Abstract: A curable resin composition includes a polyether polyol resin represented by general formula (1) and having an epoxy equivalent of 7,000 to 100,000 g/eq, an epoxy resin having a functionality of 3 or more, and an epoxy resin curing agent. Provided is a curable resin composition that is excellent in heat resistance and also excellent in bending resistance in a well-balanced manner and that is applicable in various fields that require heat resistance and toughness, particularly, electrical and electronic fields. n is an integer of 1 or more. A1 and A2 are each a divalent organic group having an aromatic structure and/or an alicyclic structure. B is a hydrogen atom or a glycidyl group.