Abstract: A multilayer ceramic capacitor includes a multilayer body including a dielectric layer and an inner electrode layer alternately laminated, an outer electrode layer on each of two end surfaces at both ends in a length direction perpendicular to a lamination direction of the multilayer body and covering end surface sides of two main surfaces at both ends in the lamination direction and end surface sides of two side surfaces in the width direction and including a base electrode layer connected to the inner electrode layer, and a bump on each of the two end surface sides to hold therebetween the base electrode layer, covering the main surface side, and including a resin and a metal. In each bump, an end surface-side portion near the end surface on the side where the bump is located, projects more than a central portion of the bump toward an outside in the lamination direction.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, outer electrode layers on end surfaces of the multilayer body at opposite ends in a longitudinal direction and covering end surface sides of each of principal surfaces of the multilayer body at opposite ends in a laminating direction and end surface sides of each of side surfaces at opposite ends in a width direction and bumps on the end surface sides of one principal surface of the multilayer body such that the outer electrode layers covering the one principal surface are sandwiched between the bumps and the one principal surface. Each bump includes copper covering an area of about 50% or more and about 96% or less in a cross section through widthwise centers of the bumps and extending in the laminating direction and the longitudinal direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated on one another, outer electrode layers on end surfaces of the multilayer body at opposite ends in a longitudinal direction and covering end surface sides of principal surfaces of the multilayer body at opposite ends in a laminating direction and end surface sides of side surfaces at opposite ends with respect to a width direction, and bumps on the end surface sides of one of the principal surfaces of the multilayer body such that the outer electrode layers covering the one principal surface are sandwiched between the bumps and the one principal surface. Each of the bumps includes tin regions, metal regions including copper, and silver regions including silver.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. A glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.

Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1?mass ratio of Ag/100)×70} wt % or more and about {(1?mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1?mass ratio of Ag/100)×5} wt % or more and about {(1?mass ratio of Ag/100)×30} wt % or less.

Abstract: An outer electrode includes a glass-free sintered layer containing no glass. A glass-free conductive paste is provided and includes a conductive metal powder and a thermosetting resin, the conductive metal powder including an alloy of tin and at least one of copper and nickel, and the glass-free conductive paste containing no glass. This composition is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to heat treatment at a temperature of about 600° C., higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is subjected to thermal decomposition or combustion and thus little of the thermosetting resin remains, and the conductive metal powder is sintered to form a unified sintered metal body.

Abstract: A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1?mass ratio of Ag/100)×70} wt % or more and about {(1?mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1?mass ratio of Ag/100)×5} wt % or more and about {(1?mass ratio of Ag/100)×30} wt % or less.

Abstract: A multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of stacked inner electrode layers, and outer electrodes on end surfaces of the multilayer body. The outer electrodes include underlying electrode layers on the end surfaces, conductive resin layers that cover the underlying electrode layers, and plating layers that cover the conductive resin layers. The underlying electrode layers are joined to the plating layers in connecting portions without the conductive resin layers interposed between the underlying electrode layers and the plating layers.

Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. A glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 ?m or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body and outer electrodes on two end surfaces of the ceramic body. Each of the outer electrodes includes a base electrode layer that is on the ceramic body and includes a sintered metal and glass, and a conductive resin layer that is on the base electrode layer and includes a metal filler and a resin. When a maximum thickness of the conductive resin layers that respectively lie on end surfaces of the ceramic body is denoted as T1 and when a maximum thickness of conductive resin layers adjacent to a first main surface and second main surface of the ceramic body or a first side surface or a second side surface of the ceramic body is denoted as T2, T1/T2 is about 2.4 or more.

Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of stacked inner electrode layers, and outer electrodes on end surfaces of the multilayer body. The outer electrodes include underlying electrode layers on the end surfaces, conductive resin layers that cover the underlying electrode layers, and plating layers that cover the conductive resin layers. The underlying electrode layers are joined to the plating layers in connecting portions without the conductive resin layers interposed between the underlying electrode layers and the plating layers.

Abstract: A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

Abstract: A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.

Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.