Patents by Inventor Kota Tokuda

Kota Tokuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220301591
    Abstract: According to one embodiment, a disk device includes a housing, recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing has an internal space. The internal wireless communication device generates at least either of: an electric signal representing information to be written to the recording medium, the electric signal corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and light, a magnetic field, or an electric field toward the external wireless communication device, the light, the magnetic field, or the electric field corresponding to an electric signal representing information read from the recording medium.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 22, 2022
    Inventors: Taichi OKANO, Masahide TAKAZAWA, Jai LIU, Nobuhiro YAMAMOTO, Kota TOKUDA
  • Publication number: 20220301595
    Abstract: A disk device according to one embodiment includes a first conversion device, a second conversion device, an optical waveguide, a first component, and a second component. The first conversion device emits light corresponding to an electric signal. The second conversion device generates an electric signal corresponding to incident light. The optical waveguide includes a first end joined to the first conversion device and a second end joined to the second conversion device, and transmits light emitted from the first conversion device to the second conversion device. The first component is electrically connected to the first conversion device. The second component is electrically connected to the second conversion device, and communicates with the first component through the first conversion device, the optical waveguide, and the second conversion device.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 22, 2022
    Inventors: Taichi OKANO, Jia LIU, Masahide TAKAZAWA, Nobuhiro TAKAZAWA, Kota TOKUDA
  • Patent number: 11437076
    Abstract: According to one embodiment, a disk device includes a housing having a first transmission hole, a magnetic disk, a head, a first sealing material having an inner surface and an outer surface and closing the first transmission hole, and a first wireless power feeding device having a first power feeding antenna. The first power feeding antenna is located mere inward of the housing than the outer surface of the first sealing material, and receives power transmitted through the first sealing material by wireless power feeding.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: September 6, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi Okano, Jia Liu, Nobuhiro Yamamoto, Kota Tokuda
  • Patent number: 11410691
    Abstract: According to one embodiment, a wiring board unit includes a reinforcing board, a flexible printed circuit board includes a joint portion including a first plane and a second plane and attached on the reinforcing board, a relay unit extending from the first plane, a plurality of connection pad groups located on one of the first plane and the second plane and a first IC chip mounted on the first plane, and the joint portion is bent on a boundary between the first plane and the second plane.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: August 9, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Kota Tokuda, Nobuhiro Yamamoto, Yousuke Hisakuni
  • Publication number: 20220247153
    Abstract: A surface light-emission laser device includes: an active layer; a first DBR layer and a second DBR layer that interpose the active layer therebetween; and an insulation film and a metal layer that are provided at a position that faces a light-emission region of the active layer, and correspond to an end part of a reflection mirror on the second DBR layer side as viewed from the active layer. The surface light-emission laser device further includes: a first contact layer provided in the first DBR layer or in contact with the first DBR layer; a second contact layer provided in contact with the second DBR layer; a first electrode layer provided in contact with the first contact layer; and a second electrode layer that is in contact with the second contact layer, and provided at a position that does not face the light-emission region of the active layer.
