Patents by Inventor Kou Hasefawa

Kou Hasefawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
    Publication number: 20050245171
    Abstract: There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1. The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.
    Type: Application
    Filed: April 27, 2005
    Publication date: November 3, 2005
    Applicant: JSR Corporation
    Inventors: Yukio Hosaka, Hiroshi Shiho, Hiroyuki Miyauchi, Takahiro Okamoto, Kou Hasefawa, Nobuo Kawahashi