Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Abstract: A semiconductor device has an island portion on which a semiconductor chip is adhered through intermediation of an insulating paste. Recessed portions having an inverted pyramid shape are formed in a semiconductor chip placing region of the island portion. A first opening angle formed by a normal extending upward from a vertex of each of the plurality of recessed portions each having an inverted pyramid shape and an opening line extending to an outer side of the semiconductor chip placing region is smaller than a second opening angle formed by the normal and an opening line extending to an inner side of the semiconductor chip placing region.

Abstract: A package for an optical sensor device has a double molding structure in which a first resin molded portion (1) and a second resin molded portion (2) are subjected to contact fitting. The first resin molded portion (1) has a structure in which peripheries of a die pad portion (8) on which an optical sensor element (5) is mounted and a part of leads (3a, 3b) are molded with a resin so as to be integrated. The second resin molded portion (2) has a structure in which the periphery of the first resin molded portion (1) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate (4) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.

Abstract: An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.

Abstract: Provided is a downsized semiconductor device having high reliability. A plurality of recessed portions (2) each having an inverted pyramid shape are formed in a semiconductor chip placing region (3) provided on a surface of an island portion (1) on which a semiconductor chip is to be mounted. The recessed portions (2) are arranged so that at least one side of the recessed portion (2) having an inverted pyramid shape faces in parallel to the periphery of the rectangular semiconductor chip placing region (3), which is closest thereto, and the corner of the recessed portion (2) opposite to the side faces the inner side of the semiconductor chip placing region (3).

Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Abstract: A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.

Abstract: Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (2), a glass substrate (9) with a cavity having divided and exposed through-hole electrodes (5) on the periphery thereof, and an optical sensor element (3) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.

Abstract: Provided is a low-cost, compact, high-reliability optical sensor device serving to correspond to the visibility. In the optical sensor device, an optical sensor element is mounted in a package formed by a light shielding glass lid substrate (1) having a filter function in part and a light shielding glass substrate (2) including a cavity. In the light shielding glass lid substrate having the filter function, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded in part. The light shielding glass substrate is made of glass having light shielding property as its own property.

Abstract: Provided is a method of manufacturing an optical filter for an illuminance sensor, which has spectral characteristics close to human luminosity characteristics, has high detection accuracy, and can be manufactured at low cost. The method includes the steps of: (a) punching a glass; (b) feeding a small piece of glass (7) having a filter effect; (c) softening the small piece of glass (7); and (d) abrading.

Abstract: A light emitting device (1) includes a glass substrate (4) having a recess (2) in a front surface, and a lead frame (5a). A copper material (7) is embedded so that the copper material (7) passes through the lead frame (5a). A light emitting element (6) is mounted on the copper material (7). The glass substrate (4) and the lead frame (5a) are bonded to each other so that the light emitting element (6) is exposed from the recess of the glass substrate (4). Thus, the copper material is embedded in a pass-through manner directly under a region of the lead frame where the light emitting element is disposed. Therefore, adhesion between the glass substrate and the lead frame is ensured, and heat generated by the light emitting element may be efficiently radiated from the rear surface of the glass substrate.

Abstract: On a through-electrode (7) formed by filling a conductive material into a though hole of a substrate, nano-metal particles are adhered to form a connection electrode (9). An LED element (3) is electrically connected to the through-electrode (7) via the connection electrode (9). The nano-metal particles can be applied into a desired shape by an inkjet method or a dispenser method, and hence a light emitting device (1) having high electrical connection reliability is realized at low cost.

Abstract: In an optical disk recording and reproducing device which uses an optical disk having at least a first recording layer and a second recording layer, a thickness of a spacer section between the first recording layer and the second recording layer is measured, an amount of defocus with respect to the second recording layer is set based on the measured spacer thickness, and a focus servo operation is performed for focusing the laser light irradiated from an optical pickup device on the second recording layer.

Abstract: A DC voltage value is obtained at least at an inside position, an intermediate position, and an outside position on a disc (1) from a drive signal that is supplied to a focusing coil (4) built into an optical pickup (2). From the DC voltage values is obtained a relationship of a position between the respective positions and the DC voltage value, and this relationship is stored into a memory circuit (12). Then, during recording or playback, the DC voltage value that is calculated on the basis of the recording or playback position of the signal at that time and the AC signal included in the drive signal that is supplied to the focusing coil (4) are added to create a signal to be supplied to a tilt adjustment coil (6).

Abstract: In an optical disk recording and reproducing device which uses an optical disk having at least a first recording layer and a second recording layer, a thickness of a spacer section between the first recording layer and the second recording layer is measured, an amount of defocus with respect to the second recording layer is set based on the measured spacer thickness, and a focus servo operation is performed for focusing the laser light irradiated from an optical pickup device on the second recording layer.

Abstract: A light-emitting element is mounted in a cup-like portion formed on a substrate and a case. The cup-like portion is filled with a sealing member made of a light-transmissible resin. A layer made of a material having a refractive index lower than that of the sealing member is provided between the sealing member and a surface of the case.

Abstract: A DC voltage value is obtained at least at an inside position, an intermediate position, and an outside position on a disc (1) from a drive signal that is supplied to a focusing coil (4) built into an optical pickup (2). From the DC voltage values is obtained a relationship of a position between the respective positions and the DC voltage value, and this relationship is stored into a memory circuit (12). Then, during recording or playback, the DC voltage value that is calculated on the basis of the recording or playback position of the signal at that time and the AC signal included in the drive signal that is supplied to the focusing coil (4) are added to create a signal to be supplied to a tilt adjustment coil (6).

Abstract: A light-emitting element is mounted in a cup-like portion formed on a substrate and a case. The cup-like portion is filled with a sealing member made of a light-transmissible resin. A layer made of a material having a refractive index lower than that of the sealing member is provided between the sealing member and a surface of the case.