Abstract: A core of a fast reactor having arranged therein at least one gas expansion module each of which being a hollow tubular structure with one end closed and the other end opened, the core including at least one neutron absorber that absorbs neutron, or, at least one neutron moderator that slows down neutron, arranged so as to adjoin the outer face, in the radial direction of the core, of the gas expansion module.

Abstract: There is provided a core of a fast reactor capable of achieving a sodium-cooled metal fuel fast reactor with high adaptability to a molten salt heat storage system, by flattening the output distribution and raising the coolant outlet temperature while suppressing deterioration of the core characteristic. A core of a fast factor is a fuel assembly obtained by densely disposing fuel rods within a wrapper tube, the fuel rod storing, within a cladding tube, hollow fuel in which Pu-enrichment is made to be a predetermined value within a range of 11 to 13 wt %. In the core of a fast factor, a first fuel assembly including a fuel rod with a large hollow diameter of the hollow fuel is loaded on the center side of the core, and a second fuel assembly including a fuel rod with a hollow diameter smaller than the hollow diameter of the hollow fuel of the first fuel assembly is loaded on the circumferential side of the core.

Abstract: To provide is a fuel assembly capable of easily adjusting average MA enrichment in an inner blanket region. An inner core fuel assembly 7 loaded in an inner core region 2 of a core of a fast reactor includes a plurality of fuel rods 10 and a plurality of fuel rods 19. Each of the fuel rods 10 includes a lower core fuel region 12, an inner blanket region 11, and an upper core fuel region 13. A U—Pu—Zr metal fuel is disposed in the lower core fuel region 12 and the upper core fuel region 13, and a U—Zr metal fuel is disposed in the inner blanket region 11. Each of the fuel rods 19 includes a lower core fuel region 12, an inner blanket region 20, and an upper core fuel region 13. A U—Pu—Zr metal fuel is disposed in the lower core fuel region 12 and the upper core fuel region 13 of the fuel rod 19, and a MA-Zr metal fuel is disposed in the inner blanket region 20.

Abstract: An object of the present invention is to provide a porous silica powder suitable for, for example, a gas chromatography support, and the porous silica powder has an average pore diameter of 0.5 to 10 ?m as determined by a mercury intrusion method, a volume of pores having a 100 nm or smaller pore diameter of 0.2 cm3/g or less as determined by a nitrogen gas adsorption method, a specific surface area of 0.5 to 100 m2/g as determined by a nitrogen gas adsorption method, and a particle size distribution of 10 to 1000 ?m.

Abstract: An object of the present invention is to provide a porous silica powder suitable for, for example, a gas chromatography support, and the porous silica powder has an average pore diameter of 0.5 to 10 ?m as determined by a mercury intrusion method, a volume of pores having a 100 nm or smaller pore diameter of 0.2 cm3/g or less as determined by a nitrogen gas adsorption method, a specific surface area of 0.5 to 100 m2/g as determined by a nitrogen gas adsorption method, and a particle size distribution of 10 to 1000 ?m.

Abstract: A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.

Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

Abstract: Even if the process for permitting execution of software is enabled in accordance with first license information, upon transmitting an invalidation signal from the invalidation signal transmitter 116, the execution of the process for permitting execution of software is limited in accordance with second license information. Thus, the invalidation signal can limit the execution of the process for permitting execution of software in accordance with specific license information and the execution of the licensed software without fail.

Abstract: Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E?E1)/(n?1).

Abstract: To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.

Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

Abstract: To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.

Abstract: A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.

Abstract: A reactor (magnetic component) has a core that constitutes a magnetic circuit of a magnetic flux generated by energizing a coil. The coil has a cylindrical wound part made of a lead wire wound like a cylinder, and a pair of terminals that has both ends of the wound part projected from one end in an axial direction. The pair of terminals is made of a first terminal formed by leading out an end of the lead wire from a first end portion (one end portion in an axial direction) of the wound part, and a second terminal, which penetrates inside the wound part in the axial direction, formed by leading out another end of the lead wire from a second end portion (another end portion in the axial direction) of the wound part.

Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

Abstract: In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.

Abstract: In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.

Abstract: Printed circuit board (PCB) design support apparatus and method are provided. The target element disposed on a front surface of the printed circuit board is mirror-copied, and then the straight line distance between the mirror copied element and a back element disposed on the back surface of the PCB is calculated under the condition that the thickness of the PCB is zero. The resultant creepage distance between the target element and the back element is obtained by adding the thickness of the PCB to the straight line distance. The creepage distance can be obtained accurately and quickly by a calculation on a straight line distance.

Abstract: Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E?E1)/(n?1).