Patents by Inventor Koji Shinoda

Koji Shinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200403345
    Abstract: In a connector (1), one end parts (31A) of first terminals (3A), one end parts (31B) of a plurality of second terminals (3B) and one end parts (31C) of a plurality of third terminals (3C) are arranged in parallel to each other along a first direction (D1). One end part (20C) of a third core resin portion (2C) sandwiches one end part (20A) of a first core resin portion (2A) and one end part (20B) of a second core resin portion (2B) from both sides in a second direction (D2). The one end part (20A) of the first core resin portion (2A) and the one end part (20B) of the second core resin portion (2B), and the one end part (20C) of the third core resin portion (3C) are shaped to be locked in a third direction (D3).
    Type: Application
    Filed: February 27, 2019
    Publication date: December 24, 2020
    Inventors: Hiroki YAMADA, Koji SHINODA
  • Patent number: 10797430
    Abstract: A connector 22 includes a housing 31, a plate 32, a plurality of terminals 33 and a potting material 34. The housing 31 is formed by insert molding with the plate 32 and the plurality of terminals 33 as cores. The housing 31 includes a separation wall 31b held in close contact with a first surface 32a of the plate 32, and this separation wall 31b is held in close contact with side surfaces of the terminals 33.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: October 6, 2020
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Koji Shinoda
  • Publication number: 20200106206
    Abstract: A connector (10) includes a first terminal (62) and a second terminal (32), and a first holding portion (72) and a second holding portion (42) configured to coat around the first terminal (62) and the second terminal (32) with resin. The first holding portion (72) and the second holding portion (42) are stacked one over the other in the height direction. The first terminal (62) has an exposed surface (62H) exposed on a resin surface of the first holding portion (72). The second holding portion (42) covers the exposed surface (62H) of the first terminal (62) while being stacked on or below the first holding portion (72).
    Type: Application
    Filed: September 19, 2019
    Publication date: April 2, 2020
    Inventor: Koji Shinoda
  • Publication number: 20190326704
    Abstract: A connector 22 includes a housing 31, a plate 32, a plurality of terminals 33 and a potting material 34. The housing 31 is formed by insert molding with the plate 32 and the plurality of terminals 33 as cores. The housing 31 includes a separation wall 31b held in close contact with a first surface 32a of the plate 32, and this separation wall 31b is held in close contact with side surfaces of the terminals 33.
    Type: Application
    Filed: December 8, 2017
    Publication date: October 24, 2019
    Inventor: Koji SHINODA
  • Patent number: 10289227
    Abstract: A method for manufacturing a touch sensing device including at least 1) to 5) as follows: 1) preparing a material film being biaxially stretched and including an available area that is a partial area in a widthwise direction of the material film, the available area extending in a lengthwise direction of the material film and including first and second segments, the first and second segments defining different areas in the lengthwise direction; 2) forming an electrode group on one of the first and second segments; 3) cutting a first piece out of the material film to make the first piece including the first segment; 4) cutting a second piece out of the material film to make the second piece including the second segment; and 5) bonding the first segment to the second segment, substantially maintaining orientations of the first segment and the second segment as before the cutting.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: May 14, 2019
    Assignee: HOSIDEN CORPORATION
    Inventor: Koji Shinoda
  • Patent number: 10289255
    Abstract: A touch sensing device including first electrodes at a first height, and second electrodes and first ground electrodes at a second height. The first electrodes are spaced apart along a first direction and each include first and second overlapping portions. The second electrodes are spaced apart along a second direction and include pairs of adjacent second electrodes. The second electrodes each include wide and narrow portions. The wide portions are spaced apart in the first direction and include pairs of adjacent wide portions. Each narrow portion is smaller in the second direction than each wide portion and interconnects the corresponding adjacent wide portions. The narrow portions overlap the corresponding first overlapping portions. Each first ground electrode, located between the corresponding adjacent second electrodes, includes first and second portions. Each first portion is located between the corresponding wide portions.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: May 14, 2019
    Assignee: HOSIDEN CORPORATION
    Inventor: Koji Shinoda
  • Patent number: 10261645
