Patents by Inventor Koji Yoshii

Koji Yoshii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10385453
    Abstract: A film forming apparatus for performing a predetermined film forming process on a substrate mounted on an upper surface of a rotary table installed within a process vessel while rotating the rotary table and heating the substrate by a heating part, includes: a contact type first temperature measuring part configured to measure a temperature of the heating part; a non-contact type second temperature measuring part configured to measure a temperature of the substrate; and a control part configured to control a power supplied to the heating part based on at least one among a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part. The control part changes a method for controlling the power when the predetermined film forming process is performed on the substrate and when the substrate is loaded into or unloaded from the process vessel.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: August 20, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masato Yonezawa, Shigehiro Miura, Hiroyuki Akama, Koji Yoshii
  • Patent number: 10099811
    Abstract: A method for manufacturing a bottle including forming the bottle (10) that is formed in a bottomed tubular shape and has a bottom wall section (19) provided with a contact part (18) positioned at an outer circumferential edge thereof and a deformable tube part that is of a multilevel topped tubular shape, is provided upright at the contact part (18), and blocks an inside of the contact part (18); the method having a primary blow molding process of performing biaxial stretch blow molding on a preform to obtain a primary intermediate molded article; a heat treatment process of heating the primary intermediate molded article to be forcibly shrunken and molded into a secondary intermediate molded article; and a secondary blow molding process of performing blow molding on the secondary intermediate molded article to obtain the bottle (10).
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 16, 2018
    Assignee: YOSHINO KOGYOSHO CO., LTD.
    Inventors: Takanori Suzuki, Koji Yoshii
  • Publication number: 20180197759
    Abstract: Disclosed is a heat treatment apparatus including: a processing container configured to accommodate a substrate; a furnace body having a heater configured to heat the substrate accommodated in the processing container and provided around the processing container; a blower configured to supply a coolant to a space between the processing container and the furnace body; and a controller having a continuous operation mode in which the blower is continuously energized and an intermittent operation mode in which energization and de-energization of the blower are repeated, and configured to control driving of the blower based on an instruction voltage. The controller drives the blower in the intermittent operation mode when the instruction voltage is higher than 0 V and lower than a predetermined threshold voltage.
    Type: Application
    Filed: January 8, 2018
    Publication date: July 12, 2018
    Inventors: Tatsuya Yamaguchi, Kazuteru Obara, Yasuaki Kikuchi, Koji Yoshii
  • Patent number: 9909809
    Abstract: The heat treatment apparatus includes: a processing chamber which accommodates a processing object; a heating unit which heats the processing object accommodated in the processing chamber; a temperature detecting unit which detects an internal temperature of the processing chamber; and a controller which sets a second setting temperature identical to as a temperature detected by the temperature detecting unit when the temperature detected by the temperature detecting unit falls below a predetermined first setting temperature due to an external disturbance; controls the heating unit so that a third setting temperature between the second setting temperature and the first setting temperature becomes identical to the temperature detected by the temperature detecting unit; and controls the heating unit so that the first setting temperature becomes identical to the temperature detected by the temperature detecting unit after the third setting temperature becomes identical to the temperature detected by the temperat
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: March 6, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Goro Takahashi, Takanori Saito, Wenling Wang, Koji Yoshii, Tatsuya Yamaguchi
  • Patent number: 9905442
    Abstract: Disclosed is a heat treatment apparatus including: a heating unit that heats an inside of a processing chamber that accommodates a plurality of workpieces; a temperature drop rate model storing unit that stores a temperature drop rate model; and a heat treatment performing unit that sets the temperature drop rate model stored in the temperature drop model storing unit and sets the inside of the processing chamber to the temperature and the time represented in the temperature drop rate model. The temperature drop rate model storing unit stores a plurality of temperature drop rate models, each of which has a different temperature drop rate. The processing chamber is divided into a plurality of zones, and the temperature drop rate mode is set for each of the zones. The heat treatment performing unit sets different temperature drop rate models in a plurality of zones to heat the plurality of workpieces.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: February 27, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Yamaguchi, Koji Yoshii, Masafumi Shoji
  • Patent number: 9748122
    Abstract: A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When a temperature is increased or decreased, the control unit can select the small-number control zone model so as to control, based on signals from temperature sensors of the respective control zones C1 . . . C5 whose number is small, heaters located on the respective control zones C1 . . . C5. When a temperature is stabilized, the control unit can select the large-number control zone model so as to control, based on signals signals from the temperature sensors of the respective control zones C1 . . . C10 whose number is large, the heaters located on the respective control zones C1 . . . C10.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: August 29, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Wenling Wang, Takanori Saito
  • Publication number: 20170051403
    Abstract: A film forming apparatus for performing a predetermine film forming process on a substrate mounted on an upper surface of a rotary table installed within a process vessel while rotating the rotary table and heating the substrate by a heating part, includes: a contact type first temperature measuring part configured to measure a temperature of the heating part; a non-contact type second temperature measuring part configured to measure a temperature of the substrate; and a control part configured to control a power supplied to the heating part based on at least one among a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part. The control part changes a method for controlling the power when the predetermined film forming process is performed on the substrate and when the substrate is loaded into or unloaded from the process vessel.
