Patents by Inventor Kosuke Yamashita

Kosuke Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10742851
    Abstract: A captured image decision device includes a synchronizing signal extraction section extracting a vertical synchronizing signal and a horizontal synchronizing signal for use in displaying a captured image captured by a camera, a time measurement section measuring a pulse interval time period of the vertical synchronizing signal, a segment area setting section configured to divide a frame of the captured image displayed according to the pulse interval time period by a horizontal virtual line, thus setting a plurality of segment areas divided by the virtual line, a pulse number measurement section measuring a pulse number of the horizontal synchronizing signal corresponding to each segment area, and a decision section deciding whether an affirmation condition of the pulse number measured by the pulse number measurement section being equal to or greater than a predetermined value is satisfied or not.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: August 11, 2020
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Norichika Yamashita, Kosuke Hirano
  • Publication number: 20200224076
    Abstract: Provided is a vinyl alcohol polymer having good fluid loss reducing performance. The vinyl alcohol polymer is a saponified product of a copolymer of a vinyl ester monomer and a multifunctional monomer, and has a degree of saponification of 70 to 95 mol % and a viscosity-average degree of polymerization of 1000 to 10000.
    Type: Application
    Filed: March 20, 2020
    Publication date: July 16, 2020
    Inventors: Akihiro YAMASHITA, Kosuke WATANABE
  • Publication number: 20200168551
    Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Applicant: FUJIFILM Corporation
    Inventor: Kosuke YAMASHITA
  • Publication number: 20200063246
    Abstract: Steel improved in all of the hardenability, toughness, surface-originated micropitting life, and bending fatigue strength and a part manufactured using such steel are provided having predetermined constituents having an Fn1 defined by the following formula (1) of 0.20 to 0.65 and having an Fn2 defined by the following formula (2) of 0.50 to 1.00: Fn1=4.2×[Cr]/(7.0×[Si]+16.0×[Mn])??(1) [Element]: mass % of element Fn2=A1/A2??(2) A1: total area (?m2) of sulfide-based inclusions containing 1.0 mol % or more of Ca with respect to the total number of moles in the sulfides and having a circle equivalent diameter of 1.0 ?m or more in observation regions of a total area of 4.0 mm2 A2: total area (?m2) of sulfide-based inclusions having a circle equivalent diameter of 1.0 ?m or more in observation regions of a total area of 4.
    Type: Application
    Filed: May 15, 2018
    Publication date: February 27, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Tomohiro YAMASHITA, Daisuke HIRAKAMI, Yutaka NEISHI, Kosuke TANAKA, Hideki IMATAKA
  • Publication number: 20200059129
    Abstract: A motor includes a rotor, a stator, and first bus bars electrically connected to the stator on one axial direction side of the stator. The stator includes a stator core including a core back extending in a circumferential direction, teeth extending radially from the core back, and coils defined by winding a conducting wire, each of which is mounted on the teeth. A first conducting wire and a second conducting wire which are two respective ends of the conducting wire extend to one axial direction side from each of the coils. The first bus bars are neutral point bus bars connecting two or more first conducting wires as neutral points. The second conducting wire is connected to a power supply that supplies power to the stator.
    Type: Application
    Filed: March 30, 2018
    Publication date: February 20, 2020
    Inventors: Yoshiaki YAMASHITA, Shunsuke MURAKAMI, Kosuke OGAWA
  • Patent number: 10559548
    Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 11, 2020
    Assignee: FUJIFILM Corporation
    Inventor: Kosuke Yamashita
  • Publication number: 20190335890
    Abstract: The plaque detecting device of the present invention comprises a light emitting unit (450) which irradiates ultraviolet or blue excitation light (L) toward the tooth surface (99a), and a first and second light receiving units (402) which receive radiated light (L?) from the tooth surface (99a). The first light receiving unit extracts the spectral component of a first wavelength region including the wavelength range of fluorescent light specific to plaque from the radiated light (L?), and obtains a first output value corresponding to the intensity of that spectral component. The second light receiving unit extracts, from the radiated light (L?), the spectral component of a second wavelength region containing the wavelength range of the fluorescent light specific to enamel and having a predetermined lower limit wavelength below the lower limit wavelength of the first wavelength region, and obtains a second output value corresponding to the intensity of this spectral component.
    Type: Application
    Filed: March 15, 2017
    Publication date: November 7, 2019
    Applicants: Omron Healthcare Co., Ltd., Colgate-Palmolive Company
    Inventors: Hideyuki YAMASHITA, Kosuke ABE, Hideaki YOSHIDA, Yasuhiro KAWABATA, Masashi KITAMURA
  • Publication number: 20190312993
    Abstract: A captured image decision device includes a synchronizing signal extraction section extracting a vertical synchronizing signal and a horizontal synchronizing signal for use in displaying a captured image captured by a camera, a time measurement section measuring a pulse interval time period of the vertical synchronizing signal, a segment area setting section configured to divide a frame of the captured image displayed according to the pulse interval time period by a horizontal virtual line, thus setting a plurality of segment areas divided by the virtual line, a pulse number measurement section measuring a pulse number of the horizontal synchronizing signal corresponding to each segment area, and a decision section deciding whether an affirmation condition of the pulse number measured by the pulse number measurement section being equal to or greater than a predetermined value is satisfied or not.
