Abstract: There is provided a manufacturing method for a bonded body, comprising: preparing a substrate A having a surface on which a wiring line terminal is provided; forming a polyimide-containing precursor portion on the surface of the substrate A, where the wiring line terminal is provided on the surface of the substrate A; preparing a substrate B having a surface on which a wiring line terminal is provided; and bonding the surface of the substrate A, where the polyimide-containing precursor portion is provided on the surface of the substrate A, to the surface of the substrate B, where the wiring line terminal is provided on the surface of the substrate B, wherein a difference between a cyclization rate of a polyimide in the polyimide-containing precursor portion before the bonding of the surface of the substrate A and a cyclization rate of a polyimide in a polyimide-containing portion formed at a bonded portion after the bonding of the surface of the substrate A is 5% or more.

Abstract: A holding device includes: a base; a support member that is attached to the base and supports an object having a three-dimensional shape, to which a toner image has been transferred, in a state in which the object is not in contact with an upper surface of the base; and a reflecting member that is attached to the base, that reflects light emitted from a light source provided above the object in a state of being supported by the support member, and that irradiates at least a lower surface side of the object.

Abstract: A heating system includes a heater compatible with plural heating methods and configured to heat a heating target in a non-contact manner, and one or more processors. The one or more processors are configured to switch a heating method to be used for heating the heating target depending on a material of the heating target.

Abstract: A fixing device includes: a holding part that extends in a width direction of a recording medium being transported and that holds the recording medium; a pair of circulating parts that are attached to both ends of the holding part and that circulate to transport the recording medium; and a heating member that heats the recording medium in a non-contact manner and that is located in a space between the pair of circulating parts in the width direction.

Abstract: There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10?7 m2s?1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

Abstract: The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10?7 m2s?1 or more, and has a volume resistivity of 1.0×1011 ?·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Abstract: There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10?7 m2s?1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.

Abstract: The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10?7 m2 s?1 or more, and has a volume resistivity of 1.0×1011 ?·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.

Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.

Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.

Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.

Abstract: A screen generating apparatus includes an operation history recording unit that records an operation count by a user for a certain time period on a display screen for each operation button, a comparison unit that compares the operation count for each operation button with a first threshold value and a second threshold value, a non-display target setting unit that sets the operation button having an operation count lower than or equal to the first threshold value as a non-display target, and an enlargement target setting unit that sets the operation button having an operation count higher than or equal to the second threshold value as an enlargement target. The screen generating unit does not display any operation button set as the non-display target on the display screen and displays any operation button set as the enlargement target in a size larger than a standard size on the display screen.

Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Abstract: To provide a method for recycling processing of dust generated in a converter furnace for collecting the dust at a low cost in a short time and returning it as a metallic iron resource to the converter process. In a method for recycling processing of dust generated in a converter furnace, including: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace, the crushed product in the accumulation tank is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank and charged into a converter furnace according to the converter operation.