    Type: Application
    Filed: August 18, 2016
    Publication date: February 23, 2017
    Inventors: Masato YONEZAWA, Shigehiro MIURA, Hiroyuki AKAMA, Koji YOSHII
  • Publication number: 20170003171
    Abstract: A temperature measuring method for measuring a temperature in a processing vessel of a semiconductor manufacturing apparatus by a radiation temperature measurement part, which is configured to measure a temperature by detecting infrared rays radiated from an object, includes: detecting infrared rays radiated from a low resistance silicon wafer having a resistivity of 0.02 ?·cm or less at room temperature (20 degrees C.) by the radiation temperature measurement part.
    Type: Application
    Filed: June 24, 2016
    Publication date: January 5, 2017
    Inventors: Yuki WADA, Koji YOSHII, Kazuteru OBARA
  • Publication number: 20160379897
    Abstract: There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.
    Type: Application
    Filed: June 24, 2016
    Publication date: December 29, 2016
    Inventors: Kazuteru OBARA, Koji YOSHII, Yuki WADA, Hitoshi KIKUCHI
  • Publication number: 20160363373
    Abstract: The controller receives information including a plurality of evaluation indexes, a weight of each evaluation index, the number of times for calculating a value of an evaluation function, and initial parameter values, and performs a simulation based on the received information. Then, the controller calculates a value of an evaluation function based on a result of the simulation, and determines whether the calculated value of the evaluation function is minimum, to update parameters when it is determined that the value of the evaluation function is minimum. In the calculation of a value of the evaluation function, a value of the evaluation function is calculated again based on the number of times for calculating a value of an evaluation function. The controller generates new parameters by a genetic algorithm when a value of an evaluation function is calculated again.
    Type: Application
    Filed: June 3, 2016
    Publication date: December 15, 2016
    Inventors: Yuto Noda, Tatsuya Yamaguchi, Masayoshi Masunaga, Koji Yoshii
  • Publication number: 20160304232
    Abstract: A method for manufacturing a bottle including forming the bottle (10) that is formed in a bottomed tubular shape and has a bottom wall section (19) provided with a contact part (18) positioned at an outer circumferential edge thereof and a deformable tube part that is of a multilevel topped tubular shape, is provided upright at the contact part (18), and blocks an inside of the contact part (18); the method having a primary blow molding process of performing biaxial stretch blow molding on a preform to obtain a primary intermediate molded article; a heat treatment process of heating the primary intermediate molded article to be forcibly shrunken and molded into a secondary intermediate molded article; and a secondary blow molding process of performing blow molding on the secondary intermediate molded article to obtain the bottle (10).
    Type: Application
    Filed: January 23, 2015
    Publication date: October 20, 2016
    Applicant: YOSHINO KOGYOSHO CO., LTD.
