Patents by Inventor Koji Tsuduki

Koji Tsuduki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220030716
    Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Inventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
  • Patent number: 11164803
    Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: November 2, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
  • Patent number: 10958860
    Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 23, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Satoshi Nozu, Yu Aoki, Koji Tsuduki
  • Publication number: 20200075437
    Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.
    Type: Application
    Filed: August 14, 2019
    Publication date: March 5, 2020
    Inventors: Satoshi Nozu, Yu Aoki, Hirotaka Sekiguchi, Koji Sato, Koji Tsuduki
  • Publication number: 20200029039
    Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 23, 2020
    Inventors: Satoshi Nozu, Yu Aoki, Koji Tsuduki
  • Patent number: 10319767
    Abstract: An optical member includes a first region and a second region constituting an interface with an adhesive member. The first region is disposed outside the second region in a second direction intersecting a first direction. An adhesive force generated at an interface between the first region and the adhesive member is smaller than an adhesive force generated at an interface between the second region and the adhesive member.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: June 11, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuya Notsu, Koji Tsuduki, Kunihiro Abe
  • Patent number: 9978675
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: May 22, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Publication number: 20170338267
    Abstract: An optical member includes a first region and a second region constituting an interface with an adhesive member. The first region is disposed outside the second region in a second direction intersecting a first direction. An adhesive force generated at an interface between the first region and the adhesive member is smaller than an adhesive force generated at an interface between the second region and the adhesive member.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 23, 2017
    Inventors: Kazuya Notsu, Koji Tsuduki, Kunihiro Abe
  • Patent number: 9815133
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9774769
    Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: September 26, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20170150601
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 25, 2017
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Patent number: 9585287
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: February 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Publication number: 20160366774
    Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.
    Type: Application
    Filed: June 8, 2016
    Publication date: December 15, 2016
    Inventors: Shin Hasegawa, Fujio Ito, Takanori Suzuki, Takao Toyoka, Tadashi Kosaka, Yasushi Kurihara, Koji Tsuduki
  • Publication number: 20160119564
    Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.
    Type: Application
    Filed: September 29, 2015
    Publication date: April 28, 2016
    Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20160044796
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 11, 2016
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9253922
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: February 2, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 9225882
    Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: December 29, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takamasa Sakuragi, Takanori Suzuki, Koji Tsuduki
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 9209330
    Abstract: A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: December 8, 2015
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Yasushi Kurihara
  • Patent number: 9197795
    Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: November 24, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takamasa Sakuragi, Takanori Suzuki, Koji Tsuduki