Abstract: A two-agent type dental adhesive composition includes a first agent; and a second agent. The first agent includes a (meth)acrylate compound having an acid group, a (meth)acrylate compound having no acid group, water, and a water-soluble organic solvent. The second agent includes a multifunctional (meth)acrylate compound, a photopolymerization initiator, and a filler of 0 to 50 mass %. Both the first agent and the second agent substantially do not contain 2-hydroxyethyl methacrylate.

Abstract: Thermosensitive fine particles of the present invention include a side chain crystal polymer which is crystallized at a temperature lower than a melting point and which exhibits fluidity at a temperature equal to or more than the melting point. The side chain crystal polymer may include, as a monomer component, a (meth)acrylate having a straight-chain alkyl group having 14 or more carbon atoms. A mean particle diameter of the fine particles may be 0.1 to 50 ?m. The thermosensitive fine particles may include no organic solvents.

Abstract: A transportation device includes a first transporter, a second transporter movable between a contact position and a separate position toward and away from the first transporter to hold a to-be-transported object between the second transporter and the first transporter in the contact position, and a transportation unit that transports the to-be-transported object to a nip area where the first transporter and the second transporter hold the to-be-transported object therebetween while the second transporter is located in the separate position. The second transporter moves from the separate position to the contact position to hold the to-be-transported object transported to the nip area by the transportation unit between the second transporter and the first transporter to transport the to-be-transported object.

Abstract: A transport device includes: a first transport body; a second transport body that is movable between a contact position and a separate position with respect to the first transport body and that nips a transported material with the first transport body at the contact position; and a transport section that includes a holder to hold a leading end portion of the transported material and that transports the transported material toward a nip region where the first transport body and the second transport body nip the transported material in a state in which the second transport body is located at the separate position. After holding of the leading end portion by the holder for the transported material transported by the transport section has been released, the second transport body nips the transported material with the first transport body and transports the transported material.

Abstract: There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10?7 m2s?1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

Abstract: The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10?7 m2s?1 or more, and has a volume resistivity of 1.0×1011 ?·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Abstract: There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10?7 m2s?1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.

Abstract: The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10?7 m2 s?1 or more, and has a volume resistivity of 1.0×1011 ?·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.

Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.

Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.

Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.

Abstract: A screen generating apparatus includes an operation history recording unit that records an operation count by a user for a certain time period on a display screen for each operation button, a comparison unit that compares the operation count for each operation button with a first threshold value and a second threshold value, a non-display target setting unit that sets the operation button having an operation count lower than or equal to the first threshold value as a non-display target, and an enlargement target setting unit that sets the operation button having an operation count higher than or equal to the second threshold value as an enlargement target. The screen generating unit does not display any operation button set as the non-display target on the display screen and displays any operation button set as the enlargement target in a size larger than a standard size on the display screen.

Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Abstract: To provide a method for recycling processing of dust generated in a converter furnace for collecting the dust at a low cost in a short time and returning it as a metallic iron resource to the converter process. In a method for recycling processing of dust generated in a converter furnace, including: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace, the crushed product in the accumulation tank is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank and charged into a converter furnace according to the converter operation.