    Inventors: Takanori SUZUKI, Koji YOSHII
  • Publication number: 20160293457
    Abstract: Disclosed is a heat treatment apparatus including: a heating unit that heats an inside of a processing chamber that accommodates a plurality of workpieces; a temperature drop rate model storing unit that stores a temperature drop rate model; and a heat treatment performing unit that sets the temperature drop rate model stored in the temperature drop model storing unit and sets the inside of the processing chamber to the temperature and the time represented in the temperature drop rate model. The temperature drop rate model storing unit stores a plurality of temperature drop rate models, each of which has a different temperature drop rate. The processing chamber is divided into a plurality of zones, and the temperature drop rate mode is set for each of the zones. The heat treatment performing unit sets different temperature drop rate models in a plurality of zones to heat the plurality of workpieces.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Inventors: Tatsuya Yamaguchi, Koji Yoshii, Masafumi Shoji
  • Patent number: 9324591
    Abstract: A heat treatment apparatus including: a processing container for processing wafers held in a boat; heaters for heating the processing container; and a control section for controlling the heaters. Heater temperature sensors are provided between the heaters and the processing container, in-container temperature sensors are provided in the processing container, and movable temperature sensors are provided in the boat. The temperature sensors are connected to a temperature estimation section. The temperature estimation section selects two of the three types of temperature sensors, e.g. the movable temperature sensors and the in-container temperature sensors, and determines the temperature of a wafer according to the following formula: T=T1×(1??)+T2×?, ?>1, where T1 and T2 represent detection temperatures of the selected temperature sensors, and ? represents a mixing ratio.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: April 26, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Wenling Wang, Takanori Saito
  • Patent number: 9255736
    Abstract: A heat treatment apparatus and control method enabling the apparatus to settle down an internal temperature of a treating vessel to a target temperature accurately and quickly. The heat treatment apparatus includes a furnace body with a heater on an inner circumferential surface thereof, the treating vessel disposed inside the furnace body, a cooling medium supply blower and cooling medium release blower each connected to the furnace body, and a temperature sensor provided inside the treating vessel. A signal from the temperature sensor is sent to a heater output computing unit and blower output computing unit included in a controller. The heater output computing unit determines a heater output level based on a heater output numerical model and the signal from the temperature sensor. The blower output computing unit determines a blower output level based on a blower output numerical model and the signal from the temperature sensor.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: February 9, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Wenling Wang, Takanori Saito
  • Patent number: 9207665
    Abstract: The heat treatment apparatus that increases a temperature of a processing object and performs a heat treatment in a constant temperature, the heat treatment apparatus includes: a processing chamber which accommodates the processing object; a heating unit which heats the processing object accommodated in the processing chamber; a memory unit which stores two or more temperature control models that are previously created, a temperature controller which controls a temperature of the heating unit; and an apparatus controller which controls the temperature controller and the memory unit, wherein the apparatus controller selects a temperature control model among the two or more temperature control models according to desired heat treatment conditions, and wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: December 8, 2015
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Goro Takahashi, Takahito Kasai, Takanori Saito, Wenling Wang, Koji Yoshii, Tatsuya Yamaguchi
  • Patent number: 9209057
    Abstract: Provided is a method of controlling temperatures of objects to be heated in a heating unit by adjusting a heating rate of each of a plurality of heating elements, based on temperature detection values detected at a plurality of temperature detection elements, wherein the plurality of temperature detection elements are positioned at different positions and the plurality of heating elements are positioned at different positions. The method includes estimating a temperature of each of the plurality of temperature detection elements by using a first estimation algorithm when one of the plurality of temperature detection elements is broken, based on the temperature detection values of the temperature detection elements excluding the broken temperature detection element, and controlling the temperatures of the objects to be heated based on the estimated temperatures.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: December 8, 2015
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Wenling Wang, Takanori Saito
  • Patent number: 8835811
    Abstract: A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When a temperature is increased or decreased, the control unit can select the small-number control zone model so as to control, based on signals from temperature sensors of the respective control zones C1 . . . C5 whose number is small, heaters located on the respective control zones C1 . . . C5. When a temperature is stabilized, the control unit can select the large-number control zone model so as to control, based on signals from the temperature sensors of the respective control zones C1 . . . C10 whose number is large, the heaters located on the respective control zones C1 . . . C10.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 16, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Wenling Wang, Takanori Saito
  • Patent number: 8821014
    Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: September 2, 2014
    Assignees: Tokyo Electron Limited, Fenwal Controls of Japan, Ltd.
    Inventors: Takanori Saito, Koji Yoshii, Tsutomu Kurihara, Tomoya Okamura
  • Publication number: 20140238972
    Abstract: A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When a temperature is increased or decreased, the control unit can select the small-number control zone model so as to control, based on signals from temperature sensors of the respective control zones C1 . . . C5 whose number is small, heaters located on the respective control zones C1 . . . C5. When a temperature is stabilized, the control unit can select the large-number control zone model so as to control, based on signals signals from the temperature sensors of the respective control zones C1 . . . C10 whose number is large, the heaters located on the respective control zones C1 . . . C10.
    Type: Application
    Filed: May 6, 2014
    Publication date: August 28, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Koji YOSHII, Tatsuya YAMAGUCHI, Wenling WANG, Takanori SAITO
  • Publication number: 20140211830
    Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 31, 2014
    Applicants: Fenwal Controls Of Japan, Ltd., TOKYO ELECTRON LIMITED
    Inventors: TAKANORI SAITO, KOJI YOSHII, TSUTOMU KURIHARA, TOMOYA OKAMURA