    Abstract: A touch sensing device including first electrodes and second electrodes. The first electrodes at a first height position are spaced apart along a first direction and each include an electrode body of strip shape extending in a second direction. The electrode body of each first electrode includes first overlapping portions. The second electrodes at a second height position are spaced apart along the second direction and intersect the first electrodes. Each second electrode includes wide portions and narrow portions. The wide portions of each second electrode are spaced apart along the first direction and include pairs of adjacent wide portions. The adjacent wide portions of each pair are located adjacent to each other in the first direction. Each narrow portion is smaller in the second direction than each wide portion, interconnects the adjacent wide portions of a corresponding pair, and overlaps a corresponding one of the first overlapping portions.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: April 16, 2019
    Assignee: HOSIDEN CORPORATION
    Inventor: Koji Shinoda
  • Patent number: 10154602
    Abstract: The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: December 11, 2018
    Assignee: HOSIDEN CORPORATION
    Inventors: Takeshi Isoda, Koji Shinoda
  • Publication number: 20180113532
    Abstract: A touch sensing device including first electrodes at a first height, and second electrodes and first ground electrodes at a second height. The first electrodes are spaced apart along a first direction and each include first and second overlapping portions. The second electrodes are spaced apart along a second direction and include pairs of adjacent second electrodes. The second electrodes each include wide and narrow portions. The wide portions are spaced apart in the first direction and include pairs of adjacent wide portions. Each narrow portion is smaller in the second direction than each wide portion and interconnects the corresponding adjacent wide portions. The narrow portions overlap the corresponding first overlapping portions. Each first ground electrode, located between the corresponding adjacent second electrodes, includes first and second portions. Each first portion is located between the corresponding wide portions.
    Type: Application
    Filed: October 19, 2017
    Publication date: April 26, 2018
    Inventor: Koji SHINODA
  • Publication number: 20180113533
    Abstract: A touch sensing device including first electrodes and second electrodes. The first electrodes at a first height position are spaced apart along a first direction and each include an electrode body of strip shape extending in a second direction. The electrode body of each first electrode includes first overlapping portions. The second electrodes at a second height position are spaced apart along the second direction and intersect the first electrodes. Each second electrode includes wide portions and narrow portions. The wide portions of each second electrode are spaced apart along the first direction and include pairs of adjacent wide portions. The adjacent wide portions of each pair are located adjacent to each other in the first direction. Each narrow portion is smaller in the second direction than each wide portion, interconnects the adjacent wide portions of a corresponding pair, and overlaps a corresponding one of the first overlapping portions.
    Type: Application
    Filed: October 19, 2017
    Publication date: April 26, 2018
    Inventor: Koji SHINODA
  • Patent number: 9939918
    Abstract: An input device including a base, a plastic part provided on the base, and a touch sensor embedded in the plastic part. Embedding the touch sensor in the plastic part contributes to the reduction of the distance from an outer face of the base to the touch sensor, thereby improving the sensitivity of the touch sensor. Embedding the touch sensor in the plastic part also makes it possible to omit a step of fixing the touch sensor to the plastic part, thereby improving the yield rate of the input device.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: April 10, 2018
    Assignee: HOSIDEN CORPORATION
    Inventors: Koji Shinoda, Takeshi Isoda
  • Publication number: 20180088714
    Abstract: A method for manufacturing a touch sensing device including at least 1) to 5) as follows: 1) preparing a material film being biaxially stretched and including an available area that is a partial area in a widthwise direction of the material film, the available area extending in a lengthwise direction of the material film and including first and second segments, the first and second segments defining different areas in the lengthwise direction; 2) forming an electrode group on one of the first and second segments; 3) cutting a first piece out of the material film to make the first piece including the first segment; 4) cutting a second piece out of the material film to make the second piece including the second segment; and 5) bonding the first segment to the second segment, substantially maintaining orientations of the first segment and the second segment as before the cutting.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 29, 2018
    Inventor: Koji Shinoda
  • Patent number: 9872409
    Abstract: The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: January 16, 2018
    Assignee: HOSIDEN CORPORATION
    Inventors: Takeshi Isoda, Koji Shinoda
  • Publication number: 20170010713
    Abstract: A capacitive sensor includes an insulator substrate, a detecting electrode formed on one face of the insulator substrate by arranging a first electric wire to provide a plurality of first annular portions, and a driving electrode formed on the other face of the insulator substrate by arranging a second electric wire to provide a plurality of second annular portions. In a region where the detecting electrode and the driving electrode of the insulator substrate are overlapped with each other as seen in a plan view, the second electric wire is arranged such that a plurality of corner portions of the second annular portion are contained within the first annular portion.