    Type: Application
    Filed: October 20, 2020
    Publication date: August 4, 2022
    Inventors: Osamu MAEDA, Kazuhiko TAKAHASHI, Yoshihiko TAKAHASHI, Kota TOKUDA, Jugo MITOMO, Takahiro ARAKIDA
  • Publication number: 20220247064
    Abstract: A disk device includes a housing having a sidewall, the side wall having a first through-hole; a magnetic disk rotatably disposed in the housing and surrounded by the sidewall in a radial direction; a flexible printed circuit electrically connected to the magnetic disk; an insulator closing the first through-hole; a wireless communication device having a first communication antenna inside the housing; and a control board electrically connected to the flexible printed circuit. The control board is supplied with power from outside of the housing via a first connector, and is configured to receive a write command or a read command via the first communication antenna.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia LIU, Taichi OKANO, Kota TOKUDA, Nobuhiro YAMAMOTO
  • Patent number: 11342650
    Abstract: According to one embodiment, a disk device includes a housing including a sidewall, a magnetic disk, a wireless communication device including a first communication antenna, and a first insulating member. The sidewall includes a first through portion. The first insulating member closes the first through portion. The first communication antenna is located in the first through portion, is disposed spaced from the housing, and wirelessly communicates with an outside of the housing.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: May 24, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia Liu, Taichi Okano, Kota Tokuda, Nobuhiro Yamamoto
  • Patent number: 11289129
    Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 29, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
  • Patent number: 11271368
    Abstract: A semiconductor laser according to one embodiment of the present disclosure includes a semiconductor stack. The semiconductor stack includes, in the following order, a first cladding layer, an active layer, one or a plurality of low-concentration impurity layers, a contact layer, and a second cladding layer that includes a transparent conductive material. The semiconductor stack further has, in a portion including the contact layer, a ridge extending in a stacked in-plane direction. Each low-concentration impurity layer has an impurity concentration of 5.0×1017 cm?3 or less, and a total thickness of the low-concentration impurity layer is 250 nm or more and 1000 nm or less. A distance between the second cladding layer and the low-concentration impurity layer closest to the second cladding layer is 150 nm or less.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: March 8, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kota Tokuda, Hideki Watanabe, Takayuki Kawasumi
  • Publication number: 20220037761
    Abstract: According to one embodiment, a disk device includes a housing including a sidewall, a magnetic disk, a wireless communication device including a first communication antenna, and a first insulating member. The sidewall includes a first through portion. The first insulating member closes the first through portion. The first communication antenna is located in the first through portion, is disposed spaced from the housing, and wirelessly communicates with an outside of the housing.
    Type: Application
    Filed: March 10, 2021
    Publication date: February 3, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia LIU, Taichi OKANO, Kota TOKUDA, Nobuhiro YAMAMOTO
  • Publication number: 20220013989
    Abstract: A semiconductor laser according to an embodiment of the present disclosure includes a semiconductor stack section. The semiconductor stack section includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, in which the second semiconductor layer is stacked on the first semiconductor layer and includes a ridge having a band shape, and an active layer. The semiconductor stack section further has an impurity region that is at least a portion of a region not facing the ridge and that is located at a position deeper than at least the active layer, in which the impurity region has an impurity concentration of the second conductivity type higher than an impurity concentration of the second conductivity type in a region, of the second semiconductor layer, facing the ridge.
    Type: Application
    Filed: October 31, 2019
    Publication date: January 13, 2022
    Inventors: KOTA TOKUDA, SHINYA SATOU
  • Publication number: 20220006265
    Abstract: A nitride semiconductor laser device of one embodiment of the present disclosure includes a single-crystal substrate, a base layer, a sheet-shaped structure, a light emitting layer, and a resonator mirror. The single-crystal substrate extends in one direction. The base layer is provided on the single-crystal substrate and includes a nitride semiconductor. The sheet-shaped structure is provided on the base layer to stand in a direction perpendicular to the base layer. The sheet-shaped structure has an area of a side surface that is greater than an area of an upper surface. The side surface extends in a longitudinal direction of the single-crystal substrate. The sheet-shaped structure includes a nitride semiconductor. The light emitting layer is provided at least on the side surface of the sheet-shaped structure. The light emitting layer includes a nitride semiconductor. The resonator mirror is provided by a pair of end surfaces of the sheet-shaped structure that oppose each other in the longitudinal direction.
    Type: Application
    Filed: October 25, 2019
    Publication date: January 6, 2022
    Inventors: TAKASHI TANGE, KUNIHIKO TASAI, KOTA TOKUDA
  • Publication number: 20210407550
    Abstract: According to one embodiment, a disk device includes a housing including a hole, a magnetic disk, a control board closing the hole, and an electronic component. The electronic component is mounted on the control board, and assists a control operation for recording and reproducing information on and from the magnetic disk.