    Type: Application
    Filed: March 24, 2017
    Publication date: October 10, 2019
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Norichika YAMASHITA, Kosuke HIRANO
  • Patent number: 10155998
    Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: December 18, 2018
    Assignee: ASTEC IRIE CO., LTD.
    Inventors: Kosuke Yamashita, Nobuo Kusakabe, Saburou Satou, Gouta Kawamura, Hiromichi Takesue
  • Publication number: 20180350769
    Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.
    Type: Application
    Filed: August 6, 2018
    Publication date: December 6, 2018
    Applicant: FUJIFILM Corporation
    Inventor: Kosuke YAMASHITA
  • Patent number: 9899306
    Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: February 20, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Yoshinori Hotta, Shunji Kurooka, Kosuke Yamashita
  • Patent number: 9799594
    Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: October 24, 2017
    Assignee: FUJIFILM Corporation
    Inventor: Kosuke Yamashita
  • Publication number: 20170125330
    Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.
    Type: Application
    Filed: January 9, 2017
    Publication date: May 4, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Yoshinori HOTTA, Shunji KUROOKA, Kosuke YAMASHITA
  • Publication number: 20170051369
    Abstract: A method for recycling processing of dust generated in a converter furnace, includes: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace 10, the crushed product in the accumulation tank 25 is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank 25 and charged into a converter furnace according to the converter operation.
    Type: Application
    Filed: November 9, 2016
    Publication date: February 23, 2017
    Inventors: Kosuke YAMASHITA, Nobuo KUSAKABE, Saburou SATOU, Gouta KAWAMURA, Hiromichi TAKESUE
  • Publication number: 20170046177
    Abstract: A screen generating apparatus includes an operation history recording unit that records an operation count by a user for a certain time period on a display screen for each operation button, a comparison unit that compares the operation count for each operation button with a first threshold value and a second threshold value, a non-display target setting unit that sets the operation button having an operation count lower than or equal to the first threshold value as a non-display target, and an enlargement target setting unit that sets the operation button having an operation count higher than or equal to the second threshold value as an enlargement target. The screen generating unit does not display any operation button set as the non-display target on the display screen and displays any operation button set as the enlargement target in a size larger than a standard size on the display screen.
    Type: Application
    Filed: August 12, 2016
    Publication date: February 16, 2017
    Applicant: AZBIL CORPORATION
    Inventor: Kosuke YAMASHITA
  • Publication number: 20160336262
    Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.
    Type: Application
    Filed: July 26, 2016
    Publication date: November 17, 2016
    Applicant: FUJIFILM Corporation
    Inventor: Kosuke YAMASHITA
  • Publication number: 20160186278
    Abstract: To provide a method for recycling processing of dust generated in a converter furnace for collecting the dust at a low cost in a short time and returning it as a metallic iron resource to the converter process. In a method for recycling processing of dust generated in a converter furnace, including: crushing and drying a cake formed by adding a binder to a slurry containing iron powder-containing dust that is generated at the time of converter blowing and wet-collected to produce a mixed slurry and subjecting the produced mixed slurry to a dehydration treatment in a filter press; accumulating the cake in an accumulation tank; and charging the cake into a converter furnace, the crushed product in the accumulation tank is kept at a temperature of less than 90° C. by forcibly passing air into the accumulation tank and charged into a converter furnace according to the converter operation.
    Type: Application
    Filed: August 7, 2014
    Publication date: June 30, 2016
    Inventors: Kosuke YAMASHITA, Nobuo KUSAKABE, Saburou SATOU, Gouta KAWAMURA, Hiromichi TAKESUE
  • Publication number: 20160153104
    Abstract: An object of the present invention is to provide a method for manufacturing a metal-filled microstructure, capable of easily filling micropores with metal and suppressing the generation of residual stress caused by metal filling.
    Type: Application
    Filed: February 9, 2016
    Publication date: June 2, 2016
    Applicant: FUJIFILM Corporation
    Inventor: Kosuke YAMASHITA
  • Publication number: 20140085829
    Abstract: The invention provides a multi-layered board and a semiconductor package including the multi-layered board with improved heat dissipation performance of the semiconductor package. A multi-layered board includes an anisotropically-conductive member that includes an insulating base which is an anodized film of an aluminum substrate and in which through-holes are formed in a thickness direction and a plurality of conduction passages which are formed of a conductive material filled in the through-holes and which extend through the insulating base in the thickness direction with the conduction passages insulated from each other, a heat conducting layer that includes heat conducting portions and is disposed on at least one surface of the anisotropically-conductive member, and heat dissipating portions formed of the conductive material and protruding from the insulating base.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 27, 2014
    Applicant: Fujifilm Corporation
    Inventor: Kosuke YAMASHITA
  • Publication number: 20120073973
    Abstract: An anisotropically conductive member includes an insulating base having through micropores and conductive paths formed by filling the through micropores with a conductive material, insulated from one another, and extending through the insulating base in its thickness direction, one end of each of the conductive paths exposed on one side of the insulating base, the other end of each of the conductive paths exposed on the other side thereof. The insulating base is an anodized film obtained from an aluminum substrate and the aluminum substrate contains intermetallic compounds with an average circle equivalent diameter of up to 2 ?m at a density of up to 100 pcs/mm2. The anisotropically conductive member dramatically increases the density of disposed conductive paths and suppresses the formation of regions having no conductive paths, and can be used as an electrically connecting member or inspection connector for electronic components.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 29, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Kosuke YAMASHITA, Yoshinori HOTTA, Akio UESUGI