Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Abstract: A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate (1) with the intervention of an adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality of magnetic particles (31) having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (32); and (b) an electrically insulative layer (4), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.

Abstract: A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate (1) with the intervention of an adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality of magnetic particles (31) having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (32); and (b) an electrically insulative layer (4), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.

Abstract: A three phase fluidized bed water purifying process comprises purifying effluents in a three phase fluidized bed composed of solid particles, an effluent, and a gas in fluidized state, the solid particles being made by mixing a binder with an inorganic material based on aluminium silicate, granulating the resulting mixture, and firing the granules to sinter them. The present invention permits the purification of effluent for a long period of time without oxygen deficiency.