Patents by Inventor Kouji Kondoh

Kouji Kondoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210153348
    Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
  • Publication number: 20190359032
    Abstract: A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Inventors: Yasuhiro SAGOU, Takuya KATAOKA, Asami OKAMOTO, Manabu MAEDA, Koji OTA, Masayuki AOYAMA, Kouji KONDOH, Motoki SHIMIZU, Yoshihiko SHIRAISHI, Yoshitarou YAZAKI, Keita SAITOU
  • Patent number: 10427498
    Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 1, 2019
    Assignee: DENSO CORPORATION
    Inventors: Yasuhiro Sagou, Hideaki Kako, Kimitake Ishikawa, Hiroyasu Oide, Hideki Seki, Kouji Kondoh, Kazuo Tada, Masaaki Inoguchi
  • Publication number: 20170318670
    Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
    Type: Application
    Filed: January 12, 2016
    Publication date: November 2, 2017
    Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
  • Patent number: 9769879
    Abstract: A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: September 19, 2017
    Assignee: DENSO CORPORATION
    Inventors: Koji Ota, Manabu Maeda, Yasuhiro Sagou, Kouji Kondoh, Gentaro Masuda, Hidetada Kajino, Yoshihiko Shiraishi
  • Publication number: 20170129310
    Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.
    Type: Application
    Filed: April 24, 2015
    Publication date: May 11, 2017
    Applicant: DENSO CORPORATION
    Inventors: Yasuhiro SAGOU, Hideaki KAKO, Kimitake ISHIKAWA, Hiroyasu OIDE, Hideki SEKI, Kouji KONDOH, Kazuo TADA, Masaaki INOGUCHI
  • Publication number: 20160059669
    Abstract: A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.
    Type: Application
    Filed: March 17, 2014
    Publication date: March 3, 2016
    Inventors: Yasuhiro SAGOU, Takuya KATAOKA, Asami OKAMOTO, Manabu MAEDA, Koji OTA, Masayuki AOYAMA, Kouji KONDOH, Motoki SHIMIZU, Yoshihiko SHIRAISHI, Yoshitarou YAZAKI, Keita SAITOU
  • Publication number: 20160066415
    Abstract: A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.
    Type: Application
    Filed: August 25, 2015
    Publication date: March 3, 2016
    Inventors: Ryohei KATAOKA, Kouji KONDOH, Jyun AKIMICHI, Kanji OTSUKA, Yutaka AKIYAMA, Kaoru HASHIMOTO
  • Publication number: 20150110477
    Abstract: A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part.
    Type: Application
    Filed: May 21, 2013
    Publication date: April 23, 2015
    Applicant: DENSO CORPORATION
    Inventors: Koji Ota, Manabu Maeda, Yasuhiro Sagou, Kouji Kondoh, Gentaro Masuda, Hidetada Kajino, Yoshihiko Shiraishi
  • Patent number: 8963017
    Abstract: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: February 24, 2015
    Assignee: DENSO CORPORATION
    Inventors: Gentaro Masuda, Kouji Kondoh, Kenji Kondoh, Hidetada Kajino
  • Publication number: 20140118984
    Abstract: In a method of producing an electronic device, a thermoplastic resin film is sandwiched between an electronic component having electrodes and a mounting member having a substrate to produce a lamination assembly. Via holes are formed in the thermoplastic resin film and filled with conductive paste. Through holes as depressed sections are formed in at least one of an area in the substrate, which faces the thermoplastic resin film, and an area in a connecting section formed on the substrate and which is not contact with the conductive paste in the via holes. The lamination assembly is heated and pressed in a lamination direction, thereof, simultaneously in order to sinter the conductive paste in the via holes. This produces an interlayer connection member in each via hole and the electronic device.
    Type: Application
    Filed: October 8, 2013
    Publication date: May 1, 2014
    Applicant: Denso Corporation
    Inventors: Kohei FUJIHARA, Kouji KONDOH, Kazuo TADA
  • Patent number: 8390106
    Abstract: A circuit board includes an insulating member and a semiconductor chip encapsulated with the thermoplastic resin portion of the insulating member. A wiring member is located in the insulating member and electrically connected to first and second electrodes on respective sides of the semiconductor chip. The wiring member includes a pad, an interlayer connection member, and a connection portion. A diffusion layer is located between the first electrode and the connection portion, between the pad and the connection portion, and between the second electrode and the interlayer connection member. At least one element of the interlayer connection member has a melting point lower than a glass-transition point of the thermoplastic resin portion. The connection portion is made of material having a melting point higher than a melting point of the thermoplastic resin portion.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: March 5, 2013
    Assignee: Denso Corporation
    Inventors: Yukihiro Maeda, Kouji Kondoh, Yoshiharu Harada, Takeshi Yamauchi, Tetsuo Fujii
  • Publication number: 20130048345
    Abstract: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.
