Abstract: A first select transistor is connected to a first wiring. A first memory cell transistor and a second memory cell transistor are connected in series between the first select transistor and a second select transistor. A first word line is connected to the first memory cell transistor. A second word line is connected to the second memory cell transistor. During a first period in which the first voltage is applied to the first wiring, a second voltage lower than a first voltage is applied in parallel to the first word line and the second word line. During a second period in which a third voltage higher than the first voltage is applied to the first wiring, the second voltage is applied to the first word line, and a fourth voltage higher than the second voltage and lower than the third voltage is applied to the second word line.

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Abstract: A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few ?m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7.

Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Abstract: The present invention provides a catalyst for forming carbon nanotubes that improves a yield at the time of manufacturing carbon nanotubes and enables continuous mass production of carbon nanotubes with high purity. The catalyst for forming carbon nanotubes of the present invention includes a carrier that includes MgO and a metal catalyst that is supported by the carrier, and the concentration of the MgO in the carrier is set equal to 99 mass % or higher.

Abstract: A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few ?m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7.

Abstract: The present invention provides a catalyst for carbon nanotube production capable of continuously mass-producing a carbon nanotube having a long fiber length and excellent conductivity. The catalyst for carbon nanotube production of the present invention includes a carrier particle which is configured to include a metal oxide and has voids therein, and a metal catalyst which is carried on the carrier particle. In a pore distribution curve of the carrier particle which is obtained by a mercury penetration method, when an integrated value of volumes of pores having a pore size of equal to or larger than 0.1 ?m is set to be a volume of voids per unit mass of the carrier particle, the volume of the voids is set to be in a range of 0.6 cm3/g to 2.2 cm3/g.

Abstract: The present invention provides a catalyst for forming carbon nanotubes that improves a yield at the time of manufacturing carbon nanotubes and enables continuous mass production of carbon nanotubes with high purity. The catalyst for forming carbon nanotubes of the present invention includes a carrier that includes MgO and a metal catalyst that is supported by the carrier, and the concentration of the MgO in the carrier is set equal to 99 mass % or higher.