Patents by Inventor Kosei Nei

Kosei Nei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10910359
    Abstract: A transistor includes a first insulator over a substrate; a first oxide thereover; a second oxide in contact with at least part of the top surface of the first oxide; a first conductor and a second conductor each in contact with at least part of the top surface of the second oxide; a third oxide that is over the first conductor and the second conductor and is in contact with at least part of the top surface of the second oxide; a second insulator thereover; a third conductor which is over the second insulator and at least part of which overlaps with a region between the first conductor and the second conductor; and a third insulator which is over the third conductor and at least part of which is in contact with the top surface of the first insulator. The thickness of a region of the first insulator that is in contact with the third insulator is less than the thickness of a region of the first insulator that is in contact with the first oxide.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: February 2, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Naoki Okuno, Kosei Nei, Hiroaki Honda, Naoto Yamade, Hiroshi Fujiki
  • Publication number: 20200273886
    Abstract: A semiconductor device which can suppress leakage current between a wiring and a connection electrode connected to a floating node is provided. The semiconductor device includes a first insulator, a first conductor over the first insulator, a second conductor over the first insulator, and a second insulator over the first insulator, the first conductor, and the second conductor. The first conductor and the second conductor contain a metal A (one kind or a plurality of kinds of aluminum, copper, tungsten, chromium, silver, gold, platinum, tantalum, nickel, molybdenum, magnesium, beryllium, indium, and ruthenium). The metal A is detected in an interface between the first insulator and the second insulator by an energy dispersive X-ray spectroscopy (EDX). The second insulator includes a groove for exposing the first insulator between the first conductor and the second conductor.
    Type: Application
    Filed: March 12, 2020
    Publication date: August 27, 2020
    Inventors: Hajime KIMURA, Tsutomu MURAKAWA, Kosei NEI, Hiroaki HONDA, Yusuke SHINO
  • Patent number: 10658395
    Abstract: A semiconductor device which can suppress leakage current between a wiring and a connection electrode connected to a floating node is provided. The semiconductor device includes a first insulator, a first conductor over the first insulator, a second conductor over the first insulator, and a second insulator over the first insulator, the first conductor, and the second conductor. The first conductor and the second conductor contain a metal A (one kind or a plurality of kinds of aluminum, copper, tungsten, chromium, silver, gold, platinum, tantalum, nickel, molybdenum, magnesium, beryllium, indium, and ruthenium). The metal A is detected in an interface between the first insulator and the second insulator by an energy dispersive X-ray spectroscopy (EDX). The second insulator includes a groove for exposing the first insulator between the first conductor and the second conductor.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 19, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hajime Kimura, Tsutomu Murakawa, Kosei Nei, Hiroaki Honda, Yusuke Shino
  • Publication number: 20200006319
    Abstract: A transistor includes a first insulator over a substrate; a first oxide thereover; a second oxide in contact with at least part of the top surface of the first oxide; a first conductor and a second conductor each in contact with at least part of the top surface of the second oxide; a third oxide that is over the first conductor and the second conductor and is in contact with at least part of the top surface of the second oxide; a second insulator thereover; a third conductor which is over the second insulator and at least part of which overlaps with a region between the first conductor and the second conductor; and a third insulator which is over the third conductor and at least part of which is in contact with the top surface of the first insulator. The thickness of a region of the first insulator that is in contact with the third insulator is less than the thickness of a region of the first insulator that is in contact with the first oxide.