    Type: Application
    Filed: March 10, 2021
    Publication date: December 30, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi OKANO, Jia LIU, Nobuhiro YAMAMOTO, Kota TOKUDA
  • Publication number: 20210328408
    Abstract: A method of manufacturing a surface emitting laser according to an embodiment of the present disclosure includes the following two steps: (1) a step of forming a semiconductor stacked structure on a substrate, the semiconductor stacked structure including an active layer, a first DBR layer of a first electrical conduction type, and a second DBR layer of a second electrical conduction type, the first DBR layer and the second DBR layer sandwiching the active layer, the second electrical conduction type being different from the first electrical conduction type; and (2) a step of forming a mesa section at a portion on the second DBR layer side in the semiconductor stacked structure and then forming an annular diffusion region of the first electrical conduction type at an outer edge of the mesa section by impurity diffusion from a side surface of the mesa section, the mesa section including the second DBR layer, the mesa section not including the active layer.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 21, 2021
    Inventors: Takayuki KAWASUMI, Hideki KIMURA, Kota TOKUDA, Yoshiaki WATANABE
  • Publication number: 20210295876
    Abstract: According to one embodiment, a disk device includes a housing having a first transmission hole, a magnetic disk, a head, a first sealing material having an inner surface and an outer surface and closing the first transmission hole, and a first wireless power feeding device having a first power feeding antenna. The first power feeding antenna is located mere inward of the housing than the outer surface of the first sealing material, and receives power transmitted through the first sealing material by wireless power feeding.
    Type: Application
    Filed: September 9, 2020
    Publication date: September 23, 2021
    Inventors: Taichi Okano, Jia Liu, Nobuhiro Yamamoto, Kota Tokuda
  • Patent number: 11109482
    Abstract: According to one embodiment, an electronic device includes a flexible printed wiring board includes an insulating layer, a plurality of connection pads provided on one side of the insulating layer and constituting a group, and a pad provided on another surface side of the insulating layer and having heat conductivity, wherein the pad overlaps one or more connection pads positioned at an outer edge of the group of connection pads via the insulating layer and comprises a portion extending on the outside of the connection pad on the outer edge, and a connection member includes a plurality of connection terminals connected to the connection pads via a solder.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 31, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Kota Tokuda, Nobuhiro Yamamoto
  • Patent number: 11108178
    Abstract: According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: August 31, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Nobuhiro Yamamoto, Kiyokazu Ishizaki, Kota Tokuda, Yousuke Hisakuni
  • Publication number: 20210225412
    Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.
    Type: Application
    Filed: August 31, 2020
    Publication date: July 22, 2021
    Inventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
  • Publication number: 20210225395
    Abstract: According to one embodiment, a wiring board unit includes a reinforcing board, a flexible printed circuit board includes a joint portion including a first plane and a second plane and attached on the reinforcing board, a relay unit extending from the first plane, a plurality of connection pad groups located on one of the first plane and the second plane and a first IC chip mounted on the first plane, and the joint portion is bent on a boundary between the first plane and the second plane.
    Type: Application
    Filed: April 5, 2021
    Publication date: July 22, 2021
    Inventors: Kota Tokuda, Nobuhiro Yamamoto, Yousuke Hisakuni
  • Publication number: 20210066887
    Abstract: A semiconductor laser according to one embodiment of the present disclosure includes a semiconductor stack. The semiconductor stack includes, in the following order, a first cladding layer, an active layer, one or a plurality of low-concentration impurity layers, a contact layer, and a second cladding layer that includes a transparent conductive material. The semiconductor stack further has, in a portion including the contact layer, a ridge extending in a stacked in-plane direction. Each low-concentration impurity layer has an impurity concentration of 5.0×1017 cm?3 or less, and a total thickness of the low-concentration impurity layer is 250 nm or more and 1000 nm or less. A distance between the second cladding layer and the low-concentration impurity layer closest to the second cladding layer is 150 nm or less.
    Type: Application
    Filed: January 17, 2019
    Publication date: March 4, 2021
    Inventors: KOTA TOKUDA, HIDEKI WATANABE, TAKAYUKI KAWASUMI