    Type: Application
    Filed: June 27, 2016
    Publication date: January 12, 2017
    Inventor: Koji Shinoda
  • Publication number: 20160366779
    Abstract: The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.
    Type: Application
    Filed: August 26, 2016
    Publication date: December 15, 2016
    Applicant: HOSIDEN CORPORATION
    Inventors: Takeshi ISODA, Koji SHINODA
  • Patent number: 9253908
    Abstract: The invention provides a device module including a device, a connecting part, and a plastic part. The device is a sensor, an electronic component, or a circuit board. The connecting part is connected to the device and includes an external connecting portion. The device and the connecting part are embedded in the plastic part. The plastic part is provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: February 2, 2016
    Assignee: HOSIDEN CORPORATION
    Inventors: Koji Shinoda, Takeshi Isoda
  • Publication number: 20140300834
    Abstract: A conductive sheet pair that does not impair visibility when being stacked is provided. The conductive sheet pair includes a first conductive sheet including a first conductive pattern including a first pattern region in which a plurality of repetitions of a first geometric figure formed of conductive lines are arranged and a first blank region in which the repetitions of the first geometric figure are not arranged, and a second conductive sheet including a second conductive pattern including a second pattern region in which a plurality of repetitions of a second geometric figure formed of conductive lines are arranged and a second blank region in which the repetitions of the second geometric figure are not arranged. The sizes and the relative positions of the first blank region and the second blank region are adjusted so that the first pattern region and the second pattern region do not overlap each other when the first conductive sheet and the second conductive sheet are aligned and stacked together.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 9, 2014
    Applicant: HOSIDEN CORPORATION
    Inventor: Koji SHINODA
  • Patent number: 8801046
    Abstract: A connector for gas piping for detachably connecting gas tubes (T) corresponding to mating pipes (54) provided in a mating connector (50) is provided with a housing main body (10) connectable to the mating connector (50), a sub-connector (30) provided in the housing main body (10), joint pipes (32) connectable to the mating pipes (54) and having the gas tubes (T) connected thereto, and an engaging mechanism for holding the sub-connector (30) and the housing main body (10) in an engaged state.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: August 12, 2014
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Koji Shinoda
  • Patent number: 8756474
    Abstract: A method for initiating a refresh operation of a solid-state nonvolatile memory device coupled to a processor is disclosed. The method comprises determining an error number for a block of the solid-state nonvolatile memory. The error number corresponds to an amount of error bits in a page of the block having a greatest amount of error bits. The method further comprises comparing the error number with an error threshold and determining a reset number indicating an amount of times that the processor has been reset since a previous refresh operation was performed on the block of the solid-state nonvolatile memory. The method further includes comparing the number of resets with a reset threshold and refreshing the block of the solid-state nonvolatile memory when the number of errors exceeds the error threshold and the number of resets exceeds the reset threshold.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: June 17, 2014
    Assignees: DENSO International America, Inc., Denso Corporation
    Inventors: Hiroaki Shibata, Koji Shinoda, Brian W. Hughes
  • Patent number: 8751774
    Abstract: A system and method for controlling messaging between a first processor and a second processor is disclosed. The second processor controls one or more peripheral devices on behalf of a plurality of predetermined tasks being executed by the first processor. The system includes a message control module that receives an input message intended for the second processor from the first processor and maintains a message history based on the received input message and previously received input messages. The message history indicates which peripheral devices of the system are to be on and which tasks of the plurality of tasks requested the peripheral devices to be on. The message control module is further configured to generate an output message that includes output instructions for the second processor based on the message history and an output duration based on the message history. The second processor executes the output instructions.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: June 10, 2014
    Assignees: DENSO International America, Inc., Denso Corporation
    Inventors: Wan-ping Yang, Koji Shinoda, Hiroaki Shibata