    Type: Application
    Filed: September 5, 2019
    Publication date: January 2, 2020
    Inventors: Naoki OKUNO, Kosei NEI, Hiroaki HONDA, Naoto YAMADE, Hiroshi FUJIKI
  • Patent number: 10411003
    Abstract: A transistor includes a first insulator over a substrate; a first oxide thereover; a second oxide in contact with at least part of the top surface of the first oxide; a first conductor and a second conductor each in contact with at least part of the top surface of the second oxide; a third oxide that is over the first conductor and the second conductor and is in contact with at least part of the top surface of the second oxide; a second insulator thereover; a third conductor which is over the second insulator and at least part of which overlaps with a region between the first conductor and the second conductor; and a third insulator which is over the third conductor and at least part of which is in contact with the top surface of the first insulator. The thickness of a region of the first insulator that is in contact with the third insulator is less than the thickness of a region of the first insulator that is in contact with the first oxide.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: September 10, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Naoki Okuno, Kosei Nei, Hiroaki Honda, Naoto Yamade, Hiroshi Fujiki
  • Patent number: 10186604
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: January 22, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshinori Ando, Hidekazu Miyairi, Naoto Yamade, Asako Higa, Miki Suzuki, Yoshinori Ieda, Yasutaka Suzuki, Kosei Nei, Shunpei Yamazaki
  • Publication number: 20180286886
    Abstract: A semiconductor device which can suppress leakage current between a wiring and a connection electrode connected to a floating node is provided. The semiconductor device includes a first insulator, a first conductor over the first insulator, a second conductor over the first insulator, and a second insulator over the first insulator, the first conductor, and the second conductor. The first conductor and the second conductor contain a metal A (one kind or a plurality of kinds of aluminum, copper, tungsten, chromium, silver, gold, platinum, tantalum, nickel, molybdenum, magnesium, beryllium, indium, and ruthenium). The metal A is detected in an interface between the first insulator and the second insulator by an energy dispersive X-ray spectroscopy (EDX). The second insulator includes a groove for exposing the first insulator between the first conductor and the second conductor.
    Type: Application
    Filed: March 19, 2018
    Publication date: October 4, 2018
    Inventors: Hajime KIMURA, Tsutomu MURAKAWA, Kosei NEI, Hiroaki HONDA, Yusuke SHINO
  • Publication number: 20180108647
    Abstract: A transistor includes a first insulator over a substrate; a first oxide thereover; a second oxide in contact with at least part of the top surface of the first oxide; a first conductor and a second conductor each in contact with at least part of the top surface of the second oxide; a third oxide that is over the first conductor and the second conductor and is in contact with at least part of the top surface of the second oxide; a second insulator thereover; a third conductor which is over the second insulator and at least part of which overlaps with a region between the first conductor and the second conductor; and a third insulator which is over the third conductor and at least part of which is in contact with the top surface of the first insulator. The thickness of a region of the first insulator that is in contact with the third insulator is less than the thickness of a region of the first insulator that is in contact with the first oxide.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 19, 2018
    Inventors: Naoki OKUNO, Kosei NEI, Hiroaki HONDA, Naoto YAMADE, Hiroshi FUJIKI
  • Publication number: 20180102420
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Application
    Filed: October 2, 2017
    Publication date: April 12, 2018
    Inventors: Yoshinori ANDO, Hidekazu MIYAIRI, Naoto YAMADE, Asako HIGA, Miki SUZUKI, Yoshinori IEDA, Yasutaka SUZUKI, Kosei NEI, Shunpei YAMAZAKI
  • Patent number: 9780201
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 3, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshinori Ando, Hidekazu Miyairi, Naoto Yamade, Asako Higa, Miki Suzuki, Yoshinori Ieda, Yasutaka Suzuki, Kosei Nei, Shunpei Yamazaki
  • Publication number: 20160336433
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Application
    Filed: July 29, 2016
    Publication date: November 17, 2016
    Inventors: Yoshinori ANDO, Hidekazu MIYAIRI, Naoto YAMADE, Asako HIGA, Miki SUZUKI, Yoshinori IEDA, Yasutaka SUZUKI, Kosei NEI, Shunpei YAMAZAKI
  • Patent number: 9496138
    Abstract: In an oxide semiconductor film formed over an insulating surface, an amorphous region remains in the vicinity of the interface with the base, which is thought to cause a variation in the characteristics of a transistor and the like. A base surface or film touching the oxide semiconductor film is formed of a material having a melting point higher than that of a material used for the oxide semiconductor film. Accordingly, a crystalline region is allowed to exist in the vicinity of the interface with the base surface or film touching the oxide semiconductor film. An insulating metal oxide is used for the base surface or film touching the oxide semiconductor film. The metal oxide used here is an aluminum oxide, gallium oxide, or the like that is a material belonging to the same group as the material of the oxide semiconductor film.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: November 15, 2016
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Masaki Koyama, Kosei Nei, Akihisa Shimomura, Suguru Hondo, Toru Hasegawa
  • Patent number: 9431435
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: August 30, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshinori Ando, Hidekazu Miyairi, Naoto Yamade, Asako Higa, Miki Suzuki, Yoshinori Ieda, Yasutaka Suzuki, Kosei Nei, Shunpei Yamazaki
  • Patent number: 9276091
    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: March 1, 2016
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Suguru Hondo, Akihisa Shimomura, Masaki Koyama, Motomu Kurata, Kazuya Hanaoka, Sho Nagamatsu, Kosei Nei, Toru Hasegawa
  • Publication number: 20150221754
    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.
