electrode or the via due to illuminating the component when the component is mounted, so that the component can be handled with more ease.

Abstract: A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.

Abstract: The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions (32) in one main surface of substrate (30) and insulating resin layer (20) having a spiral void portion (40) disposed in the region thereof, a step of forming metal layer (36) in frame-like void portion (32) and spiral void portion (40) and on insulating resin layer (20), a step of polishing metal layer (36) at least up to the upper surface of insulating resin layer and forming coil section (18) in spiral void portion (40), and a step of forming a metal layer for connecting chip parts to frame-like void portion (32), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.

Abstract: A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.

Abstract: A capacitor element includes a valve metal foil including a core layer and a porous layer on the core layer, a dielectric layer on a portion of the valve metal foil excluding an end portion of the valve metal foil, a solid electrolyte layer on the dielectric layer, a collector layer on the solid electrolyte layer, and a zinc layer on the end portion of the valve metal foil. A solid electrolytic capacitor includes the capacitor element, an insulating case for sealing the capacitor element as to expose the zinc layer, a nickel layer on the zinc layer, and an electrode provided on the case and electrically connected to the collector layer. The solid electrolytic capacitor has a small impedance even at high frequencies, and has a small overall size and a large capacitance.

Abstract: A capacitor element includes a valve metal foil including a core layer and a porous layer on the core layer, a dielectric layer on a portion of the valve metal foil excluding an end portion of the valve metal foil, a solid electrolyte layer on the dielectric layer, a collector layer on the solid electrolyte layer, and a zinc layer on the end portion of the valve metal foil. A solid electrolytic capacitor includes the capacitor element, an insulating case for sealing the capacitor element as to expose the zinc layer, a nickel layer on the zinc layer, and an electrode provided on the case and electrically connected to the collector layer. The solid electrolytic capacitor has a small impedance even at high frequencies, and has a small overall size and a large capacitance.