    Type: Application
    Filed: August 27, 2012
    Publication date: February 28, 2013
    Applicant: DENSO CORPORATION
    Inventors: Gentaro MASUDA, Kouji Kondoh, Kenji Kondoh, Hidetada Kajino
  • Patent number: 8128135
    Abstract: A lock device for a vehicle includes a base plate provided with an entrance/retracting groove for receiving or retracting a striker and a latch pivotally supported on the base plate by a latch axis. The latch includes a lock groove engaging with or disengaging from the striker entering the entrance/retracting groove and rotatable between a lock release position allowing the striker entering into the entrance/retracting groove and a lock position for holding the striker in the entrance/retracting groove by the movement of the striker. A first biasing member is provided for biasing the latch in the rotational direction to the release position to bias the pawl in a rotational direction towards the release preventing position and a second biasing member is provided for biasing the rotation plate in a rotational direction towards the release position of the latch.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: March 6, 2012
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Kenji Maeta, Kouji Kondoh, Takuya Mizuno
  • Patent number: 8118342
    Abstract: A lock apparatus of a seat for a vehicle includes a striker, a first plate including a first plate groove portion, a second plate including a second plate groove portion, plural fixing portions provided at the first and second plates, a hook member being pivotable between a lock release position and a lock position and including a hook groove portion with and from which the striker is engageable and releasable, a pawl member engageable with and releasable from the hook member, a biasing member biasing the hook member and the pawl member, and plural connecting portions provided at the first and second plates for connecting the first and second plates. The connecting portions are located at an area defined between the fixing portions and one side portion of the first and second plates opposite to another side portion at which the first and second plate groove portions are formed.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: February 21, 2012
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Motohiro Kokubo, Ikuno Nakanishi, Kouji Kondoh
  • Publication number: 20110266666
    Abstract: A circuit board includes an insulating member and a semiconductor chip encapsulated with the thermoplastic resin portion of the insulating member. A wiring member is located in the insulating member and electrically connected to first and second electrodes on respective sides of the semiconductor chip. The wiring member includes a pad, an interlayer connection member, and a connection portion. A diffusion layer is located between the first electrode and the connection portion between the pad and the connection portion, and between the second electrode and the interlayer connection member. At least one element of the interlayer connection member has a melting point lower than a glass-transition point of the thermoplastic resin portion. The connection portion is made of material having a melting point higher than a melting point of the thermoplastic resin portion.
    Type: Application
    Filed: March 31, 2011
    Publication date: November 3, 2011
    Applicant: DENSO CORPORATION
    Inventors: Yukihiro Maeda, Kouji Kondoh, Yoshiharu Harada, Takeshi Yamauchi, Tetsuo Fujii
  • Patent number: 7804188
    Abstract: The termination circuit for use in a transmission line to transmit a differential signal includes a first series circuit of a resistive element and an inductive element connected between one of two signal wires of the transmission line and a reference potential, and a second series circuit of a resistive element and an inductive element connected between the other of the signal wires and the reference potential. The inductive elements of the first and second series circuits are magnetically coupled such that they generate magnetic fields having such directions as to reinforce each other when a common-mode signal flows along the transmission line, and generate magnetic fields having such directions as to weaken each other when a differential-mode signal flows along the transmission line.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: September 28, 2010
    Assignee: Denso Corporation
    Inventors: Naoto Sakai, Kouji Kondoh
  • Publication number: 20100175806
    Abstract: In order to fill conductive paste including metal particles in a via hole formed in a film having a surface made of thermoplastic resin, mirror finish is performed with respect to the surface of the film so that surface roughness of the film becomes smaller than a minimum particle diameter of the metal particles included in the conductive paste. Thus, even when the conductive paste is directly put on the surface of the film and is moved on the surface of the film by using a squeegee, most of the metal particles do not remain on the surface of the film.
    Type: Application
    Filed: December 15, 2009
    Publication date: July 15, 2010
    Applicant: DENSO CORPORATION
    Inventors: Yoshihiko Shiraishi, Yoshitarou Yazaki, Kazuo Tada, Susumu Honda, Kouji Kondoh
  • Publication number: 20090295186
    Abstract: A lock apparatus of a seat for a vehicle includes a striker, a first plate including a first plate groove portion, a second plate including a second plate groove portion, plural fixing portions provided at the first and second plates, a hook member being pivotable between a lock release position and a lock position and including a hook groove portion with and from which the striker is engageable and releasable, a pawl member engageable with and releasable from the hook member, a biasing member biasing the hook member and the pawl member, and plural connecting portions provided at the first and second plates for connecting the first and second plates. The connecting portions are located at an area defined between the fixing portions and one side portion of the first and second plates opposite to another side portion at which the first and second plate groove portions are formed.
    Type: Application
    Filed: March 30, 2009
    Publication date: December 3, 2009
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Motohiro Kokubo, Ikuno Nakanishi, Kouji Kondoh
  • Publication number: 20090145183
    Abstract: A lock device for a vehicle includes a base plate provided with an entrance/retracting groove for receiving or retracting a striker and a latch pivotally supported on the base plate by a latch axis. The latch includes a lock groove engaging with or disengaging from the striker entering the entrance/retracting groove and rotatable between a lock release position allowing the striker entering into the entrance/retracting groove and a lock position for holding the striker in the entrance/retracting groove by the movement of the striker. A first biasing member is provided for biasing the latch in the rotational direction to the release position to bias the pawl in a rotational direction towards the release preventing position and a second biasing member is provided for biasing the rotation plate in a rotational direction towards the release position of the latch.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 11, 2009
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Kenji MAETA, Kouji Kondoh, Takuya Mizuno