    Type: Application
    Filed: April 16, 2015
    Publication date: August 6, 2015
    Inventors: Suguru HONDO, Akihisa SHIMOMURA, Masaki KOYAMA, Motomu KURATA, Kazuya HANAOKA, Sho NAGAMATSU, Kosei NEI, Toru HASEGAWA
  • Patent number: 9048265
    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: June 2, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Suguru Hondo, Akihisa Shimomura, Masaki Koyama, Motomu Kurata, Kazuya Hanaoka, Sho Nagamatsu, Kosei Nei, Toru Hasegawa
  • Publication number: 20150108475
    Abstract: To improve the electrical characteristics of a semiconductor device including an oxide semiconductor, and to provide a highly reliable semiconductor device with a small variation in electrical characteristics. The semiconductor device includes a first insulating film, a first barrier film over the first insulating film, a second insulating film over the first barrier film, and a first transistor including a first oxide semiconductor film over the second insulating film. The amount of hydrogen molecules released from the first insulating film at a given temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of the amount of released hydrogen molecules at 300° C. The second insulating film includes a region containing oxygen at a higher proportion than oxygen in the stoichiometric composition.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 23, 2015
    Inventors: Yoshinori Ando, Hidekazu Miyairi, Naoto Yamade, Asako Higa, Miki Suzuki, Yoshinori Ieda, Yasutaka Suzuki, Kosei Nei, Shunpei Yamazaki
  • Publication number: 20130320332
    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.
    Type: Application
    Filed: May 20, 2013
    Publication date: December 5, 2013
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Suguru HONDO, Akihisa SHIMOMURA, Masaki KOYAMA, Motomu KURATA, Kazuya HANAOKA, Sho NAGAMATSU, Kosei NEI, Toru HASEGAWA
  • Patent number: 8530336
    Abstract: Defects in a semiconductor substrate are reduced. A semiconductor substrate with fewer defects is manufactured with high yield. Further, a semiconductor device is manufactured with high yield. A semiconductor layer is formed over a supporting substrate with an oxide insulating layer interposed therebetween, adhesiveness between the supporting substrate and the oxide insulating layer in an edge portion of the semiconductor layer is increased, an insulating layer over a surface of the semiconductor layer is removed, and the semiconductor layer is irradiated with laser light, so that a planarized semiconductor layer is obtained. For increasing the adhesiveness between the supporting substrate and the oxide insulating layer in the edge portion of the semiconductor layer, laser light irradiation is performed from the surface of the semiconductor layer.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: September 10, 2013
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kosei Nei, Akihisa Shimomura
  • Patent number: 8383487
    Abstract: Forming an insulating film on a surface of the single crystal semiconductor substrate, forming a fragile region in the single crystal semiconductor substrate by irradiating the single crystal semiconductor substrate with an ion beam through the insulating film, forming a bonding layer over the insulating film, bonding a supporting substrate to the single crystal semiconductor substrate by interposing the bonding layer between the supporting substrate and the single crystal semiconductor substrate, dividing the single crystal semiconductor substrate at the fragile region to separate the single crystal semiconductor substrate into a single crystal semiconductor layer attached to the supporting substrate, performing first dry etching treatment on a part of the fragile region remaining on the single crystal semiconductor layer, performing second dry etching treatment on a surface of the single crystal semiconductor layer subjected to the first etching treatment, and irradiating the single crystal semiconductor la
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: February 26, 2013
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hideomi Suzawa, Shinya Sasagawa, Akihisa Shimomura, Junpei Momo, Motomu Kurata, Taiga Muraoka, Kosei Nei